With modern multipoint drawing equipment, it is possible to control the draw pins independently of each other. This gives the possibility to specifically change the normal force distribution between blankholder and wo...
The fabrication of microcomponents or microstructured surfaces with conventional manufacturing methods--such as turning, milling or drilling-imposes high demands on the machine behavior. The high requirements in terms...
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The fabrication of microcomponents or microstructured surfaces with conventional manufacturing methods--such as turning, milling or drilling-imposes high demands on the machine behavior. The high requirements in terms of machine characteristics are currently met by only few ultraprecision machinetools. A broad range of materials such as, for example, non-ferrous metals or plastics can be machined, producing real three-dimensional structures with an optical surface quality.
Digital speckle pattern interferometry is used to investigate the vibration behaviour of silicon micromembranes. Mode shapes have been mapped up to the 20th natural frequency for squared membranes with millimeter and ...
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This paper describes a non-destructive optical technique, digital speckle pattern interferometry (DSPI), that has been developed particularly for strain analysis and has proved well suited for thermal deformation meas...
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This paper describes a non-destructive optical technique, digital speckle pattern interferometry (DSPI), that has been developed particularly for strain analysis and has proved well suited for thermal deformation measurement. Fibre-reinforced composites with both metal and polymer matrices have been analysed by DSPI to determine their thermal expansion behaviour as a function of direction and temperature. Complete series of measurements can be performed quickly and without any restriction on the specimen shape. Engineering components including composite structures have been the subject of investigation. Besides quantitative results, real-time observation provides basic information for materials understanding.
This paper introduces two learning approaches used in different phases of a diagnostic system’s life cycle. First, an initial knowledge-base is built using an explanation-based learning approach which generates diagn...
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The globalisation of markets and the expansion of product responsibility into the entire product life cycle lead to an increasing competitive situation for nationally and internationally operating companies. Therefore...
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ISBN:
(数字)9781461563815
ISBN:
(纸本)9780412827204;9781461379317
The globalisation of markets and the expansion of product responsibility into the entire product life cycle lead to an increasing competitive situation for nationally and internationally operating companies. Therefore, to win this competition the use of the most effective and efficient resources regarding the whole product life cycle is necessary. Since these resources are globally distributed the different tasks both within a phase of product life cycle and those spread over different phases are distributed as well. The global interference of these tasks requires a close multilateral co-operation of the companies concerned. Current information- and communication technologies and modern management concepts offer high potentials to meet these requirements. The international seminar of CIRP on Life Cycle Engineering titled "Life Cycle Networks" was a forum for the presentation and discussion of current research work and recent advancements on these strategic issues for current and future engineering. Complex requirements and innovative solutions to support and realise Life Cycle Networks has been revealed and summerised. The employment of information technology to support both specific phases of product life cycle and holistic approaches will be the main focus. This volume contains the papers presented at the seminar which provide opportunities to identify the state-of-the-art and address future needs. The parts in this volume correspond to the sessions of the seminar and are presented under the following headings: Life Cycle Management; Life Cycle Design; Design for Environment; Design for Recycling; Life Cycle Assessment; Disassembly; IT-Networks.
This open access book presents a good overview of the current research landscape of assembly, handling and industrial robotics.The objective of MHI Colloquium is the successful networking at both academic and manageme...
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ISBN:
(数字)9783031740107
ISBN:
(纸本)9783031740091
This open access book presents a good overview of the current research landscape of assembly, handling and industrial robotics.
The objective of MHI Colloquium is the successful networking at both academic and management levels. Thereby, the colloquium focuses an academic exchange at a high level in order to distribute the obtained research results, to determine synergy effects and trends, to connect the actors in person and in conclusion, to strengthen the research field as well as the MHI community. In addition, there is the possibility to become acquainted with the organizing institute. Primary audience is formed by members of the scientific society for assembly, handling and industrial robotics (WGMHI).
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