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共 122 条记录，以下是101-110 订阅

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Minimum error bounded efficient 1 tracker with occlusion detection

Minimum error bounded efficient 1 tracker with occlusion det...

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作者： Mei, Xue Ling, Haibin Wu, Yi Blasch, Erik Bai, Li Assembly Test Technology Development Intel Corporation Chandler AZ United States Center for Information Science and Technology Computer and Information Science Department Temple University Philadelphia PA United States College of Computer and Software Nanjing University of Information Science and Technology Nanjing 210044 China Air Force Research Lab SNAA OH United States Electrical and Computer Engineering Department Temple University Philadelphia PA United States

ISBN: (纸本)9781457703942

Recently, sparse representation has been applied to visual tracking to find the target with the minimum reconstruction error from the target template subspace. Though effective, these L1 trackers require high computational costs due to numerous calculations for 1 minimization. In addition, the inherent occlusion insensitivity of the 1 minimization has not been fully utilized. In this paper, we propose an efficient L1 tracker with minimum error bound and occlusion detection which we call Bounded Particle Resampling (BPR)-L1 tracker. First, the minimum error bound is quickly calculated from a linear least squares equation, and serves as a guide for particle resampling in a particle filter framework. Without loss of precision during resampling, most insignificant samples are removed before solving the computationally expensive 1 minimization function. The BPR technique enables us to speed up the L1 tracker without sacrificing accuracy. Second, we perform occlusion detection by investigating the trivial coefficients in the 1 minimization. These coefficients, by design, contain rich information about image corruptions including occlusion. Detected occlusions enhance the template updates to effectively reduce the drifting problem. The proposed method shows good performance as compared with several state-of-the-art trackers on challenging benchmark sequences. © 2011 IEEE.

关键词： Error detection

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Minimum error bounded efficient ℓ1 tracker with occlusion detection

Minimum error bounded efficient ℓ1 tracker with occlusion d...

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Conference on Computer Vision and Pattern Recognition (CVPR)

作者： Xue Mei Haibin Ling Yi Wu Erik Blasch Li Bai Assembly Test Technology Development Intel Corporation Chandler AZ USA University of Maryland College Park USA Center of Information Science & Technology Computer & Information Science Department Temple University Philadelphia PA USA College of Computer and Software Nanjing University of Information Science and Technology Nanjing China Air Force Research Laboratory SNAA OH USA Electrical and Computer Engineering Department Temple University Philadelphia PA USA

Recently, sparse representation has been applied to visual tracking to find the target with the minimum reconstruction error from the target template subspace. Though effective, these L1 trackers require high computational costs due to numerous calculations for ℓ 1 minimization. In addition, the inherent occlusion insensitivity of the ℓ 1 minimization has not been fully utilized. In this paper, we propose an efficient L1 tracker with minimum error bound and occlusion detection which we call Bounded Particle Resampling (BPR)-L1 tracker. First, the minimum error bound is quickly calculated from a linear least squares equation, and serves as a guide for particle resampling in a particle filter framework. Without loss of precision during resampling, most insignificant samples are removed before solving the computationally expensive ℓ 1 minimization function. The BPR technique enables us to speed up the L1 tracker without sacrificing accuracy. Second, we perform occlusion detection by investigating the trivial coefficients in the ℓ 1 minimization. These coefficients, by design, contain rich information about image corruptions including occlusion. Detected occlusions enhance the template updates to effectively reduce the drifting problem. The proposed method shows good performance as compared with several state-of-the-art trackers on challenging benchmark sequences.

关键词： Target tracking Minimization Business process re-engineering Probability Visualization Image reconstruction Upper bound

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A case study of multi-chip package signal and power integrity optimization and tradeoff

A case study of multi-chip package signal and power integrit...

引用

DesignCon 2010

作者： Ji, Steven Warner, Ethan Guo, Yan Kandasamy, Aruljothi Heinemann, Erich Liu, Bowen Karunan, Anoop Ji, Gang Intel Corporation United States Physical and Electrical Design Team Assembly Test and Technology Development Group Intel Corporation United States

ISBN: (纸本)9781617385469

Package design optimization is a big challenge to microprocessor designs due to increasing design complexity. This paper presents signal and power integrity learning on mobile multi- chip-package design and validation. Two test packages were designed to meet the cost and performance target with different layer count (10 and 12). Post-silicon validation suggested the 10-layer package achieves the same platform performance as the 12-layer package due to design optimization implemented. Detailed simulation and measurement data are provided to support the conclusion and illustrate the design tradeoff between signal and power integrity.

