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International Conference on ASIC

作者： Zheng Xie Xin'an Wang Zhibin Lian Qiuping Li Shanshan Yong Key Lab of Integrated Micro System Science Engineering and Application Shenzhen Graduate School of Peking University Shenzhen China Be One Lab Inc. Toronto Ontario Canada

Confronted with ever increasing design complexity, modeling system architectures for early performance evaluation and fast exploration of the design space will be a necessary process. Meanwhile, function verification has been a bottleneck for time to market. The sharing of the two processes will greatly enhance the efficiency of system development. This paper presents a universal framework of dual-use model for both performance and functionality based on the abstract state machine, to reuse the performance model in building reference model to reduce the cycle of verification. The application Program Interface (API) function library based on Universal Verification Methodology (UVM), corresponding to the dual-use model, is provided simultaneously. Associated with the function library, the abstract state machine is recorded by the state machine component in Verification Expert system (VES) toolbox to generate specific code automatically.

关键词： Abstract State Machine VES UVM

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A 350 C piezoresistive n-type 4H-SiC pressure sensor for hydraulic and pneumatic pressure tests

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Journal of micromechanics and microengineering 2020年第5期30卷

作者： Fang, Xudong Wu, Chen Zhao, Yulong Jiang, Zhuangde Rong, Weibing Feng, Zhihong Lv, Yuanjie State Key Laboratory for Manufacturing Systems Engineering International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies Collaborative Innovation Center of Suzhou Nano Science and Technology Xi'an Jiaotong University Xi'an710049 China School of Mechanical Engineering Xi'an Jiaotong University Xi'an710049 China State Key Laboratory of Robotics and System Harbin Institute of Technology Harbin150080 China National Key Laboratory of Application Specific Integrated Circuit Hebei Semiconductor Research Institute Shijiazhuang050051 China

It has been a challenge to develop pressure sensors that can work in harsh environments. In this work, a piezoresistive n-type 4H-SiC pressure sensor is demonstrated, capable of working at 350 C under hydraulic and pneumatic pressure. The pressure measuring range of this sensor is 7 MPa and the chip dimension is 2.5 mm 2.5 mm 0.23 mm. A reliable Ti/TaSi2/Pt metal ohmic contact is used in the sensor and experimental results show that the metal combination can withstand a wide temperature range of 30 C-350 C. In order to avoid thermal stress induced by the mismatch of thermal expansion coefficients of different packaging materials when increasing temperature, a double-layer bonding scheme of cement glue and epoxy is proposed. The inner layer of the chip and the kovar alloy base are directly bonded with the epoxy, while the outer layer is wrapped with the high-temperature cement glue. Experiments confirm that this method can achieve reliable packaging with temperatures up to 350 C for 5 h. Based on the above key technologies, the sensitivity of this sensor can reach 13.2 mV V-1 kPa-1 and the test data exhibit high linearity and repeatability. Static tests prove that the sensor has good media compatibility which can operate under a hydraulic pressure load at 220 C and a barometric pressure load under 350 C. The sensor in this work can provide a reference for pressure measurements at high temperature and in complex media environments. © 2020 IOP Publishing Ltd.

关键词： Pressure sensors

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New parameter-free mobility model: Opportunity priority selection model

arXiv

引用

arXiv 2018年

作者： Liu, Erjian Yan, Xiao-Yong Key Lab. of Integrated Transportation Big Data Application Technology for Transportation Industry Beijing Jiaotong University Beijing100044 China Institute of Transportation System Science and Engineering Beijing Jiaotong University Beijing100044 China Big Data Research Center University of Electronic Science and Technology of China Chengdu611731 China

Predicting human mobility patterns has many practical applications in urban planning, traffic engineering, infectious disease epidemiology, emergency management and location-based services. Developing a universal model capable of accurately predicting the mobility fluxes between locations is a fundamental and challenging problem in regional economics and transportation science. Here, we propose a new parameter-free model named opportunity priority selection model as an alternative in human mobility prediction. The basic assumption of the model is that an individual will select destination locations that present higher opportunity benefits than the location opportunities of the origin and the intervening opportunities between the origin and destination. We use real mobility data collected from a number of cities and countries to demonstrate the predictive ability of this simple model. The results show that the new model offers universal predictions of intracity and intercity mobility patterns that are consistent with real observations, thus suggesting that the proposed model better captures the mechanism underlying human mobility than previous models. Copyright © 2018, The Authors. All rights reserved.

