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检索条件"机构=Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits"
1611 条 记 录,以下是1371-1380 订阅
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Impacts of diameter-dependent annealing on S/D extension random dopant fluctuations in silicon nanowire MOSFETs
Impacts of diameter-dependent annealing on S/D extension ran...
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2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
作者: Yu, Tao Wang, Runsheng Ding, Wei Huang, Ru Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
In this paper, the impacts of diameter-dependent annealing (DDA) effect on nanowire S/D extension random dopant fluctuations (SDE-RDF) in silicon nanowire MOSFETs (SNWTs) are investigated, in terms of electrostatic pr... 详细信息
来源: 评论
Analysis of LDMOS-SCR ESD protection device for 60V SOI BCD technology
Analysis of LDMOS-SCR ESD protection device for 60V SOI BCD ...
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2010 IEEE International Conference of Electron devices and Solid-State circuits, EDSSC 2010
作者: Zhang, Peng Wang, Yuan Jia, Song Zhang, Xing Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
A study of two major types of LDMOS-SCR electrostatic discharge protection devices for 60V SOI BCD technology is presented. The difference of the P-anode implant positions influences the triggering mechanism of the tw... 详细信息
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Predictive modeling of capacitance and resistance in gate-all-around cylindrical nanowire MOSFETs for parasitic design optimization
Predictive modeling of capacitance and resistance in gate-al...
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2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
作者: Xu, Qiumin Zou, Jibin Luo, Jieyin Wang, Runsheng Huang, Ru Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University Beijing 100871 China
This paper presents a predictive electrostatic capacitance and resistance compact model of multiple gate MOSFET with cylindrical conducting channels, taking into account parasitic effects, quantum confinement and quas... 详细信息
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Characterizing, modeling, and simulating soft error susceptibility in cell-based designs in highly scaled technologies
Characterizing, modeling, and simulating soft error suscepti...
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12th European Conference on Radiation and Its Effects on Component and Systems, RADECS 2011
作者: Li, Y.F. Li, M. Zhao, J.Y. Schrimpf, R.D. Fleetwood, D.M. Zhang, B. Wang, J.Q. Wang, D.L. Wang, Y. Accelicon Technologies Inc. 19925 Stevens Creek Blvd Cupertino CA 95014 United States Electrical Engineering and Computer Science Department Vanderbilt University VU Station B 351825 Nashville TN 37235-1825 United States State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China Institute of Automation Chinese Academy of Science Beijing 100190 China Institute of Microelectronics Tsinghua University Beijing 100084 China
A systematic flow is described for characterizing, modeling, and simulating single event transient-induced soft errors in cell-based designs. Pulse broadening effects are quantified for a 65 nm CMOS process. © 20... 详细信息
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ATOMIC LAYER DEPOSITION HfO_(2)FILM USED AS BUFFER LAYER OF THE Pt/(Bi_(0.95)Nd_(0.05))(Fe_(0.95)Mn_(0.05))O_(3)/HfO_(2)/Si CAPACITORS FOR FeFET APPLICATION
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Journal of Advanced Dielectrics 2011年 第3期1卷 369-377页
作者: DAN XIE TINGTING FENG YAFENG LUO XUEGUANG HAN TIANLING REN MARKUS BOSUND SHUO LI VELI-MATTI AIRAKSINEN HARRI LIPSANEN SEPPO HONKANEN Tsinghua National Laboratory for Information Science and Technology(TNList) Institute of Microelectronics Tsinghua UniversityBeijing 100084P.R.China Department of Micro and Nanosciences Aalto University School of Science and Technology Finland State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of ChinaChengdu 610054P.R.China
Neodymium and manganese doped BiFeO_(3)-(Bi_(0.95)Nd_(0.05))(Fe_(0.95)Mn_(0.05))O_(3)(BNFMO)ferro-electric film and HfO_(2)layer with different thickness were fabricated using metal-organic decomposition and atomic la... 详细信息
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Nd-doped Bismuth Titanate based ferroelectric field effect transistor: Design, fabrication, and optimization
Nd-doped Bismuth Titanate based ferroelectric field effect t...