关键词： Microprocessor chips

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Electrical evaluation of power- Grid configurations

Electrical evaluation of power- Grid configurations

引用

DesignCon 2010

作者： Bharath, Krishna Suryakumar, Mahadevan Sarangi, Ananda Taylor, Greg Intel Corporation United States Advance Design Team Assembly Test Technology Development Group Intel Chandler AZ United States

ISBN: (纸本)9781617385469

Scaling of transistor geometries has been the primary mechanism to support the exponential increase in microprocessor performance over generations. However, the metal interconnect and bump pitch have not scaled at the same rate, leading to challenges in power delivery. In this paper, conceptual power-grid designs have been analyzed.

关键词： Electric power transmission

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Underfill Cure Induced Micro-Anomaly (CIMA) And Its Mechanism and Reliability Implications

Underfill Cure Induced Micro-Anomaly (CIMA) And Its Mechanis...

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2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Jieping Zhang Marcus Hsu Saikumar Jayaraman Assembly and Test Technology Development Intel Corporation Chandler AZ

Cure Induced Micro-Anomaly (CIMA) are worm like hollow microstructures found within resin rich region of underfill after curing within a BGA package with combination of copper die bumps and Sn-Ag substrate bumps. CIMA leads to solder extrusion during secondary reflow. Root cause of CIMA has been identified to be from thermal mechanical stress induced by the stiffness of the joints formed between the die and substrate, dissipation of stress causes the underfill to crack. Addition of stress induction from package warpage, high Prebake temperature has shown to worsen effects of CIMA. Step-cure and flip curing has shown to reduce the effects.

关键词： Substrates Copper Joints Tin Stress Packaging

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Effects of Bump Metallurgies, Underfill Material and its Cure Process on Package Warpage

Effects of Bump Metallurgies, Underfill Material and its Cur...

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2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Jieping Zhang Dongwen Gan Jinlin Wang Jayaraman Saikumar Li-Hsin Chang Assembly & Test Technology Development Intel Corporation Chandler Arizona 85226 USA

Excessive warpage in flip-chip packages would raise concerns of process stability and reliability as well as customer acceptance concerns, making it critical to understand the thermal-mechanical mechanism of package warpage. In this paper, we report our comprehensive study focusing on the effects of the bump metallurgies, underfill material and its cure process on the package warpage. The warpage of the units with the Pb-free bump joints and its dependence on the underfill and its process were found significantly different from the units with other bump joints. The underline mechanism of package warpage formation is discussed.

关键词： Curing Joints Copper Temperature measurement Substrates Annealing

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Mm-wave rectangular slot loop antenna array for broad spatial coverage

Mm-wave rectangular slot loop antenna array for broad spatia...

引用

Antennas and Propagation Society International Symposium

作者： Helen K. Pan Bryce D. Horine Kranti K. Tantwai Intel Laboratory Intel Corporation Hillsboro OR USA Assembly Test and Technology Development Intel Corporation India

ISBN: (纸本)9781424449675

In this paper, a planar rectangular slot loop antenna is proposed that provides unique radiation pattern with broad beam pattern tilting toward the side. Other than typical broadside or endfire antenna array, the beam tilted rectangular slot loop antenna array brings flexibility for platform placement while providing broad spatial coverage.

关键词： Slot antennas Antenna radiation patterns Arrays Antenna arrays Microstrip antennas Bandwidth

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Cooling performance of piezoelectric fan in notebook system

Cooling performance of piezoelectric fan in notebook system

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34th International Electronics Manufacturing technology Conference, IEMT 2010

作者： Kar Mun, Ng Sauciuc, Ioan Wada, Hiroaki Tanaka, Nobuhira Intel Asia-Pacific Research and Development Ltd. Shanghai Zizhu Science Park No. 880 Zi Xing Road Shanghai 20041 China Assembly and Test Technology Development Intel Corporation 5000 W. Chandler Blvd Arizona United States Murata Manufacturing Company Ltd. 1-10-1 Higashikotari Nagaokakyo-shi Kyoto 617-8555 Japan

