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Effect of stagger angle on capillary performance of microgroove structures with reentrant cavities

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Science China(Technological Sciences) 2021年第7期64卷 1436-1446页

作者： SUN YaLong LIANG FuYe TANG Yong TANG Heng XI XiaoQian YANG Shu FU Ting Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong School of Mechanical and Automotive EngineeringSouth China University of TechnologyGuangzhou510640China College of Mechatronics and Control Engineering Shenzhen UniversityShenzhen518000China School of Machinery and Automation Wuhan University of Science and TechnologyWuhan430000China

Aluminum-based microgroove surfaces with reentrant cavities (MSRCs) were fabricated by two staggered ploughing/extrusion processes to meet the requirements of lightweight phase change heat transfer *** MSRCs with different stagger angles between cavities and microgrooves (MGs) were fabricated to study the effect of stagger angle on capillary *** rise and permeability tests were performed on all MSRCs and the results were compared with MGs having the same processing *** was found that MSRCs with smaller stagger angles have higher capillary height,and the maximum enhancement maintained by MSRC45 was about 54.84%.However,MSRCs with larger stagger angles were found to have higher ***,the capillary parameter K·ΔP_(cap)was used as a comprehensive index to evaluate these ***90 and MSRC75 obtained the largest K·ΔP_(cap)values without and with the effect of gravity considered,*** all MSRCs had a higher capillary rise height than MGs,smaller stagger angles (≤60°) seriously reduced the permeability of MSRCs and even resulted in smaller K·ΔP_(cap)value than that of MGs when calculated considering the effect of ***,MSRCs with larger stagger angles (≥75°) may be the optimum wicks due to the good balance between capillary pressure and permeability.

关键词： stagger angle capillary performance microgroove structure reentrant cavities

A novel ultra-thin vapor chamber based on graphite copper-clad film for thermal management in electronic devices

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A novel ultra-thin vapor chamber based on graphite copper-cl...

International Conference on (ICEPT) Electronic Packaging Technology

作者： Yifu Liang Jingjing Bai Xiaolong Liu Shengrong Xiao Xuepeng Yuan Yong Tang Caiman Yan Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong South China University of Technology Guangzhou China

As highly integrated and miniaturized power components rapidly develop, the extreme heat accumulation of electronic devices easily occurs, leading to an urgent demand for better thermal performance of heat dissipation devices. Besides, an efficient heat dissipation method was still essential for the development of flexible power components. Herein, a novel ultra-thin vapor chamber (UTVC) based on graphite copperclad film with a thickness of only 0.68 mm was fabricated by a simple hot pressing process, and the composite wick structure was used as a capillarity-enhanced structure and a supporting structure for vapor flowing. The different filling liquid mass and test orientations of UTVC were both discussed. The surface temperature, temperature difference, thermal resistance, and thermal conductivity of UTVC were experimentally investigated, respectively. The UTVC could achieve a uniform surface temperature distribution (below 7.5 W), a low temperature difference (less than 2℃ at 6.5 W), a low thermal resistance (0.33℃/W at 6.5 W), and a high thermal conductivity (beyond 10000 W/(m·K)) under different orientations. Moreover, UTVC also showed wonderful flexibility, providing a potential application in the field of flexible folding. Further research will be carried out based on its flexibility.

关键词：

Pool Boiling Enhancement of Copper Powder-Mesh Composite Surface Based on Screen Printing for High-Power Electronics Cooling

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Pool Boiling Enhancement of Copper Powder-Mesh Composite Sur...

International Conference on (ICEPT) Electronic Packaging Technology

作者： Shiwei Zhang Yincai Zhao Jingjing Bai Huarong Qiu Yiming Li Zixin Yang Caiman Yan Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong South China University of Technology Guangzhou China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

