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Metrology for Automotive (MetroAutomotive), IEEE International Workshop on

作者： Felix Essingholt Linda Cousin Gerd vom Bögel Thorben Grenter Anton Grabmaier Wireless Sensors & Systems Fraunhofer Institute for Microelectronic Circuits and Systems IMS Duisburg Germany Smart System Design Fraunhofer Institute for Microelectronic Circuits and Systems IMS Duisburg Germany Business Unit Industry Fraunhofer Institute for Microelectronic Circuits and Systems IMS Duisburg Germany Department of Electronic Components and Circuits University of Duisburg-Essen Duisburg Germany

ISBN: (数字)9798350384987

ISBN: (纸本)9798350384994

Continuing the conceptual work published in [1] from the Energy ECS [2] subproject for the monitoring of electrical distribution grids, an initial design for a retrofittable autonomous current sensor system for the low-voltage distribution network is presented in this paper. The sensor system is capable of measuring the currents and their phase in all conductors of a 3-phase energy grid of cables going into or out of distribution cabinets and is intended for monitoring loads and detecting overloads due to extensive charging of electrical vehicles (EV). Additionally, electrodes for monitoring the voltage have been designed to provide a rudimentary voltage measurement for the phase calculation of the current. The System has been developed to be self-sufficient with inductive energy harvesting, providing a maintenance free solution. For this, an overcurrent and over voltage protection for the electronics was implemented, according to the requirements discovered in our previous works. In this paper, the concepts and designs for the autonomous current sensor are described and first results of its performance in the laboratory are shown.

关键词： Low voltage Load monitoring Phase measurement Energy measurement Metrology Sensor systems Smart grids

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Contactless camera-based AHI score estimation in SAS patients

Contactless camera-based AHI score estimation in SAS patient...

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作者： Alic, Belmin Zauber, Tim Viga, Reinhard Seidl, Karsten Wiede, Christian Seidl, Karsten Department of Electronic Components and Circuits University of Duisburg-Essen Bismarckstr. 81 Duisburg Germany Department of Electronic Components and Circuits University of Duisburg-Essen Duisburg Germany Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg Germany

Sleep apnea syndrome (SAS) is a common sleeprelated breathing disorder characterized by recurring cessations of airflow during sleep. The gold standard for diagnosing SAS is polysomnography (PSG) which requires the patient to spend one or several nights in a sleep clinic. A PSG involves a significant amount of contact-based sensors, which leads to discomfort and deviations in sleep behavior. In this work, a contactless, multispectral camera-based approach for the autonomous detection of events of nocturnal airflow reduction is presented. The detected events are further employed in estimators of sleep diagnostic metrics, such as the apnea-hypopnea index (AHI) and the SAS stage. The AHI estimation resulted in a Pearson correlation coefficient of r = 0.9993. The SAS stage estimator correctly predicted the SAS stage for all three recruited patients. © 2023 the author(s), published by Walter de Gruyter Berlin/Boston.

关键词： Data fusion

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Sensor systems for Extremely Harsh Environments

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Journal of microelectronics and Electronic Packaging 2022年第4期19卷 101-114页

作者： Kappert, Holger Schopferer, Sebastian Saeidi, Nooshin Döring, Ralf Ziesche, Steffen Olowinsky, Alexander Naumann, Falk Jägle, Martin Spanier, Malte Grabmaier, Anton Fraunhofer Institute for Microelectronic Circuits and Systems IMS Finkenstr Duisburg Germany Fraunhofer Institute for High-Speed Dynamics Ernst-Mach-Institut EMI Efringen-Kirchen Germany Fraunhofer Institute for Electronic Nano Systems ENAS Dresden Germany Fraunhofer Institute for Ceramic Technologies and Systems IKTS Dresden Germany Fraunhofer Institute for Laser Technology ILT Aachen Germany Fraunhofer Institute for Microstructure of Materials and Systems IMWS Halle Germany Fraunhofer Institute for Physical Measurement Techniques IPM Freiburg Germany Fraunhofer Institute for Reliability and Microintegration IZM Berlin Germany Department of Electronic Components and Circuits University Duisburg-Essen Duisburg Germany

Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight fraunhofer institutes have bundled their competencies and have run the fraunhofer Lighthouse Project "eHarsh" to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform. © 2022 International microelectronics Assembly and Packaging Society.

