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Simulations for A Novel Fluid Dispensing Technology Based on Gas-liquid Slug Flow

Simulations for A Novel Fluid Dispensing Technology Based on...

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Peng Peng Jianhua Zhang Jinsong Zhang Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University China School of Mechatronics Engineering and Automation Shanghai University China Yanchang Road 149 Shanghai City China

The fluid dispensing is one of the key technologies in electronic packing. A novel approach of non-contact fluid dispensing has been proposed based on the principle of gasliquid two-phase flow. In view of gas-liquid two-phase dynamics, the flow pattern of slug flow can be obtained stably in the microchannel as the flow rate ratio between the gas and liquid is in an appropriate range. The slug flow can generate fluid droplets and gas bubbles and spray them out of the nozzle with uniform interval, accurate volume, good consistency, high controllability and no back haul. This paper carried out the numerical simulation to investigate the gasliquid two-phase flow in the microchannel for the adhesive dispensing. A 2-D model of microchannel with a diameter for 0.04 mm was established and meshed. The gas-liquid slug flow emerges after iterating over 1 million steps with the gas flow rate for 0.1 m/s, the water flow rate for 0.05 m/s. The wetting property controlled by the contact angle had been discussed to present different liquid materials application. The poor wetting of liquid benefited for conforming droplets shape and avoiding droplets crashing and back haul. While the gas flow rate decreased, the length of liquid droplet and gas bubble increased and decreased, respectively and the total numbers of bubble and droplet decreased in one period. This indicated the fluid parameters have a high relationship with the quantity and volume of droplet.

关键词： Microchannel Fluids Numerical models Mathematical model Shape Equations

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Comparisons of Nano-Additives Influence on Properties of the Bi-Modal Solder Pastes for Special applications

Comparisons of Nano-Additives Influence on Properties of the...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Janusz Sitek Krystyna Bukat Marek Koscielski Aneta Arazna A.Mlozniak Malgorzata Jakubowska Shiwei Ma Yan Zhang Johan Liu Qijie Zha Yulai Ga Tele and Radio Research Institute 03-450 Warsaw 11 Ratuszowa St. Poland Institute of Electronic Materials 133 Wolczynska Str. 01-919 Warsaw Poland Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch School of Materials Science and Engineering Shanghai University Shanghai 200072 China

The paper presented the results of investigation of two solder pastes SnBi and SAC with different nano-particles, which could be applied for special application. It was presented that materials and samples preparation for investigation. The results of SEM analyzer of solder joints executed using these pastes and their shear strength measurements enable to make the comparison of nano-additives influence on properties of the bi-modal solders pastes. It was observed that addition of nano-particles into both solder pastes changed the microstructure of solder joints, and formed a large number of nano-sized grains with uniform distribution. For the SAC solder joints with nano-Ag particles it was also observed that specific Ag3Sn crystallites. We supposed that the Ag3Sn crystals, which created “internal net” and nano-sized grains with uniform distribution must influence the mechanical properties of the solder joints. The results of shear strength measurements of solder joints confirmed the significantly higher shear strength of bimodal solder joints in comparison to reference solder joints without nano-additives.

关键词： Soldering Lead Microstructure Materials Packaging Nanoparticles

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IGZO-TFT Driven AM-OLED displays

IGZO-TFT Driven AM-OLED Displays

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第七届全国暨华人有机分子和聚合物发光与光电特性学术会议

作者： Jun Li Liang Zhang Fan Zhou Jia-Hua Zhang Hua-Ping Lin Xue-Yin Jiang Zhi-Lin Zhang Department of Materials Science Shanghai University Jiading Shanghai 201800 People''s Republic of China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 People ''s Republic of China Department of Materials Science Shanghai University Jiading Shanghai 201800 People''s Republic of China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 People ''s Republic of China

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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Study on the adhesion strength of new nano-structured polyme...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Lei Zhang Xiuzhen Lu Xin Luo Björn Carlberg Masoud Zandira Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden

With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.

关键词： Materials Electronic packaging thermal management Thermal resistance Metals Heating Reliability Thermal conductivity

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New Permeation Rate Measurement for Thin Film Encapsulation of Organic Light Emitting Diodes

New Permeation Rate Measurement for Thin Film Encapsulation ...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Hao zhang Jianhua Zhang Bin Wei Minyan Zhang Li Long Renzheng Sang Tao Feng School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai Universi School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 The Linde Group Carl-von-Linde-Strasse 2585716 Unterchleissheim Germany

We have developed a new method to measure the water vapor transmission ratio (WVTR) for thin film encapsulation (TFE) of organic light emitting diodes (OLEDs). It is a nondestructive method to measure WVTR by investigating the change of photoluminescent spectra of organic material. This method can be realized easily by online test. By calibrating the evolution curve (the photoluminescent intensity versus time), we have figured out the relative water transmission which was responded by organic materials. The WVTR of TFE devices is estimated to be about 2.0×10-2gm-2day-1 in a controlled environment of 85% relative humidity (RH) at 38℃. Novel thin film encapsulation devices have also been presented.

