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Fully CMOS compatible capacitive differential pressure sensors with on-chip programmabilities and temperature compensation

Fully CMOS compatible capacitive differential pressure senso...

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IEEE SENSORS

作者： H.K. Trieu N. Kordas W. Mokwa Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

Describes the development and characterization of CMOS compatible surface micromachined capacitive differential pressure sensors with monolithic integrated electronics. Results from on-chip linearization, temperature ... 详细信息

关键词： Capacitive sensors Sensor arrays Electrodes Passivation Temperature sensors Sensor phenomena and characterization Fabrication Silicon Etching CMOS process

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A CMOS Photodiode Array with Linearized Spectral Response and Spatially Distributed Light Intensity Detection for the Use in Optical Storage systems

A CMOS Photodiode Array with Linearized Spectral Response an...

引用

European Conference on Solid-State Device Research (ESSDERC)

作者： I. Hehemann E. Ozkan A. Kemna W. Brockherde B.J. Hosticka H. Hofmann Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany Optical Disk Recording Laboratory Thomson Multimedia Inc. Schwenningen Germany

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A 1K × 1K high dynamic range CMOS image sensor with on-chip programmable region of interest readout

A 1K × 1K high dynamic range CMOS image sensor with on-chip...

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European Conference on Solid-State circuits (ESSCIRC)

作者： O. Schrey J. Huppertz G. Filimonovic A. Bussmann W. Brockherde B.J. Hosticka Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

An integrated 1024×1024 CMOS image sensor with programmable region of interest (ROI) readout and multi-exposure technique has been developed and successfully tested. Size and position of the ROI is programmed based on multiples of a minimum readout kernel of 32×32 pixels. Since the dynamic range of the irradiance normally exceeds the electrical dynamic range of the imager that can be covered using a single integration time a multi exposure technique has been implemented in the imager. Subsequent sensor images are acquired using different integration times and recomputed to form a single composite image. A newly developed algorithm performing the recomputation is presented. The chip has been realized in a 0.5µm n-well standard CMOS process. The pixel pitch is 10µm × 10µm and the total chip area is 164mm 2 .

关键词： Dynamic range CMOS image sensors Lighting Layout Reflectivity Photodiodes Circuit testing Image sensors CMOS process Smart pixels

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A CMOS photosensor array for 3D imaging using pulsed laser

A CMOS photosensor array for 3D imaging using pulsed laser

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IEEE International Conference on Solid-State circuits (ISSCC)

作者： R. Jeremias W. Brockherde G. Doemens B. Hosticka L. Listl P. Mengel Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany Siemens AG Munich Germany

ISBN: (纸本)0780366085

A 32×2 pixel optical time of flight range sensor in standard 0.5 μm CMOS acquires up to 20k BD-images/s combines CDS, S&H, multiple double short time integration, a high-speed synchronous shutter, and a phase synchronizer enabling exposures <30 ns with <5.2 W/m/sup 2/ NEP. This CMOS imager chip for 3D imaging applications contains a photodiode array and the aforementioned features enable optical TOF measurements of laser pulses reflected from a target. The 42 mm/sup 2/ chip dissipates 330 mW.

关键词： Optical arrays Optical pulses CMOS image sensors Optical sensors Optical imaging High speed optical techniques Pulse measurements Integrated optics Photodiodes Semiconductor device measurement

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The VITERBI-Algorithm for impulsive noise with unknown parameters

The VITERBI-Algorithm for impulsive noise with unknown param...

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IEEE/SP Workshop on Statistical Signal Processing (SSP)

作者： T. Kaiser Y. Dhibi Department of Wireless Chips & Systems Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

We propose a modification of the well-known Viterbi algorithm (VA) for communication channels distorted by impulsive instead of the often used Gaussian noise. Here we assume that the parameters - eg, the moments - of the noise are unknown. Instead of applying a recursive solution by repeated execution of the VA we directly embed the estimation of the unknown parameters into the structure of the VA itself. Such an approach is called per-survivor processing (PSP) which provides a general framework for the approximation of maximum likelihood sequence estimation (MLSE) whenever the presence of unknown quantities prevents the precise use of the classical VA. In addition, the classical VA is modified so that it works optimally for some kinds of impulsive noise. We show by means of the modified VA, that the bit-error rate can be substantially decreased. In other words, only with minor technical modifications by minimizing an adequate nonlinear norm, the transmission becomes more reliable compared to the usual Euclidian norm minimized by the conventional VA.

关键词： Sequences Gaussian noise Maximum likelihood estimation Communication channels Random processes Additive noise Circuit noise DH-HEMTs microelectronics circuits and systems

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Micro implantable visual prostheses

Micro implantable visual prostheses

引用

International Conference on Microtechnologies in Medicine and Biology

作者： M. Schwarz L. Ewe N. Hijazi B.J. Hosticka J. Huppertz S. Kolnsberg W. Mokwa H.K. Trieu Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

Two micro implantable visual prosthesis systems for blind patients are described. The first system is a retina implant which is based on an implantable microelectrostimulator applicable for patients suffering from retinitis pigmentosa or macula degeneration, and has been already successfully tested in animal experiments. The second system is an intraocular vision aid based on an implantable intraocular optoelectronic display encapsulated into an silicone diaphragm which is applicable for patients suffering from bilateral corneal opacification but with intact posterior ocular segment. Both systems employ wireless power and data transmission using an 13 MHz RF-link for power transmission and either ASK modulation of the RF-carrier or an near IR optical link for data transmission from an external image acquisition and telemetry unit to both implantable micro devices.