关键词： Forecasting

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Two-dimensional materials for future information technology: status and prospects

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science China(Information sciences) 2024年第6期67卷 1-147页

作者： Hao QIU Zhihao YU Tiange ZHAO Qi ZHANG Mingsheng XU Peifeng LI Taotao LI Wenzhong BAO Yang CHAI Shula CHEN Yiqi CHEN Hui-Ming CHENG Daoxin DAI Zengfeng DI Zhuo DONG Xidong DUAN Yuhan FENG Yu FU Jingshu GUO Pengwen GUO Yue HAO Jun HE Xiao HE Jingyi HU Weida HU Zehua HU Xinyue HUANG Ziyang HUANG Ali IMRAN Ziqiang KONG Jia LI Qian LI Weisheng LI Lei LIAO Bilu LIU Can LIU Chunsen LIU Guanyu LIU Kaihui LIU Liwei LIU Sheng LIU Yuan LIU Donglin LU Likuan MA Feng MIAO Zhenhua NI Jing NING Anlian PAN Tian-Ling REN Haowen SHU Litao SUN Yue SUN Quanyang TAO Zi-Ao TIAN Dong WANG Hao WANG Haomin WANG Jialong WANG Junyong WANG Wenhui WANG Xingjun WANG Yeliang WANG Yuwei WANG Zhenyu WANG Yao WE... Department of Applied Physics The Hong Kong Polytechnic University Key Laboratory for Micro-Nano Physics and Technology of Hunan Province College of Materials Science and EngineeringHunan University College of Integrated Circuits Zhejiang University Shenzhen Geim Graphene Center Shenzhen Key Laboratory of Layered Materials for Value-Added ApplicationsTsinghua-Berkeley Shenzhen Institute & Institute of Materials ResearchTsinghua Shenzhen International Graduate SchoolTsinghua University State Key Laboratory of Extreme Photonics and Instrumentation College of Optical Science and EngineeringInternational Research Center for Advanced PhotonicsZijingang CampusZhejiang University National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Microsystem and Information TechnologyChinese Academy of Sciences CAS Key Laboratory of Nanophotonic Materials and Devices & Key Laboratory of Nanodevices and Applications i-LabSuzhou Institute of Nano-Tech and Nano-Bionics (SINANO)Chinese Academy of Sciences College of Chemistry and Chemical Engineering Hunan University Key Laboratory of Quantum State Construction and Manipulation (Ministry of Education) Department of PhysicsRenmin University of China School of Integrated Circuits Beijing National Research Center for Information Science and Technology (BNRist)Tsinghua University School of Electronic Science and Engineering Nanjing University The State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology Shaanxi Joint Key Laboratory of GrapheneSchool of MicroelectronicsXidian University Key Laboratory of Artificial Micro- and Nano-Structures of Ministry of Education School of Physics and TechnologyWuhan University School of Integrated Circuits Huazhong University of Science and Technology Center for Nanochemistry (CNC) Beijing Science and Engineering Center for NanocarbonsBeijing National Laboratory for Molecular SciencesCollege of Chemistry and Molecular EngineeringPeking University State Key Laboratory for Artificial Microstruct

Over the past 70 years, the semiconductor industry has undergone transformative changes,largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional(2D) materials like transition metal dichalcogenides(TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3D integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research.

关键词： two-dimensional (2D) materials information technology production technology standardization of characterization microelectronic devices optoelectronic devices multi-functional integration

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Technology Roadmap for Flexible Sensors

