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检索条件"机构=Institute of Circuits and System"
369 条 记 录,以下是1-10 订阅
排序:
Low-Complexity and Multiplier-Free Baud-Rate Timing Phase Error Detector for High-Speed Optical IM/DD systems  16
Low-Complexity and Multiplier-Free Baud-Rate Timing Phase Er...
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16th Pacific Rim Conference on Lasers and Electro-Optics, CLEO-PR 2024
作者: Tang, Jianwei Yang, Bang Wei, Jinlong Cheng, Chen Hao, Yaguang Wu, Qi Wang, Jianyu Liang, Junpeng Xu, Zhaopeng Sun, Zhongliang Yang, Yanfu Hu, Weisheng Peng Cheng Laboratory Department of Circuits and System Shenzhen518000 China School of Integrated Circuits Harbin Institute of Technology Shenzhen518000 China
A novel low-complexity and multiplication-free baud-rate timing phase error detector for high-speed IM/DD optics is proposed. Its superior performance is validated by experimental demonstration of 50 Gbaud PAM4 and PA... 详细信息
来源: 评论
In-memory computing based on phase change memory for high energy efficiency
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Science China(Information Sciences) 2023年 第10期66卷 20-41页
作者: Luchang HE Xi LI Chenchen XIE Zhitang SONG National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Micro-System and Information Technology Chinese Academy of Sciences School of Microelectronics University of Science and Technology of China
The energy efficiency issue caused by the memory wall in traditional von Neumann architecture is difficult to reconcile. In-memory computing(CIM) based on emerging nonvolatile memory(NVM) is a promising solution to av... 详细信息
来源: 评论
Design memristor-based computing-in-memory for AI accelerators considering the interplay between devices, circuits, and system
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Science China(Information Sciences) 2023年 第8期66卷 243-253页
作者: Junjie AN Linfang WANG Wang YE Weizeng LI Hanghang GAO Zhi LI Zhidao ZHOU Jinghui TIAN Jianfeng GAO Chunmeng DOU Qi LIU School of Microelectronics University of Science and Technology of China State key Lab of Fabrication Technologies for Integrated Circuits Institute of MicroelectronicsChinese Academy of Sciences School of Microelectronics University of Chinese Academy of Sciences Frontier Institute of Chip and System State Key Laboratory of ASIC and System Fudan University
Recent advances in developing beyond von Neumann architectures have moved the memristive devices to the forefront as one of the key enablers to realizing memristive computing-in-memory(m CIM)structures, which shows a ... 详细信息
来源: 评论
A Novel Coprime Nested Array with Enhanced DOFs and Reduced Mutual Coupling for DOA Estimation of Noncircular Sources
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IEEE Transactions on Vehicular Technology 2025年 1-13页
作者: Peng, Zhe Gong, Qishu Xie, Huikai School of Integrated Circuits and Electronics Beijing100081 China BIT Chongqing Institute of Microelectronics and Microsystems Chongqing401332 China Beijing Institute of Control and Electronics Technology Key Laboratory of Information System and Technology Beijing100038 China
Recently, many sparse array configurations have been designed for direction of arrival (DOA) estimation of noncircular sources due to their capability of constructing high-performance difference-sum coarray. Nested ar... 详细信息
来源: 评论
Study on the aerodynamic characteristics of reentry capsule with obtuse head inverted cone under hypersonic chemical nonequilibrium flow
Study on the aerodynamic characteristics of reentry capsule ...
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2024 International Conference on Aerospace and Mechanics, ICAM 2024
作者: Sun, Bin Chen, Weiyue Huang, Cai Long, Yin Diao, Weihe Zhang, Huiwen Beijing Institute of Spacecraft System Engineering Beijing100094 China School of Integrated Circuits and Electronics Beijing Institute Technology University Beijing100081 China
During spacecraft reentry, the aerodynamic characteristics of the reentry capsule with a sizeable obtuse head inverted cone (OBHIC) in a hypersonic state are the key factors in the design of controlled reentry traject... 详细信息
来源: 评论
A 67F2 Reconfigurable PUF Using 1T2R RRAM Switching Competition in 28nm CMOS with 5e-9 Bit Error Rate
A 67F2 Reconfigurable PUF Using 1T2R RRAM Switching Competit...
