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Reflection phase and surface wave propagation characteristics of a symmetrical perforated high impedance surface

Reflection phase and surface wave propagation characteristic...

引用

Antennas and Propagation Society International Symposium

作者： Saud M. Saeed Constantine A. Balanis Ahmet C. Durgun Computer and Energy Engineering Arizona State University Tempe AZ USA Assembly and Test Technology Development Intel Corporation Chandler AZ USA

Electromagnetic bandgap (EBG) structures are used to suppress surface wave (SW) propagation in printed antenna systems. Although there are several different types of EBG structures, not all of them can be utilized in flexible applications. As a promising flexible EBG structure, perforated high impedance surfaces (PHIS), which also behave as artificial magnetic conductors, were previously reported. However, due to the asymmetry of their geometry, they can suppress SW in only one direction. This paper reports a symmetrical PHIS, which suppresses surface waves in more than one direction. The geometry of the perforations and patches are optimized to overlap the reflection phase and SW suppression bands.

关键词： Surface impedance Surface waves Microstrip antennas Periodic structures Microstrip Impedance

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MULTI-FEATURE SPARSE-BASED DEFECT DETECTION AND CLASSIFICATION IN SEMICONDUCTOR UNITS

MULTI-FEATURE SPARSE-BASED DEFECT DETECTION AND CLASSIFICATI...

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IEEE International Conference on Image Processing

作者： Bashar Haddad Lina Karam Jieping Ye Nital Patel Martin Braun School of Electrical Computer and Energy Engineering Arizona State University School of Computer Science and Engineering Arizona State University Assembly & Test Technology Development Intel Corporation

ISBN: (纸本)9781467399623

Automated inspection systems have been used extensively for high-speed defect detection, gaging and quality control. In the semiconductor manufacturing industry, assembly and testing processes are getting more complex resulting in a greater tendency of defects to impact the production process. Currently available defect detection and classification systems are customized and hard-wired to the detection of particular classes of defects and cannot deal with new unknown classes. Shortage of defective units, similarities within different classes of defects, wide variations within the same defect class, and data imbalance are the basic challenges for this problem. This paper presents a novel stacking-based multi-feature, sparse-based defect detection and classification method that is robust to data imbalance and low number of training samples. Experimental results on real-world data from intel show that the proposed approach results in a high classification accuracy as compared to existing methods.

关键词： Automation Data mining Feature extraction Image classification Sparse coding Stacking

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Improved Package Modeling and Correlation Methodology for High Speed IO Design

Improved Package Modeling and Correlation Methodology for Hi...

引用

IEEE Electronic Components and technology Conference

作者： Cemil S. Geyik Zhichao Zhang Kemal Aygun Assembly and Test Technology Development Intel Corporation Chandler AZ

Predicting and optimizing the package electrical performance for high speed input/output (IO) design requires an accurate and robust modeling methodology. Such a methodology requires high fidelity representation of physical structures and accurate characterization of broadband frequency dependent material properties. In addition, a modeling to measurement correlation flow that can very accurately de-embed the parasitics of probe pads and transitions from measured data is also required to validate both the modeling methodology itself and the modeling input parameters. In this paper, a comprehensive flow for an improved package modeling and a correlation methodology for high speed IO design is presented that is verified with measured and modeled results for both single-ended and differential package transmission lines.

关键词： High speed io design Signal integrity Transmission lines Packaging Two-line method Modeling

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Hot forming of Mg AZ31B alloy sheet processed by warm rolling 12th

Hot forming of Mg AZ31B alloy sheet processed by warm rollin...

引用

12th International Conference on Superplasticity in Advanced Materials, ICSAM 2015

作者： Antoniswamy, Aravindha R. Weldon, Andrew J. Taleff, Eric M. Hector, Louis G. Carter, Jon T. Department of Mechanical Engineering The University of Texas at Austin 204 E. Dean Keeton St. Stop C2200 AustinTX78712 United States General Motors Research and Development MC 480-106-RL1 30500 Mound Rd WarrenMI48090-9055 United States Intel Corporation Assembly and Test Technology Development 5000 W. Chandler Blvd ChandlerAZ85226 United States Cameron 5921 Thomas Road HoustonTX77041 United States

