This study proposed a high-quality fiber ring laser combining four-subring resonators and a saturable absorber within a ring cavity. An un-pumped erbium-doped fiber is introduced as the saturable absorber (SA) within ...
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After the COVID-19 pandemic, broadband internet utilization is predicted to continue to grow and experience a significant increase. The pandemic has changed how people work, study, communicate, shop, and carry out man...
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The advent of the Segment Anything Model (SAM) marks a significant milestone in deep learning semantic segmentation tasks. In this study, an incremental learning model based on pseudo labels is proposed. The model gen...
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Post-pandemic and globalization have accelerated the implementation of Industry 4.0, aided by rapid technological and information advancements. Industry 4.0 has significant consequences for all institutions in develop...
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Exact solutions of the Routing, Modulation, and Spectrum Allocation (RMSA) problem in Elastic Optical Networks (EONs), so that the number of admitted demands is maximized while those of regenerators and frequency slot...
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The use of high-penetration solar photovoltaics (PV) to transmission networks is complicated by voltage rise. Infractions of voltage occur when voltage levels surpass the permitted limits. Several solutions have been ...
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In general, public or private organizations or companies have used information-based technology as a support to improve business performance to be more effective and efficient in order to achieve a company's busin...
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Floods are the most frequent disaster events in Lhoksukon, resulting in significant losses and community and environmental damage. Floods are generated by several factors, consisting of hydrometeorological, topographi...
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Online transactions are significant in the pandemic era. Using online transactions can minimize the risk of physical contact with disease transmission between buyers and sellers. However, with so many choices of items...
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3D-LSI techniques are proven to be effective in improving performance without miniaturization of transistors. However, 3D-LSI have problems in heat dissipation, especially in 3D-LSI without TSV. An example is the stac...
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