This paper describes a radiation detection readout circuit for portable dosimeter which is aimed at low power,low noise and high counting rate.A current feedback baseline holder circuit is proposed to solve the baseli...
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This paper describes a radiation detection readout circuit for portable dosimeter which is aimed at low power,low noise and high counting rate.A current feedback baseline holder circuit is proposed to solve the baseline shift problem without any other performance *** core circuit has been implemented in 0.35μm CMOS *** achieves 46mV/fC conversion gain,200kcps counting rate and consumes 260μA current from 3.3V *** no detector is connected to the chip,the equivalent input noise charge is 0.094fC rms.
The effect of CHF3 gas flow rate on the trench shape and etch rate was studied for germanium-based device *** this study,a sidewall tilt angle larger than 80°with the trench depth of 300nm was achieved by optimiz...
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The effect of CHF3 gas flow rate on the trench shape and etch rate was studied for germanium-based device *** this study,a sidewall tilt angle larger than 80°with the trench depth of 300nm was achieved by optimizing the flow rate ratio of SF6/CHF3/He gas ***,based on the experimental results,a Linear Reactive Ion Etching(RIE) Model was proposed to predict the optimized composition of the SF6/CHF3/He gas mixture to obtain steep trenches with low etch rate,which may provide the guideline for the germanium etching process design.
A power clamp circuit using current mirror is proposed in this *** current mirror is used for capacitance multiplication in the proposed circuit. Besides,the proposed circuit has different turn-on and turn-off paths t...
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ISBN:
(纸本)9781467324748
A power clamp circuit using current mirror is proposed in this *** current mirror is used for capacitance multiplication in the proposed circuit. Besides,the proposed circuit has different turn-on and turn-off paths towards clamp transistor and it employs a non-traditional phase inverter in the turn-on path of clamp *** results verify that the proposed circuit has enhanced ability to discharge static charges during an ESD event while making the ESD pulse detection CR time constant notably *** the reduction of CR time constant,the proposed circuit has better immunity to mis-triggering and is less chip area-consuming.
A high-performance PMOSFET based on silicon material of hybrid orientation is *** orientation wafers,integrated by(100) and(110) crystal orientation,are fabricated using silicon-silicon bonding, chemical mechanica...
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A high-performance PMOSFET based on silicon material of hybrid orientation is *** orientation wafers,integrated by(100) and(110) crystal orientation,are fabricated using silicon-silicon bonding, chemical mechanical polishing,etching silicon and non-selective expitaxy.A PMOSFET with W/L = 50μm/8μm is also processed,and the measured results show that the drain-source current and peak mobility of the PMOSFET are enhanced by up to 50.7%and 150%at V_(gs) =-15 V and V_(ds) =-0.5 V,*** mobility values are higher than that reported in the literature.
This paper mainly discusses issues concerning the architecture of time divided closed loop accelerometer. For this particular architecture mathematical relationship between the external acceleration detected by sensor...
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This paper mainly discusses issues concerning the architecture of time divided closed loop accelerometer. For this particular architecture mathematical relationship between the external acceleration detected by sensor and the voltage output of the readout circuits is deduced. Both Matlab/Simulink model and Verilog-A model for such architecture are *** results agree with the mathematical *** circuits designed to work under 50kHz with feedback duty cycle ηbeing 60% are fabricated using 0.35μm HV CMOS *** results show a sensitivity of 1.518V/g.
A readout integrated circuit for 384×288 uncooled infrared focal plane array (IRFPA) is presented in this paper. To overcome the kickback to sample and hold stage with less power consumption, a novel readout stag...
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A readout integrated circuit for 384×288 uncooled infrared focal plane array (IRFPA) is presented in this paper. To overcome the kickback to sample and hold stage with less power consumption, a novel readout stage of a Class AB op-amp with input stage in each column and sharing one cascode output stage is introduced. This IRFPA readout circuit has been designed and fabricated in 0.35um CMOS technology. The readout speed of the circuit can reach 7MHz, the dynamic range is 86.5dB and power consumption is 108mW. A 32×32 experimental chip has been verified by test results.
In order to obtain power efficient flip-flops,two novel Hybrid-latch schemes are introduced in this paper. They achieve high performance by shortening the critical data path and power efficiency by eliminating the inv...
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ISBN:
(纸本)9781467324748
In order to obtain power efficient flip-flops,two novel Hybrid-latch schemes are introduced in this paper. They achieve high performance by shortening the critical data path and power efficiency by eliminating the inverter chain pulse *** simulation under SMIC 90nm process revealed that the two new flip-flop have excellent power and speed performance compared to the referenced *** can reduce 44.5% and 51.4% power dissipation,29.2% and 44.5% clock-to-output latency and 65.6% and 68.4% PDP.
RapidIO is a high-performance standard for embedded *** to different ending alignments of RapidIO packets,the corresponding CRC computations should be *** this paper,two selective parallel computation schemes based on...
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ISBN:
(纸本)9781467324748
RapidIO is a high-performance standard for embedded *** to different ending alignments of RapidIO packets,the corresponding CRC computations should be *** this paper,two selective parallel computation schemes based on simplified intermediate value equations are *** with the reference designs,the power dissipations can be reduced by more than 30% meanwhile better balances between the speeds and resource consumptions can be achieved.
The STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become popular with its better tradeoff between breakdown voltage and on-resistance and its compatibility with the standard complementary...
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The STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become popular with its better tradeoff between breakdown voltage and on-resistance and its compatibility with the standard complementary metal-oxide-semiconductor (CMOS) process. In this paper, a multi-region trap characterization direct current current-voltage (MR-DCIV) technique was proposed to characterize interface state generation in both channel and STI drift regions. The correlation between interface trap and MR-DCIV current has been verified by two-dimensional device simulation. Degradation of STI-based LDMOS transistors in various reliability stress modes is investigated experimentally by proposed technique. The impact of interface state location on device electrical characteristics is analyzed from measurement and simulation. Our study reveals that OFF-state stress becomes the worst degradation mode in term of the on-resistance degradation, which is attributed to interface state generation under STI drift region.
Stress-induced degradation of STI-based LDMOSFETs has been studied by multi-region direct-current current voltage(MR-DCIV)spectroscopy, a new point of view over the traditional CP and Id-Vg characterization *** capabi...
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ISBN:
(纸本)9781467324748
Stress-induced degradation of STI-based LDMOSFETs has been studied by multi-region direct-current current voltage(MR-DCIV)spectroscopy, a new point of view over the traditional CP and Id-Vg characterization *** capability of identifying the interface states in LDMOSFETs has been demonstrated by MR-DCIV *** correlation between device degradation and MR-DCIV spectrum has been verified by 2D device simulation. Experimental results and the degradation mechanism for both ON-and OFF-state stresses have been addressed. The role played by the interface state at channel and STI region in LDMOSFETs has been clearly revealed through MR-DCIV *** term of the on-resistance,the OFF-state stress leads to the worst degradation in an STI-based nLDMOS,which is attributed to the interface state generation under STI region.
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