ISBN: (纸本)9783038356721

Magnesium alloy AZ31B is of interest for hot forming because it can achieve a superplastic response at high temperatures and slow strain rates. As temperature decreases and forming rate increases, its strain-rate sensitivity decreases and significant plastic anisotropy can arise. These effects are the result of a transition in deformation mechanisms from grain-boundary-sliding (GBS) to dislocation-climb (DC) creep. However, sheet production using a particular warm-rolling process can produce a material with a smaller grain size and weaker basal texture. These microstructural changes promote GBS creep and decrease the degree of anisotropy under DC creep. Microstructural and tensile data are presented to show these effects at 350 and 450°C through comparisons to a normally processed material with a more typical microstructure. © 2016 Trans Tech Publications, Switzerland.

关键词： Magnesium alloys

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On the effective coefficient of thermal expansion (CTE) of bilayer/trilayer in semiconductor package substrates

On the effective coefficient of thermal expansion (CTE) of b...

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Electronic Components and technology Conference (ECTC)

作者： Peng Chen Prasanna Raghavan Kyle Yazzie Huiyang Fei Assembly and Test Technology Development Intel Corporation Chandler AZ

The coefficient of thermal expansion (CTE) is a material parameter used to measure the degree of expansion divided by the change in temperature. For single layer films, there exists an explicit definition and well-established technique (Thermomechanical Analysis) to measure the CTE. However, there is no explicit definition of effective CTE for multilayer films/composites composed of multiple materials with different individual CTE's. Definition and calculation of effective CTE of multilayer films/composites are still unexplored fundamental problems. Bilayer and trilayer films are major components in the semiconductor package substrate. Three different effective CTE's located at the top surface, bottom surface and mid-plane of bottom film of bilayers were derived explicitly and compared to finite element modeling. Furthermore, the effective CTE of symmetrical trilayer films was derived explicitly and compared to finite element modeling. It shows that not only the individual CTE's of constituent materials but also the ratios of thicknesses and moduli contribute to the effective CTE behavior. The theoretical and numerical study of effective CTE of bilayer and trilayer fills our knowledge gap of effective CTE of multilayer films/composites and provides better understanding of the thermal-mechanical behavior of semiconductor package substrate. The principles also provide solutions and insights to solve critical issues (i.e. warpage) induced by thermal mismatch strains.

关键词： Films Substrates Erbium Strain Resins Hafnium

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Impact of fiber weaves on 56 Gbps SerDes interface in glass epoxy packages

Impact of fiber weaves on 56 Gbps SerDes interface in glass ...

引用

IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEPS)

作者： Ahmet C. Durgun Kemal Aygün Assembly and Test Technology Development Intel Corporation Chandler AZ USA

Some package substrates are composed of glass fiber bundles and epoxy resin which have different electrical properties. These differences result in variations in characteristic impedance and propagation speeds, which may be detrimental at high data rates. The insertion loss (IL), within pair skew and differential to common mode conversion ratio of transmission lines may drastically increase due to the fiber weave effect. Consequently, the link budget of high speed communication channels may be significantly hindered. This paper addresses the problems due to the fiber weave effect and provides mitigation techniques at the package level, particularly for 56 Gbps Serializer/Deserializer (SerDes) interface.

关键词： Weaving Optical fiber communication Glass Substrates Conferences Analytical models Geometry

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Reliable and accurate characterization of frequency dependent electrical material properites

Reliable and accurate characterization of frequency dependen...

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Electronic Components and technology Conference (ECTC)

作者： Yichi Zhang Leigh Wojewoda Kemal Aygün Electrical Core Competency Assembly and Test Technology Development Intel Corporation Chandler AZ

In today's high speed digital circuit design, some high data rate signal paths require interconnect simulations up to 100 GHz. One of the major challenges for these simulations is generating reliable and accurate frequency dependent material models for dielectric constant (dk) and loss tangent (df). This paper will present a metrology for measurement of typical interconnect materials using cavity resonators including a method to capture all measurement variations. Once a precise metrology is established, the paper will then use the collected data to provide additional insight into popular modeling methods used to extrapolate data beyond measurement frequency. For the type of materials measured, specific recommendations will be made on the modeling parameters to have the most accurate high-frequency models for typical package substrate materials.

