In this paper, the impacts of diameter-dependent annealing (DDA) effect on nanowire S/D extension random dopant fluctuations (SDE-RDF) in silicon nanowire MOSFETs (SNWTs) are investigated, in terms of electrostatic pr...
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A study of two major types of LDMOS-SCR electrostatic discharge protection devices for 60V SOI BCD technology is presented. The difference of the P-anode implant positions influences the triggering mechanism of the tw...
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This paper presents a predictive electrostatic capacitance and resistance compact model of multiple gate MOSFET with cylindrical conducting channels, taking into account parasitic effects, quantum confinement and quas...
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Neodymium and manganese doped BiFeO_(3)-(Bi_(0.95)Nd_(0.05))(Fe_(0.95)Mn_(0.05))O_(3)(BNFMO)ferro-electric film and HfO_(2)layer with different thickness were fabricated using metal-organic decomposition and atomic la...
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Neodymium and manganese doped BiFeO_(3)-(Bi_(0.95)Nd_(0.05))(Fe_(0.95)Mn_(0.05))O_(3)(BNFMO)ferro-electric film and HfO_(2)layer with different thickness were fabricated using metal-organic decomposition and atomic layer deposition(ALD)method,*** ferroelectric-insulator-semiconductor(MFIS)capacitors with 200 nm thick BNFMO and 5 nm thick HfO_(2)layer on silicon substrate have been prepared and *** is found that there is no distinct interdifusion and reaction occurring at the interface between BNFMO/HfO_(2)and HfO_(2)/*** capacitance-voltage(C-V)and leakage current properties of Pt/HfO_(2)/Si capacitors with different HfO_(2)thickness were *** MFIS structure showed clockwise C-V hysteresis loops due to the ferroelectric polarization of *** maximum memory window is 5 *** current of the Pt/BNFMO/HfO_(2)/Si capacitor was about 2.1×10^(-6)A/cm^(2)at an applied voltage of 4V.
Ferroelectric field effect transistor (FeFET) is a promising candidate in nonvolatile memory application due to its fast read/write speed, nondestructive readout, and low power consumption. Since the poor retention ch...
Ferroelectric field effect transistor (FeFET) is a promising candidate in nonvolatile memory application due to its fast read/write speed, nondestructive readout, and low power consumption. Since the poor retention characteristic can be improved by introducing insulator buffer layers between gate layer and FET channel region, more and more attentions are devoted to the realization and optimization of this novel memory device [1]. Traditional ferroelectric materials, such as PZT [2, 3] and SBT [4] based FeFETs are extensively studied and reported in the past decades. Recently, Nd-doped Bismuth Titanate B 3.15 Nd 0.85 Ti 3 O 12 (BNdT) with a large remnant polarization (2Pr=103μC/cm 2 ) and outstanding fatigue endurance was reported by Chon et al. [5], and many ferroelectric applications are being processed based on this brand new ferroelectric material [6, 7]. In this letter, we fabricated a BNdT based FeFET for the first time. The fundamental structural and electrical properties are investigated correspondingly.
A systematic flow is described for characterizing, modeling, and simulating single event transient-induced soft errors in cell-based designs. Pulse broadening effects are quantified for a 65 nm CMOS process.
A systematic flow is described for characterizing, modeling, and simulating single event transient-induced soft errors in cell-based designs. Pulse broadening effects are quantified for a 65 nm CMOS process.
RapidIO is an open standard that provides high-performance interconnect for chip-to-chip, board-to-board, and chassis-to-chassis communications. In this paper, we present an executable RapidIO interconnect in which an...
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RapidIO is an open standard that provides high-performance interconnect for chip-to-chip, board-to-board, and chassis-to-chassis communications. In this paper, we present an executable RapidIO interconnect in which an improved Buffer structure based on flow control is put forward. It helps to provide a smooth data flow, strong built-in error detection and error recovery mechanisms. It is tested to increase utilization and lower packet latency. And it can be applied to reliable and high speed embedded system communications.
In summary, a novel RRAM with the structure of Cu/SixO yNz/W was first fabricated and its characteristics are thoroughly investigated. The new device exhibited low switching voltages and low reset currents, demonstrat...
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ISBN:
(纸本)9781424477272
In summary, a novel RRAM with the structure of Cu/SixO yNz/W was first fabricated and its characteristics are thoroughly investigated. The new device exhibited low switching voltages and low reset currents, demonstrating its potential for low-power applications. Repeatable unipolar resistive switching characteristics in terms of high off/on resistance ratio and good retention capability were observed. The switching mechanism of the device was analyzed and can be explained by the formation and rupture of vacancy-filaments.
RapidIO is an emerging high-performance and point-to-point packetized interconnection technology. In this paper, the design of the logical core based on safety arbitration mechanisms is described in detail. The packin...
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RapidIO is an emerging high-performance and point-to-point packetized interconnection technology. In this paper, the design of the logical core based on safety arbitration mechanisms is described in detail. The packing and unpacking of I/O Logical, Message Passing and Globally Shared Memory transactions are achieved. Excellent average data transfer rates, up to 7.8 bytes per cycle are reached in certain transactions with 256-byte data payloads, meanwhile the data efficiencies are more than 95%. Moreover, maintenance read transactions targeted at local capability and status registers can be executed in a lower latency compared with the reference design.
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