This paper reviews current developments in mechatronic systems for metal cutting and formingmachinetools. The integration of mechatronic modules to the machine tool and their interaction with manufacturing processes...
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This paper reviews current developments in mechatronic systems for metal cutting and formingmachinetools. The integration of mechatronic modules to the machine tool and their interaction with manufacturing processes are presented. Sample mechatronic components for precision positioning and compensation of static, dynamic and thermal errors are presented as examples. The effect of modular integration of mechatronic system on the reconfigurability and reliability of the machinetools is discussed along with intervention strategies during machine tool operation. The performance and functionality aspects are discussed through active and passive intervention methods. A special emphasis was placed on active and passive damping of vibrations through piezo, magnetic and electro-hydraulic actuators. The modular integration of mechatronic components to the machine tool structure, electronic unit and CNC software system is presented. The paper concludes with the current research challenges required to expand the application of mechatronics in machinetools and manufacturing systems.
Today's automotive manufacturers are required to meet ever greater demands for increased flexibility due to decreasing batch sizes. Solutions to meet these demands will bring about far-reaching changes to the mass...
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Today's automotive manufacturers are required to meet ever greater demands for increased flexibility due to decreasing batch sizes. Solutions to meet these demands will bring about far-reaching changes to the mass productions methods which currently dominate automotive manufacturing. In addition to the current need for sheet metal components, such trends will also have an effect on assembly and joining techniques used. The paper describes the challenge for production engineering resulting from current and future market demands.
Mechanical Machining of carbide metals is critical, as these materials belong to the hardest substances known. Electrochemical Machining (ECM) is presented as an alternative to conventional processing. This technique ...
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ISBN:
(纸本)0955308224
Mechanical Machining of carbide metals is critical, as these materials belong to the hardest substances known. Electrochemical Machining (ECM) is presented as an alternative to conventional processing. This technique dissolves conductive materials by anodic dissolution in neutral solutions at extremely high current densities of about 100 A/cm. This is independent from the hardness of the work piece and should therefore be favourable to structuring carbide metals. For the reason of carbide metal alloys being composites of extremely hard particles embedded in a softer matrix, ECM of these materials is complex due to the nonhomogenous structure as the components dissolve and passivate differently. The paper starts with results of modifying conventional micro tools made of tungsten carbide. In the second part the potential of working with a free electrolyte jet (EJM) is investigated.
The use of joinable formed sheet parts made of high-strength and high-tensile materials requires specifically adapted catting technologies to guarantee the requirements for dimensional *** cutting technology used,toge...
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The use of joinable formed sheet parts made of high-strength and high-tensile materials requires specifically adapted catting technologies to guarantee the requirements for dimensional *** cutting technology used,together with the tool and the machine,determine the parameters of the final part,depending on the geometry to be cut and the semi-finished products selected,although the interaction of the workpiece/tribology 、tool system is *** is therefore necessary to modify the tool design for cutting tools in shearing and precision cutting processes and to select appropriate tool materials of steel and ceramics whilst ensuring that the coatings used are sufficiently durable.
Due to the need for a significant reduction in the weight of parts in automotive manufacturing, the use of lightweight materials such as magnesium and aluminium is becoming increasingly important. Unfortunately, these...
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Glass is a commonly used material in the MEMS technology. Applications range from usage in the optical data transmission, MOEMS, applications in the micro-fluid analysis and bioengineering, packaging for housing and a...
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ISBN:
(纸本)0955308208
Glass is a commonly used material in the MEMS technology. Applications range from usage in the optical data transmission, MOEMS, applications in the micro-fluid analysis and bioengineering, packaging for housing and as insulating substrate for bonding. Functional structures are mostly applied in array arrangements on the glass wafer following other wafer level processes of the micro system technology. Among the numerous possibilities to structure glass at the surface, high temperature micro forming is one of the economically most favourable processes [1] [2], in particular for the manufacturing of higher quantities with high surface quality. With this technology it is possible to mould functional structures directly into bondable borosilicate glass. Former research results from within this research group on structuring of fluoride glasses [3] had shown the possibility of micro-structuring the material glass by moulding. After improving the equipment technology with respect to achievable forming temperatures up to 800°C, isothermal tempering and accurate controlling of the load transmission, the possibility to microstructure glass wafers of Pyrex®7740 and other borosilicate glasses is proven within a suitable process window.
This article describes the successful implementation of a modular system concept for ultra precision assembly tasks by means of the accurate alignment of light emitting and receiving modules in front of buried wavegui...
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ISBN:
(纸本)0955308208
This article describes the successful implementation of a modular system concept for ultra precision assembly tasks by means of the accurate alignment of light emitting and receiving modules in front of buried waveguides in optical circuit boards. The constitutive result of a Saxon research project FGM [1] is a modular designed assembling system, that enables vertical fine positioning and gripper integrated angle adjustment in opposition to conventional Surface Mount technology. Today these sensitive components are mounted and adjusted predominantly manually under special laboratory conditions. The technical challenge is to develop new methods and assembling components for high-precision and reproducible packaging in an automated assembling process. This is an important step to reduce the fabrication costs drastically and to smooth the way from a pure laboratory method to an industrial solution concept.
For the assembly of an inclination sensor, which uses a sensor principle based on micro electrical mechanical system (MEMS) elements, an active assembly strategy was developed. Its aim is the precise orientation of th...
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For the assembly of an inclination sensor, which uses a sensor principle based on micro electrical mechanical system (MEMS) elements, an active assembly strategy was developed. Its aim is the precise orientation of the MEMS relatively to gravity direction, so that no further calibration of the sensor has to be done. Main features are the continuous control of angle signal from the incomplete sensor and a new gripper with tilt function and force limiting kinematics. The assembly strategy as well as the gripper design are described in this paper.
This paper describes a systematic study of influences that have to be overcome for the application of interferometry in the high temperature range. A specially designed test facility including an optical arrangement i...
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