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Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

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SOLDERING & SURFACE MOUNT TECHNOLOGY 2023年第4期35卷 218-230页

作者： Lin, Wei Li, Xuewen Tu, Bing Zhang, Chaohua Li, Yulong Nanchang Univ Sch Adv Mfg Key Lab Robot & Welding Automation Jiangxi Prov Nanchang Peoples R China Nanchang Univ Engn Training Ctr Sch Adv Mfg Nanchang Peoples R China Nanchang Univ Chongqing Res Inst Nanchang Peoples R China Nanchang Univ Sch Adv Mfg Key Lab Robot & Welding Automation Jiangxi Prov Nanchang Peoples R China

PurposeThis study aims to analyze the wettability of the self-developed Sn-Bi-Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial reaction of Sn-Bi-Zn solder on Cu substrate. Design/methodology/approachThe wetting kinetics, diffusion phenomenon and interfacial reaction of Sn-Bi-Zn solder on Cu substrate were analyzed by experiments. The interface was observed by scanning electron microscope to study the effect of Zn content on its interface. FindingsWith the increase in brazing temperature, the final spreading equivalent radius of the solder increases significantly, and the final contact angle of the solder decreases significantly. In addition, when the Zn content is 1%, the spreading effect of solder is the best, the equivalent radius is the largest and the contact angle is the smallest. According to the microstructural analysis, the thick intermetallic compounds layer of the Sn-15Bi-xZn solders on the Cu substrate can be effectively decreased by adding appropriate Zn content. Originality/valueThe wetting kinetics, diffusion phenomenon and interfacial reaction of Sn-15Bi-xZn solder on Cu substrate at different temperatures have not been studied yet.

关键词： Lead-free solder Interfacial reaction Sn-Bi-Zn Spreading phenomena Wetting kinetics

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Vacuum wetting of Ag/TA2 to develop a novel micron porous Ti with significant biocompatibility and antibacterial activity

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Journal of Materials Science & Technology 2022年第21期116卷 180-191页

作者： Guanpeng Liu Yulong Li Ming Yan Jicai Feng Jian Cao Min Lei Quanwen Liu Xiaowu Hu Wenqin Wang Xuewen Li Key Lab for Robot and Welding Automation of Jiangxi Province Mechanical and Electrical Engineering SchoolNanchang UniversityNanchang 330031China Jiangxi Provincial Key Laboratory of Interdisciplinary Science Nanchang UniversityNanchang 330031China Department of Materials Science and Engineering and Shenzhen Key Laboratory for Additive Manufacturing of High-Performance Materials Southern University of Science and TechnologyShenzhen 518055China State Key Lab of Advanced Welding and Joining Harbin Institute of TechnologyHarbin 150001China The National Engineering Research Center for Bioengineering Drugs and the Technologies Institute of Translational MedicineNanchang UniversityNanchang 330031China The Engineering Training Center of Nanchang University Mechanical and Electrical Engineering SchoolNanchang UniversityNanchang 330031China

Porous Ti with low modulus,excellent bio-corrosion resistance,biocompatibility,and antibacterial activity is highly pursued as advanced implant *** this work,a new approach to prepare micron porous structures on the surface layer of a grade 2 commercially-pure Ti(TA2)was proposed,which utilized a simple vacuum wetting process of pure Ag on the surface of *** microstructure,corrosion resistance,biocompatibility,mechanical properties,antibacterial ability,and formation mechanism of the asfabricated porous Ti were *** results show that the pores(with average pore sizes of 0.5-5μm)are distributed on the surface layer of the TA2 with a depth of~10μ*** particular,a large number of silver nanoparticles(Ag NPs)form which are dispersed on the porous *** formation mechanisms of the porous structures and Ag NPs were elucidated,suggesting that the volatilization/sublimation of Ag in TA2 is *** porous Ti possesses excellent bio-corrosion resistance,surface wettability,biocompatibility,antibacterial activity,and a relatively low elastic modulus of 40-55 GPa,which may have a promising future in the field of orthopedic *** work also provides a novel idea for the development of advanced porous Ti materials for orthopedic-related basic research and biomedical applications.