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2024 IEEE Symposium on VLSI Technology and circuits, VLSI Technology and circuits 2024
作者: Cao, Yue Yang, Honghu Yang, Jianguo Liu, Qi Liu, Ming Frontier Institute of Chip and System Fudan University Shanghai China Zhangjiang Laboratory Shanghai China State Key Laboratory of Fabrication Technologies for Integrated Circuits Institute of Microelectronics Chinese Academy of Sciences Beijing China
Aiming at low-cost, high-reliability hardware security in IoT applications, we demonstrated a 1Mb 1T2R RRAM Reconfigurable PUF design. A 1T2R PUF cell with a smaller size utilizes the switch time variation in the RRAM...
来源: 评论
Reliable ferroelectricity down to cryogenic temperature in wakeup free Hf_(0.5)Zr_(0.5)O_(2)thin films by thermal atomic layer deposition
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Journal of Semiconductors 2024年 第3期45卷 33-37页
作者: Shuyu Wu Rongrong Cao Hao Jiang Yu Li Xumeng Zhang Yang Yang Yan Wang Yingfen Wei Qi Liu State Key Laboratory of Fabrication Technologies for Integrated Circuits Institute of MicroelectronicsChinese Academy of SciencesBeijing 100029China Frontier institute of Chip and System Fudan UniversityShanghai 200433China College of Electronic Science and Technology National University of Defense TechnologyChangsha 410073China University of Chinese Academy of Sciences Beijing 100049China
The performance and reliability of ferroelectric thin films at temperatures around a few Kelvin are critical for their application in *** this work,TiN/Hf_(0.5)Zr_(0.5)O_(2)/TiN capacitors that are free from the wake-... 详细信息
来源: 评论
Signal Integrity Simulation and Analysis for 2.5D Advanced Package Interconnect Based on Universal Chiplet Interconnect Express (UCIe)  26
Signal Integrity Simulation and Analysis for 2.5D Advanced P...
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26th Electronics Packaging Technology Conference, EPTC 2024
作者: Fan, Yuxuan Gan, Hanchen Zhou, Yunyan Lei, Bo Song, Gang Wang, Qidong System Packaging and Integration Research Center Institute of Microelectronics of Chinese Academy of Sciences Beijing100029 China School of Integrated Circuits University of Chinese Academy of Sciences Beijing100049 China
This paper presents the design and signal integrity (SI) simulation of 2.5D advanced packaging interconnects based on the Universal Chiplet Interconnect Express (UCIe) protocol. The study compares multiple interconnec... 详细信息
来源: 评论
Optimized Valley Skipping Strategy to Improve Efficiency and Reduce THD for DCM Boost PFC Converter  4
Optimized Valley Skipping Strategy to Improve Efficiency and...
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4th International Conference on Power Engineering, ICPE 2023
作者: Wang, Wanyang Zhu, Living Zhang, Weniia Huang, Baoqiang Min, Run Tong, Qiaoling Zhang, Shuo Wang, Yinyu School of Integrated Circuits Huazhong University of Science and Technology Wuhan China Beijing Institute of Spacecraft System Engineering China Academy of Space Technology Beijing China
This article proposes an optimized valley skipping strategy to improve efficiency and reduce total harmonic distortion (THD) for boost power factor correction (PFC) converters in discontinuous conduction mode (DCM). I... 详细信息
来源: 评论
Low-Complexity and Multiplier-Free Baud-Rate Timing Phase Error Detector for High-Speed Optical IM/DD systems
Low-Complexity and Multiplier-Free Baud-Rate Timing Phase Er...
收藏 引用
Pacific Rim Conference on Lasers and Electro-Optics (CLEO/Pacific Rim)
作者: Jianwei Tang Bang Yang Jinlong Wei Chen Cheng Yaguang Hao Qi Wu Jianyu Wang Junpeng Liang Zhaopeng Xu Zhongliang Sun Yanfu Yang Weisheng Hu Department of Circuits and System Peng Cheng Laboratory Shenzhen China School of Integrated Circuits Harbin Institute of Technology Shenzhen China
A novel low-complexity and multiplication-free baud-rate timing phase error detector for high-speed IM/DD optics is proposed. Its superior performance is validated by experimental demonstration of 50 Gbaud PAM4 and PA... 详细信息
来源: 评论