关键词： Visual prosthesis Data communication Retina Implants Pigmentation system testing Animals Displays Image segmentation Power transmission

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Nonlinear function generation using oversampled /spl Sigma//spl Delta/-modulators

Nonlinear function generation using oversampled /spl Sigma//...

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IEEE International Symposium on circuits and systems (ISCAS)

作者： O. Machul D. Hammerschmidt D. Weiler B.J. Hosticka Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

In this paper we present a technique for nonlinear function generation which uses a novel sparse look-up table approach. This novel approach can be derived from the simple look-up table concept and utilizes the interpolating properties of oversampled /spl Sigma//spl Delta/-modulators. We show that the approximation process with oversampled /spl Sigma//spl Delta/-modulators can be generally understood as a weighted sum of piecewise-continuous polynomial B-splines. The weights are digitally stored in a sparse look-up table memory which can be used for the nonlinear function mapping. The shape of the polynomial B-splines depends on the order of the loop-filter which is used in the /spl Sigma//spl Delta/-modulator topology. Derailed investigations of the approximation behaviour show that a spectrum of linear, square, and cubic piecewise-continuous interpolation can be achieved if we use up to 3rd order /spl Sigma//spl Delta/-modulators. With the increased order of modulator topology the approximation quality is also improved under the assumption that we use the same weight set for function mapping. The fact that polynomial B-splines delivers only nonzero values within a limited range of input arguments makes this approximation method much less sensitive to local errors than classical approximation methods like Lagrange or Newton interpolation.

关键词： Table lookup Interpolation Microprocessors Spline Sensor systems Polynomials Topology Approximation methods Nonlinear control systems Control systems

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Monolithic integrated surface micromachined pressure sensors with analog on-chip linearization and temperature compensation

Monolithic integrated surface micromachined pressure sensors...

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IEEE International Conference on Micro Electro Mechanical systems

作者： H.K. Trieu M. Knier O. Koster H. Kappert M. Schmidt W. Mokwa Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

This paper introduces a novel family of monolithic integrated surface micromachined pressure sensors with both linearization and temperature compensation done on-chip. All sensor parameters are fully programmable and on-chip stored using integrated EEPROM. Surface micromachined capacitive pressure sensors are pre-destinated for monolithic integrated sensor systems due to their compatibility to a standard CMOS process. This enables a cost effective production. Compared with piezoresistive pressure sensors, the surface micromachined pressure sensors are superior with respect to high overpressure stability, simple packaging, ease of monolithic integration of signal conditioning electronics, low power consumption and small chip size.

关键词： Temperature sensors Sensor systems EPROM Capacitive sensors CMOS process Costs Production Piezoresistance Stability Electronics packaging

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A programmable intraocular CMOS pressure sensor system implant

A programmable intraocular CMOS pressure sensor system impla...

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European Conference on Solid-State circuits (ESSCIRC)

作者： K. Stangel S. Kolnsberg D. Hammerschmidt B.J. Hosticka H.K. Trieu W. Mokwa Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

In this contribution we present a programmable intraocular pressure sensor system implant integrated on a single CMOS chip. It contains on-chip micromechanical pressure sensor array, a temperature sensor, readout and calibration electronics, a µC-based digital control unit, and an RF-transponder. The transponder enables wireless data transmission and wireless power reception, thus making batteryless operation feasible. The chip has been fabricated in a 1.2 µm n-well CMOS process complemented by additional processing steps.

关键词： Sensor systems Implants Sensor arrays Temperature sensors Wireless sensor networks Micromechanical devices Calibration Digital control Transponders Data communication

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LVDS I/O cells with rail-to-rail receiver input for SONET/SDH at 1.25Gb/s

LVDS I/O cells with rail-to-rail receiver input for SONET/SD...

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European Conference on Solid-State circuits (ESSCIRC)

作者： U. Vogel R. Jahne S. Ulbricht G. Bunk M. Steinert C. Zimmermann T. Iwamoto R. Kokozinski Fraunhofer Institute of Microelectronic Circuits and System Dresden Germany Toshiba Electronics Europe Dusseldorf Germany Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

Low voltage differential signaling (LVDS) has developed as a data transmission standard for on-chip, on-board/backplane or cable connections. This paper reports design criteria and measurement results of 1.25Gb/s LVDS I/O cells serving various application requirements (e.g., SONET/SDH), developed for 0.25µm and 0.18µm standard digital CMOS processes. Especially the design of a rail-to-rail input stage is described.

关键词： Rail to rail inputs SONET Synchronous digital hierarchy Standards development Low voltage Data communication Backplanes Communication cables Measurement standards CMOS process

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