关键词： Energy efficiency

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An Alternate Approach to Backside Thinning: A Doping Selective Silicon Wet Etch 241

An Alternate Approach to Backside Thinning: A Doping Selecti...

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241st ECST Meeting

作者： Bahena, Joel Fijal, Jonathan Tyler, Phillip Taddei, John Wiemann, Matthias Figge, Martin Veeco Instruments Precision Surface Processing Horsham19044 United States Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg47057 Germany

ISBN: (纸本)9781607685395

Backside illuminated technologies have been used in complementary metal-oxide-semiconductor image sensors for years and are finding a renewed interest and are being investigated for imagers and detectors in light detection and ranging applications. Coupled with the improved performance facilitated through 3D integration, the thinning of bonded wafers has become a crucial processing step. In this study, an alternate and potentially more cost-effective method has been explored using an HNA (hydrofluoric, nitric, acetic)wet etch for backside thinning of bonded epitaxial P+/P- silicon wafers. By utilizing a dopant concentration gradient, P+ silicon is selectively etched and P- silicon can be effectively used as an etch stop. Several HNA concentrations were explored to determine ratios that yield high P+ silicon etch rates while maintaining high P+/P- selectivity. Furthermore, bath life, spiking scheme, and repeatability were examined using a large wafer sample size with the goal of developing a full process flow. © 2022 ECS - The Electrochemical Society.

关键词： Silicon wafers

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Generalized comparison of the accessible emission limits of flash- And scanning LiDAR-systems 16

Generalized comparison of the accessible emission limits of ...

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2021 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2021 and 16th Conference on PhD Research in microelectronics and Electronics, PRIME 2021

作者： Burkard, Roman Viga, Reinhard Ruskowski, Jennifer Grabmaier, Anton Department of Electronic Components and Circuits University of Duisburg-Essen Duisburg Germany Department of CMOS Image Sensors Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg Germany Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg Germany

ISBN: (纸本)9783800755899

In the field of autonomous driving and human-robot collaboration applications the demand for three-dimensional imaging systems, that are reliable, small and low-cost, is rising. A promising technology to satisfy these demands are scanning- or flash-based light detection and ranging (LiDAR)-systems, which differ mainly in the illumination of the field-of-view. A scanning LiDAR-system illuminates the field-of-view sequentially by deflecting a laser beam. In a flash LiDAR-system the laser beam is extended to illuminate the whole field-of-view with every emitted laser pulse. Both illumination principles are extensively treated in the recent literature separately and without the inclusion of the limits defined by the laser safety standard IEC 60825-1:2014. In this work a generalized model is derived from the standard. This model is able to determine the emission limits of the standard for both LiDAR-systems at the same time and it is used to compare the maximum output power and the intensities in the field-of-view for both LiDAR-systems. © VDE VERLAG GMBH.

关键词： Scanning

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Sensor systems for Extremely Harsh Environments

Sensor Systems for Extremely Harsh Environments

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作者： Kappert, Holger Schopferer, Sebastian Saeidi, Nooshin Döring, Ralf Ziesche, Steffen Olowinsky, Alexander Naumann, Falk Jägle, Martin Spanier, Malte Grabmaier, Anton Fraunhofer Institute for High-Speed Dynamics Ernst-Mach-Institut EMI Efringen-Kirchen Germany Fraunhofer Institute for Electronic Nano Systems ENAS Dresden Germany Fraunhofer Institute for Ceramic Technologies and Systems IKTS Dresden Germany Fraunhofer Institute for Laser Technology ILT Aachen Germany Fraunhofer Institute for Microstructure of Materials and Systems IMWS Halle Germany Fraunhofer Institute for Physical Measurement Techniques IPM Freiburg Germany Fraunhofer Institute for Reliability and Microintegration IZM Berlin Germany Department of Electronic Components and Circuits University Duisburg-Essen Duisburg Germany Fraunhofer Institute for Microelectronic Circuits and Systems IMS Finkenstr. 61 Duisburg47057 Germany

Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean and energy efficient operation or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight fraunhofer institutes have bundled their competencies and have run the fraunhofer Lighthouse Project ‘eHarsh’ to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are not only pure sensor elements, rather containing one or multiple sensor elements and integrated readout electronics. Various technologies which are necessary for the realization of such sensor systems have been identified, developed and finally bundled in a technology platform. These technologies are e. g. MEMS and ceramic based sensors, SOI-CMOS based integrated electronics, board assembly and laser based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization and reliability simulations. Based on the platform a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform. © 2022 IMAPS-International microelectronics and Packaging Society. All rights reserved.

关键词： Integrated circuits

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Terahertz Remote Respiration Rate Monitoring

Terahertz Remote Respiration Rate Monitoring

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International Workshop on Mobile Terahertz systems (IWMTS)

作者： Svenja Nicola Kobel Yamen Zantah Andreas Prokscha Christian Wiede Gerd vom Bögel Thomas Kaiser Karsten Seidl Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) Duisburg Germany Institute of Digital Signal Processing University of Duisburg-Essen Duisburg Germany Department of Electrical Components and Circuits University of Duisburg-Essen Duisburg Germany

ISBN: (数字)9798350365832

ISBN: (纸本)9798350365849

Terahertz technology positions itself as a promising alternative to conventional vital signs measurement methods due to its unique characteristics, making it particularly suitable for non-contact measurements in free space. In this work, the influence of different frequency bands and clothing on the accuracy of respiration rate measurements is analyzed, using a motion-based method that utilizes amplitude information. The highest accuracy is obtained in the lowest studied frequency band of 220 GHz − 330 GHz, with a mean absolute error of 0.34 rpm. Notably, clothing does not impede the measurements. The results demonstrate the capability of terahertz technology to effectively detect and monitor respiration rate.

关键词： Accuracy Clothing Terahertz materials Medical services Position measurement Extraterrestrial measurements Thorax Frequency measurement Monitoring Terahertz communications

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6GEM Perspective on Joint Communication and Sensing 26

6GEM Perspective on Joint Communication and Sensing

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26th International ITG Workshop on Smart Antennas, WSA 2023 and 13th Conference on systems, Communications, and Coding, SCC 2023

作者： vom Bögel, Gerd Vossiek, Martin Wietfeld, Christian Haferkamp, Markus Häger, Simon Sezgin, Aydin Weimer, Michael Thill, Ruben Sivadevuni, Srivardhan Sarma Böcker, Stefan Pohl, Nils Wessel, Jan Braun, Tobias T. Kögel, Tobias Geiß, Johanna Wireless Systems Fraunhofer Institute for Microelectronic Circuits and Systems IMS Duisburg Germany Digital Communication Systems Ruhr-University Bochum Bochum Germany Integrated Systems Ruhr-University Bochum Bochum Germany Hochfrequenztechnik Friedrich-Alexander-Universität Erlangen Germany High Frequency Radar Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR Wachtberg Germany ICs and Sensor Systems Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR Wachtberg Germany Kommunikationsnetze TU Dortmund University Dortmund Germany

ISBN: (纸本)9783800760510

Joint Communications and Sensing (JCS) requires innovative new technologies and solutions in both the HW and SW domains. The key factors for JCS are very high frequencies (GHz/THz) with large bandwidths, the agility of the 6G infrastructure spectrum, and the ability to process radio signals for multiple purposes. The Innovation potential in this area is huge, but technological challenges to be solved are also demanding. In the component and hardware area, frequencyagile RF components are subject of the development to support very high bandwidths with the lowest possible nonlinearity and power consumption. The common hardware and algorithmic challenge is to ensure coherent processing of signals, sensor fusion and in particular common waveform design, novel baseband solutions, JCS supporting packet structures and efficient edge-based processing. This article provides an overview of JCS from the perspective of the 6GEM project. © VDE VERLAG GMBH · Berlin · Offenbach.