引用

ACS NANO 2023年第6期17卷 5211-5295页

作者： Luo, Yifei Abidian, Mohammad Reza Ahn, Jong-Hyun Akinwande, Deji Andrews, Anne M. Antonietti, Markus Bao, Zhenan Berggren, Magnus Berkey, Christopher A. Bettinger, Christopher John Chen, Jun Chen, Peng Cheng, Wenlong Cheng, Xu Choi, Seon-Jin Chortos, Alex Dagdeviren, Canan Dauskardt, Reinhold H. Di, Chong-an Dickey, Michael D. Duan, Xiangfeng Facchetti, Antonio Fan, Zhiyong Fang, Yin Feng, Jianyou Feng, Xue Gao, Huajian Gao, Wei Gong, Xiwen Guo, Chuan Fei Guo, Xiaojun Hartel, Martin C. He, Zihan Ho, John S. Hu, Youfan Huang, Qiyao Huang, Yu Huo, Fengwei Hussain, Muhammad M. Javey, Ali Jeong, Unyong Jiang, Chen Jiang, Xingyu Kang, Jiheong Karnaushenko, Daniil Khademhosseini, Ali Kim, Dae-Hyeong Kim, Il-Doo Kireev, Dmitry Kong, Lingxuan Lee, Chengkuo Lee, Nae-Eung Lee, Pooi See Lee, Tae-Woo Li, Fengyu Li, Jinxing Liang, Cuiyuan Lim, Chwee Teck Lin, Yuanjing Lipomi, Darren J. Liu, Jia Liu, Kai Liu, Nan Liu, Ren Liu, Yuxin Liu, Yuxuan Liu, Zhiyuan Liu, Zhuangjian Loh, Xian Jun Lu, Nanshu Lv, Zhisheng Magdassi, Shlomo Malliaras, George G. Matsuhisa, Naoji Nathan, Arokia Niu, Simiao Pan, Jieming Pang, Changhyun Pei, Qibing Peng, Huisheng Qi, Dianpeng Ren, Huaying Rogers, John A. Rowe, Aaron Schmidt, Oliver G. Sekitani, Tsuyoshi Seo, Dae-Gyo Shen, Guozhen Sheng, Xing Shi, Qiongfeng Someya, Takao Song, Yanlin Stavrinidou, Eleni Su, Meng Sun, Xuemei Takei, Kuniharu Tao, Xiao-Ming Tee, Benjamin C. K. Thean, Aaron Voon-Yew Trung, Tran Quang Wan, Changjin Wang, Huiliang Wang, Joseph Wang, Ming Wang, Sihong Wang, Ting Wang, Zhong Lin Weiss, Paul S. Wen, Hanqi Xu, Sheng Xu, Tailin Yan, Hongping Yan, Xuzhou Yang, Hui Yang, Le Yang, Shuaijian Yin, Lan Yu, Cunjiang Yu, Guihua Yu, Jing Yu, Shu-Hong Yu, Xinge Zamburg, Evgeny Zhang, Haixia Zhang, Xiangyu Zhang, Xiaosheng Zhang, Xueji Zhang, Yihui Zhang, Yu Zhao, Siyuan Zhao, Xuanhe Zheng, Yuanjin Zheng, Yu-Qing Zheng, Zijian Zhou, Tao Zhu, Bowen Zhu, Ming Zhu, Rong Zhu, Yangzhi Zhu, Yong Zou, Guijin Chen, Xiaodong 08-03 Innovis Singapore 138634 Republic of Singapore Innovative Centre for Flexible Devices (iFLEX) School of Materials Science and Engineering Nanyang Technological University Singapore 639798 Singapore Department of Biomedical Engineering University of Houston Houston Texas 77024 United States School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea Department of Electrical and Computer Engineering The University of Texas at Austin Austin Texas 78712 United States Microelectronics Research Center The University of Texas at Austin Austin Texas 78758 United States Department of Chemistry and Biochemistry California NanoSystems Institute and Department of Psychiatry and Biobehavioral Sciences Semel Institute for Neuroscience and Human Behavior and Hatos Center for Neuropharmacology University of California Los Angeles Los Angeles California 90095 United States Colloid Chemistry Department Max Planck Institute of Colloids and Interfaces 14476 Potsdam Germany Department of Chemical Engineering Stanford University Stanford California 94305 United States Laboratory of Organic Electronics Department of Science and Technology Campus Norrköping Linköping University 83 Linköping Sweden Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC) SE-100 44 Stockholm Sweden Department of Materials Science and Engineering Stanford University Stanford California 94301 United States Department of Biomedical Engineering and Department of Materials Science and Engineering Carnegie Mellon University Pittsburgh Pennsylvania 15213 United States Department of Bioengineering University of California Los Angeles Los Angeles California 90095 United States School of Chemistry Chemical Engineering and Biotechnology Nanyang Technological University Singapore 637457 Singapore Nanobionics Group Department of Chemical and Biological Engineering Monash University Clayton Australia 3800 Monash

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze continued...challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative

关键词： soft materials mechanics engineering flexible electronics conformable sensors bioelectronics human-machine interfaces body area sensor networks technology translation sustainable electronics