关键词： Porous titanium Biomaterials Vacuum wetting Porous surface Antibacterial activity

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Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging

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Journal of Wuhan University of Technology(Materials Science) 2019年第5期34卷 1210-1219页

作者： BI Xiaoyang HU Xiaowu Key Lab for Robot and Welding Automation of Jiangxi Province Nanchang University

The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound(IMC) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6 Sn5. The thickness of the interfacial IMC in Sn-16 Sb/Cu is linearly against the square root of aging time, which indicates that the growth of IMC is mainly controlled by diffusion between Cu and Sn atoms. By using linear regression method, the growth rate constants of interfacial IMC layers are 1.254×10^-18, 8.821×10^-18 and 1.22×10^-17 m^2 s^-1 for Sn-16 Sb/Cu joints aged at 120, 150 and 170 ℃, respectively. Besides, the activation energy of the interfacial IMC growth was also calculated to be 68.27 kJ/mol. The IMC grain diameters after aging treatment increase with the increasing aging time, with i e, d = 0.492 t0.106, d = 0.543 t0.143 and d = 0.290 t0.263 for aging temperatures of 120, 150 and 170 ℃, respectively. Besides, by using nanoindentation, the softening of Sn-16 Sb solder was found during aging treatment. Moreover, the U-shape evolution of the values in hardness and Young’s moduli was found in this work.

关键词： lead-free solder aging treatment intermetallic compound interfacial reaction nanoindentation

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Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior

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Journal of Wuhan University of Technology(Materials Science) 2019年第3期34卷 668-675页

作者： LAI Yanqing HU Xiaowu Key Lab for Robot & Welding Automation of Jiangxi Province Mechanical & Electrical Engineering SchoolNanchang University

The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds（IMCs） layer（η-Cu6 Sn5 + e-Cu3 Sn） for various soldering time and the influence of Bi addition on the thermal behavior of Sn-x Bi solder alloys were investigated. The Cu6 Sn5 IMC could be observed as long as the molten solder contacted with the Cu substrate. However, with the longer welding time such as 60 and 300 s, the Cu3 Sn IMC was formed at the interface between Cu6 Sn5 and Cu substrate. With the increase of soldering time, the thickness of total IMCs increased, meanwhile, the grain size of Cu6 Sn5 also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs,but excessive Bi（≥ 5 wt%） inhibited the growth of Cu6 Sn5 and Cu3 Sn IMC in Sn-x Bi/Cu microelectronic interconnects. Furthermore, with the Bi contents increasing（Sn-10 Bi solder in this present investigation）, some Bi particles accumulated at the interface between Cu6 Sn5 layer and the solder.

关键词： intermetallic compound Sn-xBi solder joints interfacial reaction thermal behavior

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Improved Laser-Induced Dynamic Wetting Behavior and Spreading Mechanism of Non-Reactive Mg/Steel Systems with the Assistance of Cu Coating

SSRN

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SSRN 2023年

作者： Dou, Tianyu Wang, Ruijun Xu, Wenhu Yang, Jin Li, Haoyue Zheng, Min Jiang, Qing Jiang, Jiawei Li, Yulong Tan, Caiwang School of Materials Science and Engineering Shanghai University of Engineering Science Shanghai201620 China State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin150001 China Key Lab for Robot and Welding Automation of Jiangxi Province Mechanical and Electrical Engineering School Nanchang University Nanchang330031 China Shanghai University of Engineering Science China

A Cu coating was introduced on the steel surface by electroplating, the wetting and spreading behavior of Mg alloys on Cu coated steel substrates during the laser machining process was investigated. Wetting behavior, microstructure, diffusion kinetics, and thermodynamic calculations were conducted to comprehend the role of the Cu coating in the wetting process. The contact angle decrease first followed by an increase with the increased Cu coating thickness. Conversely, the contact radius trended towards an initial increase followed by a subsequent decrease. Facilitated movement of Mg atoms towards the steel substrate enhanced the interfacial reaction, transitioning the primary wetting mechanism from reaction control to adsorption/desorption processes. The introduction of Cu elements promoted the creation of a loosely structured Mg+Mg2Cu phase at the solid-liquid interface between Mg and steel. It significantly increased the wetting of Mg droplets on the steel surface. The results showed that the wetting behavior in this material system was synergistically governed by reactions, surface energy, and thermodynamic driving forces. These findings provided a foundational understanding for enhancing the joining of dissimilar Mg/steel materials under non-isothermal processing conditions. © 2023, The Authors. All rights reserved.