关键词： Organic light emitting diodes Encapsulation Films Organic materials Chemical vapor deposition Substrates Equations

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The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

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ECS Transactions 2011年第1期34卷

作者： Qiong Fan Huiwang Cui Chune Fu Dongsheng Li Xin Tang Zhichao Yuan Lilei Ye Johan Liu Ministry of Education and SMIT Center Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University No.149 Yanchang Road Shanghai Shanghai 200072 China Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Shanghai University SHT Smart High Tech AB Shanghai University SE-412 96 Gothenburg Gothenburg 41296 Sweden

This research used low molecular surface modifiers, and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Several different functionalizers, such as thioglycolic acid, silane and di-acid, were used to functionalize the silver surface. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. The adipic acid had the greatest effect on the rheological and electrical property of ICAs, so its weight percentage in silver flakes was also optimized; ICAs displayed the maximum electrical conductivity when there was 0.5 wt% of silver flakes.

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Numerical Investigation on the Thermal Properties of the Micro-cooler

Numerical Investigation on the Thermal Properties of the Mic...

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Shun Wang Yangming Liu Yan Zhang Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch

The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the present paper, micro-pin-fin heat sink with gas impinging jet as the cooling medium is analyzed. The heat dissipation of forced air convection cooling with micro-pin-fin structures made of aligned carbon nanotube arrays has been taken into consideration. The three-dimensional computational fluid dynamics (CFD) simulation was carried out. The temperature distribution and the pressure drop are studied in the cases of various geometrical parameters of the micro-pin-fin heat sinks at the same heating power prescribed. The fluid flow and the heat transfer phenomena in the micro-pin-fins heat sinks are investigated. The heat removal efficiency of the air micro-cooler is evaluated. An array of 8×8 fins with the optimized fin-to-base length ratio achieves the best cooling effect.

关键词： Heat sinks Heat transfer Space heating Temperature distribution Mathematical model Carbon nanotubes

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Hydrogen passivation for the performance enhancement of poly-Si crystallized by double-frequency YAG laser

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Optoelectronics Letters 2010年第4期6卷 288-290页

作者：李娟丁思维姚颖罗翀孟志国吴春亚熊绍珍张志林郭海诚 Tianjin Key Laboratory of Photo-electronic Thin Film Devices and Technology Key Laboratory of Opto-electronic Information Science and Technology(Nankai University and Tianjin University) Ministry of Education Institute of Photo-electronics Nankai University Key Laboratory of Advanced Display and System Applications Ministry of EducationShanghai University Department of Electronic and Computer Engineering The Hong Kong University of Science and Technology

The hydrogen passivation is adopted to enhance the performance of poly-Si crystallized by YAG laser annealing(LA polySi).The effects of passivation time,passivation power and passivation temperature on the hall mobility of the LA poly-Si are investigated and the mechanism of the hydrogen passivation is preliminarily *** is found that the effect of the hydrogen passivation on the qulity of YAG laser annealed poly-Si is also correlated with the deposition method and the defect type in it.

关键词： YAG激光器性能增强氢钝化结晶双频率聚硅激光退火多晶硅

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Single-channel blind separation of JPEG permuted image using double compression

Single-channel blind separation of JPEG permuted image using...

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2010 International Conference on Audio, Language and Image Processing, ICALIP 2010

作者： Wang, Wei Fang, Yong School of Communication and Information Engineering Key Laboratory of Specialty Fiber Optics and Optical Access Networks Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education 200072 China

ISBN: (纸本)9781424458653

A novel blind separation algorithm based on double compression for single-channel JPEG permuted image was proposed in this paper. Firstly, the permuted image was compressed again, and then the primary compression factors were estimated by calculating the correlation coefficients of image blocks in pre and post recompression. Secondly, a 'mapping space' was constructed based on the primary compression factors estimated, according to different classification parameters in the mapping space, the activation region could be accurately detected and the permutation mixing matrixes were estimated. Lastly, the source image blocks could be completely recovered using permutation mixing matrix estimated. Simulation results show a high detection accuracy on the permuted image with uncompressed and without noised. Furthermore, the robustness against Gaussian noise and lossy JPEG compression of the algorithm were analyzed in this paper. ©2010 IEEE.

关键词： Mapping

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The design and realization of CAN bit timing logic

The design and realization of CAN bit timing logic

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2nd Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics, PrimeAsia 2010

作者： Jinyan, Guo Yueli, Hu Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China College of Mechanical and Electronic Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China

ISBN: (纸本)9781424467372

In the CAN bus, mistakes in bit timing will lead to serious decline in bus performance. How to deal with the bit timing of CAN bus communication decided whether the CAN controller can receive or transmit data correctly. According to bus protocol, bit synchronization will fix bit errors resulting from improper setting in many cases. This paper illustrated the structure of nominal bit time and the principle of bit synchronization, gave an optimized method of nominal bit time of CAN2.0 protocol, that the four non-overlapping segments of traditional nominal bit time is simplified to 3 non-overlapping segments, and on this basis, proposed a design method of bit timing processor of CAN bus based on the synchronized state machine. It also provides programmable time segments to compensate for the propagation delay times and phase shifts, and gave simulation and verification of the design. The results show that the design work which obeys the CAN2.0 protocol, can more easily deal with the CAN bus communication bit timing, realized the control of CAN bus protocol on the bit timing and bit synchronization, and better optimizes the CAN network.

关键词： Synchronization

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