关键词： Cavity resonators Dielectric measurement Resonant frequency Metrology Integrated circuit modeling Fabry-Perot Frequency measurement

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Predictive dynamic thermal and power management for heterogeneous mobile platforms 15

Predictive dynamic thermal and power management for heteroge...

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Design, Automation and test in Europe Conference and Exhibition

作者： Gaurav Singla Gurinderjit Kaur Ali K. Unver Umit Y. Ogras Energy Engineering Arizona State University Assembly & Test Technology Development Intel Corporation

ISBN: (纸本)9783981537048

Heterogeneous multiprocessor systems-on-chip (MPSoCs) powering mobile platforms integrate multiple asymmetric CPU cores, a GPU, and many specialized processors. When the MPSoC operates close to its peak performance, power dissipation easily increases the temperature, hence adversely impacts reliability. Since using a fan is not a viable solution for hand-held devices, there is a strong need for dynamic thermal and power management (DTPM) algorithms that can regulate temperature with minimal performance impact. This paper presents a DTPM algorithm based on a practical temperature prediction methodology using system identification. The DTPM algorithm dynamically computes a power budget using the predicted temperature, and controls the types and number of active processors as well as their frequencies. Experiments on an octa-core big. LITTLE processor and common Android apps demonstrate that the proposed technique predicts temperature within 3% accuracy, while the DTPM algorithm provides around 6× reduction in temperature variance, and as large as 16% reduction in total platform power compared to using a fan.

关键词： Temperature measurement Power demand Benchmark testing Prediction algorithms Mathematical model Thermal management Graphics processing units

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Advancement in modeling vapor pressure induced stresses in electronic packaging

Advancement in modeling vapor pressure induced stresses in e...

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International Conference on Electronics Packaging (ICEP)

作者： Loh Wei Keat Lee Yung Hsiang Ong Kang Eu Chin Ian Leong Jenn Seong Assembly and Test Technology Development Intel Technology Sdn Bhd Malaysia Quality and Reliability Department Intel Technology Sdn Bhd Malaysia

ISBN: (纸本)9781479919536

Reliability defect associated with thermal and humidity environment is not a new issue in modern electronics packaging. Moisture entrapment causes localized vapor pressure build up and leads to pop-corning or delamination in the internal structures when subjected reflow temperature. It was normally assumed that moisture entrapped inside the polymeric material is in saturated vapor state where vapor pressure can raised up to ~5MPa at 260°C which may and may not cause any resultant stress field change that leads to catastrophic failure. The approach proposed here utilized the Pressure-specific volume-Temperature (P-v-T) properties of water to determine the state of the water properties and corresponding vapor pressure induced. This open up the possibility that the pressure developed can be higher than 5MPa which can potentially explain the catastrophic failure such as pop-corning. The modeling framework leverage sequential moisture diffusion analysis and stress analysis with custom subroutine to incorporate vapor pressure induce strain in finite element computation. Two case studies demonstrated the feasibility of this advance methodology to describe the failure mechanism.

关键词： Moisture Stress Temperature Polymers Strain Electronics packaging Delamination

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In-situ surface mount process characterization using digital image correlation

In-situ surface mount process characterization using digital...

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2013 Annual Conference on Experimental and Applied Mechanics

作者： Walwadkar, Satyajit Kovalchick, Christopher Hezeltine, Wade Liang, Frank McAllister, Alan Mechanical Core Competency Assembly Test and Technology Development Intel Corporation 5200 Elam Young Parkway Hillsboro OR 97124 United States

ISBN: (纸本)9783319007793

Surface mount technologies (SMT) are widely used in the electronic industry to mount integrated circuit (IC) component packages onto printed circuit boards (PCB). Increasing miniaturization and form factor reduction drives the need for improved tools and techniques to better understand and quantify the fundamentals of the surface mount process A novel application of the digital image correlation (DIC) method, a non-contact, full-field optical measuring technique for quantifying displacements and strains on a surface of interest, is employed for in-situ lab-based SMT investigations to characterize solder joint collapse. A case study is presented to examine key phenomena during the SMT process illustrating the effect of package tilt on solder joint collapse as a result of asymmetric solder ball array pattern on BGA. © The Society for Experimental Mechanics, Inc. 2014.

关键词： Image correlation

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