关键词： Wetting

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All-Fiber Hydrofluoric Acid Sensor Based on the Dynamic Corrosion Process of the End Face of a Fiber Tip

SSRN

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SSRN 2022年

作者： Yang, Hong Li, Yulong Lei, Min Li, Xuewen Key Lab for Robot &Welding Automation of Jiangxi Province Mechanical & Electrical Engineering School Nanchang University Nanchang China The Engineering Training Center of Nanchang University Mechanical & Electrical Engineering School Nanchang University Nanchang330031 China

An all-fiber hydrofluoric acid (HF) sensor based on the dynamic corrosion process of the end face (DCPEF) of a fiber tip is proposed in this study. The HF detection can be easily realized by inserting the fiber tip protected by a ceramic ferrule into the HF solution. Theoretically and experimentally, the feasibility of the proposed DCPEF sensor for HF detection is demonstrated. Results show that the proposed sensor can achieve the detection of HF concentration in a wide range of 0-40.00 wt.%, which is the widest detection range of HF concentration among the previous reported HF detection methods. At the HF concentration of 1.12 wt.%, the proposed sensor exhibits high sensitivity and low corresponding error of -3114 s/wt.% and 0.005 wt.%, respectively. Furthermore, the ability of remote sensing using this sensor is proved. Results show that the remote sensing system shows similar sensing characteristics as the common sensing system. Comparing with previous works, the proposed sensor has the advantages of easy fabrication, low cost, convenient operation, wide detection range, remote sensing feasibility, and etc., which has a great application prospect for HF detection. © 2022, The Authors. All rights reserved.

关键词： Optical fibers

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Microstructure and Mechanical Properties of the Al7(Cofeni)86ti7 High Entropy Alloy Coating Prepared by Electron Beam Remelting

SSRN

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SSRN 2023年

作者： Li, Yulong Tang, Bin Li, Xuewen Ouyang, Hua Wang, Wenqin Key Lab for Robot & Welding Automation of Jiangxi Province Mechanical & Electrical Engineering School Nanchang University Nanchang330031 China The Engineering Training Center of Nanchang University Mechanical & Electrical Engineering School Nanchang University Nanchang330031 China Mechanical & Electrical Engineering Shool Nanchang University Nanchang330031 China

Al7(CoFeNi)86Ti7 coating was prepared on Ti-6Al-4V (TC4) surface by electron beam cladding technology to improve the properties. Microstructure and morphology of the coating were analyzed by X-ray diffraction, scanning electron microscope (SEM) and electron back scattering diffraction (EBSD);microhardness, friction and wear properties of the coating were studied by nanoindentation, friction and wear testing machine. Results show that the microstructure of Al7(CoFeNi)86Ti7 high entropy alloy coating are composed of Co-Fe rich BCC phase and Ti-Ni-Co rich phase. Under the optimal parameters, the average hardness of the coating reaches 735 HV0.2, about 1.5 times that of the substrate (490 HV0.2);the average friction coefficients of the substrate and the coating are 0.4899 and 0.5418, respectively;the wear forms of the coating show abrasive and adhesive mixing characteristics at first, and then change to abrasive wear. © 2023, The Authors. All rights reserved.

关键词： Microstructure

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All-fiber hydrofluoric acid sensor based on the dynamic corrosion process of the end face of a fiber tip

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OPTICAL FIBER TECHNOLOGY 2022年第0期73卷

作者： Yang, Hong Li, Yulong Lei, Min Li, Xuewen Nanchang Univ Jiangxi Prov Mech & Elect Engn Sch Key Lab Robot &Welding Automation Nanchang Peoples R China Nanchang Univ Engn Training Ctr Mech & Elect Engn Sch Nanchang 330031 Peoples R China