With the rapid development of high-power electronic devices, heat dissipation has become one of the key issues limiting evolution. Pool boiling, as a typical phase change heat transfer technology, is a promising solution to this high-power heat dissipation problem. The pursuit of efficient pool boiling based on the structural surface has been a research goal. In this study, a copper powder-mesh composite surface was proposed based on screen printing technology to optimize pool boiling performance. This novel composite surface is obtained by locally screen printing of ultra-fine copper powder in copper mesh. The optimized composite surface achieves a critical heat flux (CHF) of $214.1\ \mathrm{W}/\text{cm}^{2}$ and a heat transfer coefficient (HTC) of $38.4\ \mathrm{W}/(\text{cm}^{2}\cdot \mathrm{K})$ at a heat flux of $90.7 \mathrm{W}/\text{cm}^{2}$ , which is improved by 116.3% and 644.2% over conventional smooth copper surfaces, respectively. The combined fine pores of the micro-powder and high permeability of the copper mesh enable rapid bubble formation and effective liquid supply, preventing dry-out phenomenon and significantly enhancing the pool boiling heat transfer performance. Benefitting from flexible and reliable screen-printing technology, this locally printed composite surface shows great potential for thermal application in high-power electronic devices.

关键词： Heating systems Printing Performance evaluation Electric potential Visualization Liquids Copper

A novel ultra-thin 90° bent vapor chamber for heat dissipation in multi-heat source electronic devices

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A novel ultra-thin 90° bent vapor chamber for heat dissipat...

International Conference on (ICEPT) Electronic Packaging Technology

作者： Jingjing Bai Yifu Liang Huarong Qiu Yincai Zhao Shiwei Zhang Fangqiong Luo Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong South China University of Technology Guangzhou China

With the high development of miniaturization, lightweight, and integration of the miniature electronic manufacturing industry, the traditional heat dissipation methods have been difficult to satisfy the high-power density heat dissipation challenges of multi-heat source electronic devices in a narrow space. At the same time, the amount of power chips on the PCB in electronic devices has increased dramatically, and the phenomenon that the heated and condensation parts are not in the same plane is becoming more and more general. The phase change heat transfer heat sink, which uses the latent heat of liquid medium to transfer heat through phase change, is the most efficient heat transfer device to solve the high heat flux heat dissipation problem. Herein, based on the phase change heat transfer heat sink, an ultra-thin 90° bent vapor chamber (UTBVC) that achieves up to 50 W of heat dissipation from multiple heat sources and has not yet reached the critical power of the heat sink is proposed. Furthermore, the study delves into how the heat transfer capability of UTVCs changes depending on their filling ratios and examines how their thermal resistance is affected by bending. In this work, the UTBVC is shown to have an excellent heat transfer performance, which reduced the heat source temperature by 23.44°C at 50 W with a maximum temperature difference of less than 1°C at the evaporation surface. In this study, a novel and feasible solution to heat dissipation in a narrow space with multiple heat sources is provided by the UTBVC, and a brave design for the bent vapor chambers in different planes is also offered.

关键词：

Ultra-Thin Vapor Chamber Based Heat Dissipation Technology for Lithium-Ion Battery

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SSRN 2023年

作者： Zhao, Wei Yin, Shubin Tang, Yong Li, Hongming Huang, Haoyi Ji, Wei Zhang, Shiwei Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong School of Mechanical and Automotive Engineering South China University of Technology Guangzhou510640 China

Powerful thermal management scheme is the key to realizes the extreme fast charging of battery electric vehicles. Scheme, set water-cooled plate at the bottom of battery modules, has remarkable heat dissipation ability, but increase the temperature difference between the top and bottom of the battery. The temperature difference problem is more obvious during the high-rate charge/discharge process, in particular in area of the battery tabs which usually located far away from the cooling plate, the heat is accumulated, which risks thermal runaway. Targeting this problem, the thermal management method based on Ultra-Thin Vapor Chamber (UTVC) is proposed in this paper to improve the temperature uniformity and to reduce the highest temperature of batteries. According to the number of applied UTVCs, a unilateral UTVC (U-UTVC) and a bilateral UTVC(B-UTVC) cooling approach are presented, of which effectiveness is verified by a set of thermal performance experiments. The test data show that the temperature differences of the batteries with U-UTVC and B-UTVC schemes are 39.77% and 73.54% lower than traditional method in 25°C ambient temperature and 1.39C charge rate. The temperature difference on battery surface with B-UTVC scheme is about 3°C at both 25°C and 40°C ambient temperatures. © 2023, The Authors. All rights reserved.