ISBN: (纸本)9781424488278

Thin form factor and high computing performance are the inevitable trend of notebook industry. Both vectors impose more stringent challenge on thermal solution design to maintain internal components and external chassis surfaces within temperature requirements. Cooling industry contributed great effort in miniaturizing conventional blower fan to thin form factor for supporting thin notebook cooling. However, due to the physical size constraints such as rotary blade, magnetic coil, bearing mechanism & circuit board, the effective flowrate of thin form factor fan is relative low. Multiple past researches have been focusing on characterization of thermal performance at component level. However, investigation of practical cooling application of piezofan in thin notebook has not been widely studied. This paper investigates the feasibility of implementing piezoelectric fan (referred as piezofan from now) as an alternative cooling technology in thin notebook. The piezofan design is constrained by volumetric size not greater than blower fan used for cooling thin notebook. The selected notebook is low power thin & light 13 notebook, with processor TDP (Thermal Design Power) of 18W. Firstly, the cooling impact of heat exchanger design is studied in terms of position, fin gap & inlet shape. The optimum cooling performance is observed when heat exchanger design is with 1.5mm fin gap, additional recesses at top & bottom of inlet plane and positioned at in front (0mm) of piezofan vibration tip. Secondly, cooling characteristic of piezofan is studied in terms of blade length (l), thickness (t), operating frequency () and amplitude (A). First resonance frequency is observed to be linearly dependent on t/l2. The cooling performance of piezofan is concluded inversely power to A. Better cooling performance is obtained at higher resonance frequency and larger vibration amplitude. Piezofan with shorter vibration blade generates higher A value (better cooling performance). The sound pres

关键词： Cooling

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Cooling performance of piezoelectric fan in notebook system

Cooling performance of piezoelectric fan in notebook system

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IEEE/CHMT(CPMT) International Electronics Manufacturing technology Symposium

作者： Ng Kar Mun Ioan Sauciuc Hiroaki Wada Nobuhira Tanaka Intel Asia-Pacific Research & Development Ltd. No. 880 Zi Xing Road Shanghai Zizhu Science Park 20041 China Assembly & Test Technology Development Chandler Arizona Murata Manufacturing Company Ltd. Kyoto Japan

Thin form factor and high computing performance are the inevitable trend of notebook industry. Both vectors impose more stringent challenge on thermal solution design to maintain internal components and external chassis surfaces within temperature requirements. Cooling industry contributed great effort in miniaturizing conventional blower fan to thin form factor for supporting thin notebook cooling. However, due to the physical size constraints such as rotary blade, magnetic coil, bearing mechanism & circuit board, the effective flowrate of thin form factor fan is relative low. Multiple past researches have been focusing on characterization of thermal performance at component level. However, investigation of practical cooling application of piezofan in thin notebook has not been widely studied. This paper investigates the feasibility of implementing piezoelectric fan (referred as piezofan from now) as an alternative cooling technology in thin notebook. The piezofan design is constrained by volumetric size not greater than blower fan used for cooling thin notebook. The selected notebook is low power thin & light 13" notebook, with processor TDP (Thermal Design Power) of 18 W. Firstly, the cooling impact of heat exchanger design is studied in terms of position, fin gap & inlet shape. The optimum cooling performance is observed when heat exchanger design is with 1.5mm fin gap, additional recesses at top & bottom of inlet plane and positioned at in front (~0 mm) of piezofan vibration tip. Secondly, cooling characteristic of piezofan is studied in terms of blade length (l), thickness (t), operating frequency (f) and amplitude (A). First resonance frequency is observed to be linearly dependent on t/l 2 . The cooling performance of piezofan is concluded inversely power to A × f. Better cooling performance is obtained at higher resonance frequency and larger vibration amplitude. Piezofan with shorter vibration blade generates higher A × f value (better cooling performance).

关键词： Blades Heating Cooling Resonant frequency Voltage measurement Vibrations Frequency measurement

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A compact 802.11 a/b/g/n WLAN Front-End Module using passives embedded in a flip-chip BGA organic package substrate

A compact 802.11 a/b/g/n WLAN Front-End Module using passive...

引用

Microwave, MTT-S International Symposium

作者： Telesphor Kamgaing Emile Davies-Venn Kaladhar Radhakrishnan Components Research Intel Corporation Chandler AZ USA Assembly and Test Technology Development Intel Corporation Chandler AZ USA

ISBN: (纸本)9781424428038

This paper discusses the design and implementation of a compact RF front-end-module for 802.11 a/b/g/n application. A high performance embedded passives technology has been developed by extending existing multilayer FCBGA packaging substrate technology to include thin film capacitors, resistors and spiral inductors. Using these basic elements, all of the passive building blocks for the RF front-end module (FEM) have been designed and characterized individually. Several of these building blocks have then been used in combination with surface mounted active dies to realize a dual-band one-transmit/one-receive WiFi FEM with dimensions of 8 mm times 8 mm times 1 mm. Preliminary measurements indicate small signal gain of 10 dB at 2.4 GHz for the Rx chain.

关键词： Wireless LAN Packaging Substrates Radio frequency Thin film inductors Nonhomogeneous media Capacitors Resistors Spirals Dual band

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