An all-fiber hydrofluoric acid (HF) sensor based on the dynamic corrosion process of the end face (DCPEF) of a fiber tip is proposed in this study. HF detection can be easily realized by inserting the fiber tip protected by a ceramic ferrule into the HF solution. Theoretically and experimentally, the feasibility of the proposed DCPEF sensor for HF detection is demonstrated. The proposed sensor can detect HF concentration in a wide range of 0-40.00 wt%, which is the widest detection range of HF concentration among contemporary HF detection methods. At HF concentration of 1.12 wt%, the proposed sensor exhibits high sensitivity and a low corresponding measurement error of -1532 s/wt% and 0.009 wt%, respectively. Furthermore, the remote sensing capability of this sensor is proved. This remote sensing system shows similar sensing characteristics as the common sensing system. Compared with previous works, the proposed sensor has the advantages of easy fabrication, low cost, convenient operation, wide detection range, remote sensing capability, and so on;thus, it has great application prospects for HF detection.

关键词： Hydrofluoric acid sensor Optical fiber Fresnel reflection Remote sensing

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Fracture behavior and mechanical strength of sandwich structure solder joints with Cu-Ni(P) coating during thermal aging

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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 2020年第5期31卷 3876-3889页

作者： Xu, Tao Hu, Xiaowu Li, Jiayin Li, Qinglin Nanchang Univ Sch Mech & Elect Engn Key Lab Robot & Welding Automation Jiangxi Prov Nanchang 330031 Peoples R China Lanzhou Univ Technol State Key Lab Adv Proc & Recycling Nonferrous Met Lanzhou 730050 Peoples R China

Coating at the interface of solder joint has a great impact on the growth behavior of intermetallic compounds (IMCs) and the mechanical properties. In this study, the sandwich structure samples of Cu/Sn3.0Ag0.5Cu/Cu solder joints with coatings of Ni(P) monolayer and dual Cu-Ni(P) layers on Cu substrate were designed to conduct the shear test. The mechanical strength, fracture modes, and fractographic morphologies of Sn3.0Ag0.5Cu/Cu, Sn3.0Ag0.5Cu/Ni(P)-Cu, and Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints reflowed at 280 degrees C for 10 min and then aged at 150 degrees C for up to 360 h were investigated. Experimental results show that the mechanical strength of Sn3.0Ag0.5Cu/Cu solder joints firstly increased because of the pinning effect of IMC, and then decreased due to the brittleness of excessive growth of IMC during solid-state aging processes. The Sn3.0Ag0.5Cu/Cu solder joints presented ductile fracture, mixed fracture, and brittle fracture modes during shear testing processes. The shear strength of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints decreased to about 17 MPa after 120 h thermal aging. At the same time, the shear failure mode of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints changed from the ductile dominant fracture to the brittle dominant fracture. The shear strength of Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints remained approximate 21 MPa and the fractured position always occurred inside the IMC layer regardless of aging time.

关键词： Thermal aging

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Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

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Acta Metallurgica Sinica(English Letters) 2019年第5期32卷 629-637页

作者： Shuang Li Xiao-Wu Hu Wei-Guo Zhang Yu-Long Li Xiong-Xin Jiang Key Lab for Robot and Welding Automation of Jiangxi Province Mechanical and Electrical Engineering SchoolNanchang University College of Mechanical and Electronic Engineering Northwest A&F University

In order to study the in?uence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0 Ag-0.5 Cu/Cu system, two kinds of experiments were designed, including:(1) solid-state aging between the solder and Cu substrate;(2)liquid-state aging between the metastable supercooled liquid-state solder and Cu substrate. The aging times were 30, 60,120 and 180 min, respectively, and the aging temperature was 8 ℃ lower than the melting point of the Sn-3.0 Ag-0.5 Cu(SAC305) alloy(217 ℃). The experimental data revealed that the physical state of the solder obviously affected the formation of the intermetallic compound(IMC), and resulted in the difference in the diffusion of atoms on the interface between the SAC305 solder and Cu substrate. The IMC interface after aging for 30 min presents unique characteristics compared with that of the sample after dip soldering. The IMC interface of solid-state aged SAC305/Cu couple is relatively planar, while the IMC interface under metastable supercooled liquid-state aging conditions presents scallop-like shape.

关键词： Lead-free solder Supercooling Metastable liquid state Aging Intermetallic compound

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