关键词： Bandwidth

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First steps towards a chipless, passive THz-based epidermal electronics concept

First steps towards a chipless, passive THz-based epidermal ...

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2025 International Conference on Mobile and Miniaturized Terahertz systems, ICMMTS 2025

作者： Schaberg, L.L. Kubiczek, T. Kolluru, N. Santhakumaran, S. Burkard, R. Mertin, W. Muckel, F. Bacher, G. Schall-Giesecke, A.L. Neumaier, D. Kirchner, E. Balzer, J.C. Benson, N. Institute of Technology for Nanostructures Germany Communication Systems Germany The Bergische Universität Chair of Smart Sensor Systems Wuppertal Germany Institute of Medical Technology Systems Germany "Werkstoffe der Elektrotechnik"Institute Germany University of Duisburg-Essen The Faculty of Engineering Duisburg Germany Institute "Elektronische Bauelemente und Schaltungen" Germany Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg Germany German Research Centre for Artificial Intelligence Robotics Innovation Center Bremen Germany

ISBN: (纸本)9798350365832

This contribution rethinks epidermal electronic concepts by introducing a passive, chipless and wireless approach for skin-based health information detection. The idea is based on the sensitivity of the graphene electrochemical potential to chemical or electrical potential changes at the interface of the thin film and the impact of this on the graphene reflection properties in the THz range. This feature has the potential to enable contactless information readout for future applications, while at the same time significantly simplifying epidermal electronics patches and thus mitigating current technology limitations. In this contribution a proof of principle experiment based on a dual gate electrochemical graphene transistor structure is discussed, to demonstrate the tuneability of the graphene electrochemical potential as a prerequisite for our concept. THz time domain spectroscopy is then used to demonstrate he impact of this electrochemical potential variation on the graphene reflection properties between 100GHz and 1.5THz, proving the feasibility of our concept. © 2025 IEEE.

关键词： Graphene transistors

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Self-Assembling Flexible 3D-MEAs for Cortical Implants

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Current Directions in Biomedical Engineering 2021年第2期7卷 359-362页

作者： Hegel, Lena Kauth, Andrea Seidl, Karsten Ingebrandt, Sven RWTH Aachen University Aachen Germany RWTH Aachen University Aachen Germany Fraunhofer Institute for Microelectronic Circuits and Systems Duisburg Germany Department of Electronic Components and Circuits and Center for Nanointegration Duisburg- Essen University of Duisburg-Essen Duisburg Germany

Flexible Multi Electrode Arrays (MEAs) for neural interfacing reduce the mechanical mismatch between the soft brain tissue and the electrode arrays allowing accurate signal recordings and neural stimulation while reducing inflammatory responses. Many standard manufacturing processes of MEAs are designed for planar structures and the production of three-dimensional structures is challenging. In the present study, shaft structures with one to two circular gold microelectrodes (10 - 20 μm), each on a base polyimide (PI) substrate, were investigated. We describe a fabrication method, with which shafts made from bi-layer PI flip into the third dimension, which is a first step towards spontaneous assembly of electrodes in flexible 3D MEAs for neuroelectronic applications. A lift-up of the shafts was achieved by the contraction of a second PI layer and a steady nitrogen flow during polycondensation. This shrinking PI was structured in pits with a width of 5 - 600 μm. We achieved liftup angles of up to 42 degrees. The shaft structures can be hardened and later be used for neural implantation experiments. © 2021 by Walter de Gruyter Berlin/Boston.

关键词： Polyimides

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