关键词： Temperature control

Evaluation on Capillary Performance of Multifunctional Ultra-Thin Composite Wick

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SSRN 2023年

作者： Yin, Shubin Tang, Yong Zhao, Wei Li, Hongming Huang, Haoyi Ji, Wei Zhang, Shiwei Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong School of Mechanical and Automotive Engineering South China University of Technology Guangzhou510640 China South China University of Technology China

Vapor chamber (VC) based heat transfer technology effectively addresses challenges in battery thermal management owing to its superior heat transfer efficiency per unit volume. However, achieving a lightweight and ultra-thin of VC, which is significantly influenced by wicks, is crucial to ensuring its practical application. However, reducing the thickness of wick weakens its capillary, subsequently affecting the thermal performance of the VC. To address this issue, this paper presents a Multifunctional Ultra-Thin Composite Wick (MUTCW) based on sintering single layer mesh and copper base, to improve the capillary property and meanwhile reduce the thickness of wick. A series of capillary rate-of-rise experiments are conducted to evaluate the MUTCW capability comprehensively. The results show a MUTCW sintered by a layer of 0.1mm 200# mesh deliveres the best capillary performance, here 19.299 wick coefficient, 3.5mm/s average capillary velocity and 3.32mg/s average volumetric flow rate. © 2023, The Authors. All rights reserved.

关键词： Sintering

Ultra-Thin Vapor Chamber Based Heat Dissipation Technology for Lithium-Ion Battery

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SSRN 2023年

作者： Tang, Yong Zhao, Wei Li, Hongming Huang, Haoyi Yin, Shubin Ji, Wei Zhang, Shiwei Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong School of Mechanical and Automotive Engineering South China University of Technology Guangzhou510640 China South China University of Technology China

Powerful thermal management scheme is the key to realizes the extreme fast charging of battery electric vehicles. Scheme, set water-cooled plate at the bottom of battery modules, has remarkable heat dissipation ability, but increase the temperature difference between the top and bottom of the battery. The temperature difference problem is more obvious during the high-rate charge/discharge process, in particular in area of the battery tabs which usually located far away from the cooling plate, the heat is accumulated, which risks thermal runaway. Targeting this problem, the thermal management method based on Ultra-Thin Vapor Chamber (UTVC) is proposed in this paper to improve the temperature uniformity and to reduce the highest temperature of batteries. According to the number of applied UTVCs, a unilateral UTVC (U-UTVC) and a bilateral UTVC(B-UTVC) cooling approach are presented, of which effectiveness is verified by a set of thermal performance experiments. The test data show that the temperature differences of the batteries with U-UTVC and B-UTVC schemes are 39.77%and 73.54% lower than traditional method in 25°C ambient temperature and 1.39C charge rate. The temperature difference on battery surface with B-UTVC scheme is about 3°C at both 25°C and 40°C ambient temperatures. © 2023, The Authors. All rights reserved.

关键词： Temperature control

Ultra-Thin Vapor Chamber Based Heat Dissipation Technology for Lithium-Ion Battery

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SSRN 2023年

关键词： Temperature control

Effect of Forced Convection Cooling on Overload Performance of Permanent Magnet Synchronous Motor for Industrial Robot

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SSRN 2024年

作者： Yang, Fan Li, Hongming Sun, Yalong Zhang, Shiwei Liu, Hang Tang, Yong School of Mechanical and Power Engineering Zhengzhou University Zhengzhou450001 China Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong School of Mechanical and Automotive Engineering South China University of Technology Guangzhou510640 China

With the increase in power density, the heat dissipation problem becomes an important factor restricting the performance of Permanent magnet synchronous motors (PMSMs) for industrial robots. To effectively utilize the carrying capacity of electromagnetic materials, the forced convection cooling module is applied for a PMSM originally using natural cooling, focusing on the effects of improved heat dissipation capability on the output performance of PMSM. The experimental data reveals that compared with the original motor (O-M) using natural cooling, the steady winding temperature of the PMSM with forced convection module (FC-M) is reduced by 33.7 ℃ under the rated load conditions. Besides, the FC-M operates continuously under 130% rated current load conditions, which is about 18.2% higher than the 110% of O-M. In the intermittent load conditions of industrial robot applications, FC-M achieves higher equivalent output power and shorter cycle time than O-M. Furthermore, the temperature distribution of PMSM under various conditions is simulated by the finite element method. The model gets good consistency with the test results and the maximum error is within 4.7%. The results show that the application of forced convection cooling system may be an effective method in realizing high power-to-weight ratio of PMSMs for industrial robots. © 2024, The Authors. All rights reserved.

关键词： Industrial robots