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IEEE Conference on Electron devices and Solid-State circuits
作者: Tingling Feng Dan Xie Yongyuan Zang Xaio Wu Yafeng Luo Tianling Ren Markus Bosund Shuo Li Veli-Matti Airaksinen Harri Lipsanen Seppo Honkanen Tsinghua National Laboratory for information Science and Technology (TNList) Institute of Microelectronics Tsinghua University Beijing China State Key Laboratory of Electronic Thin Final and Intergrated Devices University of Electronic science and Technology of China Chengdu China Electrical and Computer Engineering McGill University Montreal QUE Canada Department of micro and Nanosciences Aalto University of Science and Technology Finland
Ferroelectric field effect transistor (FeFET) is a promising candidate in nonvolatile memory application due to its fast read/write speed, nondestructive readout, and low power consumption. Since the poor retention ch...
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Characterizing, modeling, and simulating soft error susceptibility in cell-based designs in highly scaled technologies
Characterizing, modeling, and simulating soft error suscepti...
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European Conference on Radiation and its Effects on Components and Systems (RADECS)
作者: Y. F. Li M. Li J. Y. Zhao R. D. Schrimpf D. M. Fleetwood B. Zhang J. Q. Wang D. L. Wang Y. Wang Accelicon Technologies Inc. Cupertino CA USA Electrical Engineering and Computer Science Department Vanderbilt University Nashville TN USA State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology Chengdu China Institute of Automation Chinese Academy of Sciences Beijing China Institute of Microelectronics Tsinghua University Beijing China
A systematic flow is described for characterizing, modeling, and simulating single event transient-induced soft errors in cell-based designs. Pulse broadening effects are quantified for a 65 nm CMOS process.
来源: 评论
Buffer design based on flow control in RapidIO
Buffer design based on flow control in RapidIO
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Asia Pacific Conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)
作者: Xiongbo Zhao Song Jia Yuan Wang Guirong Wu Fengfeng Wu Kai Yang Key Laboratory of Microelectronics Devices and Circuits Institute of Microelectronics Peking University Beijing China
RapidIO is an open standard that provides high-performance interconnect for chip-to-chip, board-to-board, and chassis-to-chassis communications. In this paper, we present an executable RapidIO interconnect in which an... 详细信息
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A novel nitrogen-doped SiOx resistive switching memory with low switching voltages
A novel nitrogen-doped SiOx resistive switching memory with ...
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2010 15th Silicon Nanoelectronics Workshop, SNW 2010
作者: Gao, Dejin Zhang, Lijie Huang, Ru Wang, Runsheng Wu, Dongmei Kuang, Yongbian Tang, Yu Yu, Zhe Wang, Albert Z. H. Wang, Yangyuan Key Laboratory of Microelectronic Devices and Circuits Institute of Microelectronics Peking University 100871 China Dept. of Electrical Engineering University of California Riverside CA 92521 United States
In summary, a novel RRAM with the structure of Cu/SixO yNz/W was first fabricated and its characteristics are thoroughly investigated. The new device exhibited low switching voltages and low reset currents, demonstrat... 详细信息
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Design of RapidIO logical core based on safety arbitration mechanisms
Design of RapidIO logical core based on safety arbitration m...
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Asia Pacific Conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)
作者: Wu Fengfeng Jia Song Yang Kai Zhao Xiongbo Wu Guirong Key Laboratory of Microelectronics Devices and Circuits (MOE) Institute of Microelectronics Peking University Beijing China
RapidIO is an emerging high-performance and point-to-point packetized interconnection technology. In this paper, the design of the logical core based on safety arbitration mechanisms is described in detail. The packin... 详细信息
来源: 评论