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检索条件"机构=Institute of Microelectronics and Key Laboratory of Microelectronic Devices and Circuits"
610 条 记 录,以下是391-400 订阅
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100-nm T-gate InAlAs/InGaAs InP-based HEMTs with f_T = 249 GHz and f_(max) = 415 GHz
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Chinese Physics B 2014年 第3期23卷 613-618页
作者: 汪丽丹 丁芃 苏永波 陈娇 张毕禅 金智 Microware Devices and Integrated Circuits Department Key Laboratory of Microelectronics Device and Integrated TechnologyInstitute of Microelectronics Chinese Academy of Sciences
InA1As/InGaAs high electron mobility transistors (HEMTs) on an InP substrate with well-balanced cutoff frequency fT and maximum oscillation frequency frnax are reported. An InA1As/InGaAs HEMT with 100-nm gate length... 详细信息
来源: 评论
High temperature behavior of multi-region direct current current-voltage spectroscopy and relationship with shallow-trench-isolation-based high-voltage laterally diffused metal-oxide-semiconductor field-effect-transistors reliability
High temperature behavior of multi-region direct current cur...
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作者: He, Yandong Zhang, Ganggang Zhang, Xing Institute of Microelectronics and Key Laboratory of Microelectronic Devices and Circuits Peking University Beijing 100871 China
With the process compatibility with the mainstream standard complementary metal-oxide-semiconductor (CMOS), shallow trench isolation (STI) based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become... 详细信息
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Formation energy study of oxygen vacancies in undoped, aluminum-doped and nitrogen-doped TaOx-based RRAM by first principle simulation
Formation energy study of oxygen vacancies in undoped, alumi...
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作者: Deng, Haopei Cai, Yimao Yu, Muxi Huang, Ru Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
Formation and transfer of oxygen vacancies are essential to transitional metal oxide RRAM's switching behavior. In this paper, first principle is used to simulate the formation energy of oxygen vacancies in undope... 详细信息
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Investigation of passivation of Ge substrate by N2O plasma and N2 plasma treatment
Investigation of passivation of Ge substrate by N2O plasma a...
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作者: Lin, M. Li, M. An, X. Yun, Q. Li, M. Li, Z. Liu, P. Zhang, B. Zhang, X. Huang, R. Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
In this paper, passivation of Ge substrates by N2O plasma is proposed and compared with a N2 plasma treatment. Results show that both N2O and N2 plasma treatments can improve the quality of the interface between the h... 详细信息
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Simulation analysis of nanopore performance in single-nanoparticle detection
Simulation analysis of nanopore performance in single-nanopa...
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IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
作者: Yu Zhang Guiya Liu MinQuan Li Jun Luo Chengjun Huang Ministry of Education Anhui University Hefei China Key Laboratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics of Chinese Academy of Sciences Beijing China
Single-nanoparticle detection with cylindrical and pyramidal-shaped nanopores was systematically studied using FEM (Finite Element Modeling) method simulations and terminal currents were obtained. The effects of pore ... 详细信息
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AlO_x prepared by atomic layer deposition for high efficiency-type crystalline silicon solar cell
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Chinese Physics B 2014年 第2期23卷 448-451页
作者: 仇洪波 李惠琪 刘邦武 张祥 沈泽南 School of Materials Science and Engineering Shandong University of Science and Technology Key Laboratory of Microelectronic Devices and Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences
The influence of atomic layer deposition parameters on the negative charge density in AlOx film is investigated by the corona-charge measurement. Results show that the charge density can reach up to -1.56×10^12 c... 详细信息
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Optimization of ohmic contact for InP-based transferred electronic devices
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Journal of Semiconductors 2014年 第3期35卷 158-162页
作者: 武德起 丁武昌 杨姗姗 贾锐 金智 刘新宇 Key Laboratory of Microelectronics Devices & Integrated Technology Microwave Devices and Integrated Circuits Department Institute of Microelectronics Chinese Academy of Sciences School of Physics and Electrical Information Science Ningxia University
The effect of the annealing time and annealing temperature on Ni/Ge/Au electrode contacts deposited on the n-type InP contact layer has been studied using a circular transmission line model. The minimum specific conta... 详细信息
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Strain affected electronic properties of bilayer tungsten disulfide
Strain affected electronic properties of bilayer tungsten di...
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作者: Xin, Zheng Zeng, Lang Wang, Yijiao Wei, Kangliang Du, Gang Kang, Jinfeng Liu, Xiaoyan Peking University Shenzhen Graduate School Shenzhen 518055 China Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
The strain effect on the electronic properties of bilayer tungsten disulfide (WS2) is investigated by density functional theory (DFT). It is found that the band gap and carrier effective masses of AA and AB stacking b... 详细信息
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The beat-frequency circuit for monitoring duty-cycle shift based on BTI effect  12
The beat-frequency circuit for monitoring duty-cycle shift b...
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2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014
作者: Qiao, Fang He, Yandong Zhang, Ganggang Zhang, Xing Peking University Shenzhen Graduate School Shenzhen518055 China Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing100871 China
Circuit reliability issues have great attention to the researchers, especially bias temperature instability (BTI). Obviously, the threshold voltage of the device degraded when the MOS is in the stress mode. For CMOS d... 详细信息
来源: 评论
Memory devices: Eliminating Negative‐SET Behavior by Suppressing Nanofilament Overgrowth in Cation‐Based Memory (Adv. Mater. 48/2016)
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Advanced Materials 2016年 第48期28卷
作者: Sen Liu Nianduan Lu Xiaolong Zhao Hui Xu Writam Banerjee Hangbing Lv Shibing Long Qingjiang Li Qi Liu Ming Liu Key Laboratory of Microelectronic Devices & Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing 100029 China College of Electronic Science and Engineering National University of Defense Technology Changsha 410073 China Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM) Nanjing 210009 China
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