The evolution of the microstructure and morphology of Cu55Ni45 and Cu60Ni40 alloys under varying degrees of undercooling was investigated through molten glass purification and cyclic superheating *** increasing the Cu...
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The evolution of the microstructure and morphology of Cu55Ni45 and Cu60Ni40 alloys under varying degrees of undercooling was investigated through molten glass purification and cyclic superheating *** increasing the Cu content,the effect of Cu on the evolution of the microstructure and morphology of the Cu-Ni alloy during undercooling was *** mechanism of grain refinement at different degrees of undercooling and the effect of Cu content on its solidification behaviour were *** solidification behaviour of Cu55Ni45 and Cu60Ni40 alloys was investigated using infrared thermometry and high-speed *** results indicate that both Cu55Ni45 and Cu60Ni40 alloy melts undergo only one recalescence during rapid *** degree of recalescence increases approximately linearly with increasing *** solidification front of the alloy melts undergoes a transition process from a small-angle plane to a sharp front and then to a smooth ***,the growth of the subcooled melt is constrained to a narrow range,facilitating the formation of a coarse dendritic crystal morphology in the Cu-Ni *** large undercooling,the stress breakdown of the directionally growing dendrites is primarily caused by thermal *** strain remaining in the dendritic fragments provides the driving force for recrystallisation of the tissue to occur,which in turn refines the tissue.
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