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Are We Building on the Rock? On the Importance of Data Preprocessing for Code Summarization

arXiv

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arXiv 2022年

作者： Shi, Lin Mu, Fangwen Chen, Xiao Wang, Song Wang, Junjie Yang, Ye Li, Ge Xia, Xin Wang, Qing Institute of Software Chinese Academy of Sciences Beijing China Lassonde School of Engineering York University Toronto Canada School of Systems and Enterprises Stevens Institute of Technology HobokenNJ United States Key Lab of High Confidence Software Technology Peking University Beijing China Software Engineering Application Technology Lab Huawei China Laboratory for Internet Software Technologies Institute of Software CAS China University of Chinese Academy of Sciences China Science & Technology on Integrated Information System Laboratory Institute of Software CAS China

Code summarization, the task of generating useful comments given the code, has long been of interest. Most of the existing code summarization models are trained and validated on widely-used code comment benchmark datasets. However, little is known about the quality of the benchmark datasets built from real-world projects. Are the benchmark datasets as good as expected? To bridge the gap, we conduct a systematic research to assess and improve the quality of four benchmark datasets widely used for code summarization tasks. First, we propose an automated code-comment cleaning tool that can accurately detect noisy data caused by inappropriate data preprocessing operations from existing benchmark datasets. Then, we apply the tool to further assess the data quality of the four benchmark datasets, based on the detected noises. Finally, we conduct comparative experiments to investigate the impact of noisy data on the performance of code summarization models. The results show that these data preprocessing noises widely exist in all four benchmark datasets, and removing these noisy data leads to a significant improvement on the performance of code summarization. We believe that the findings and insights will enable a better understanding of data quality in code summarization tasks, and pave the way for relevant research and practice. Copyright © 2022, The Authors. All rights reserved.

关键词： Benchmarking

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Recent Advances in Triboelectric Nanogenerators: From Technological Progress to Commercial applications

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ACS Nano 2023年第12期17卷 11087-11219页

作者： Choi, Dongwhi Lee, Younghoon Lin, Zong-Hong Cho, Sumin Kim, Miso Ao, Chi Kit Soh, Siowling Sohn, Changwan Jeong, Chang Kyu Lee, Jeongwan Lee, Minbaek Lee, Seungah Ryu, Jungho Parashar, Parag Cho, Yujang Ahn, Jaewan Kim, Il-Doo Jiang, Feng Lee, Pooi See Khandelwal, Gaurav Kim, Sang-Jae Kim, Hyun Soo Song, Hyun-Cheol Kim, Minje Nah, Junghyo Kim, Wook Menge, Habtamu Gebeyehu Park, Yong Tae Xu, Wei Hao, Jianhua Park, Hyosik Lee, Ju-Hyuck Lee, Dong-Min Kim, Sang-Woo Park, Ji Young Zhang, Haixia Zi, Yunlong Guo, Ru Cheng, Jia Yang, Ze Xie, Yannan Lee, Sangmin Chung, Jihoon Oh, Il-Kwon Kim, Ji-Seok Cheng, Tinghai Gao, Qi Cheng, Gang Gu, Guangqin Shim, Minseob Jung, Jeehoon Yun, Changwoo Zhang, Chi Liu, Guoxu Chen, Yufeng Kim, Suhan Chen, Xiangyu Hu, Jun Pu, Xiong Guo, Zi Hao Wang, Xudong Chen, Jun Xiao, Xiao Xie, Xing Jarin, Mourin Zhang, Hulin Lai, Ying-Chih He, Tianyiyi Kim, Hakjeong Park, Inkyu Ahn, Junseong Huynh, Nghia Dinh Yang, Ya Wang, Zhong Lin Baik, Jeong Min Choi, Dukhyun Kyung Hee University Gyeonggi Yongin17104 Korea Republic of Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 77 Massachusetts Avenue CambridgeMA02139 United States Department of Mechanical Engineering Soft Robotics Research Center Seoul National University Seoul08826 Korea Republic of Department of Mechanical Engineering Gachon University Seongnam13120 Korea Republic of Department of Biomedical Engineering National Taiwan University Taipei10617 Taiwan Frontier Research Center on Fundamental and Applied Sciences of Matters National Tsing Hua University Hsinchu30013 Taiwan School of Advanced Materials Science & Engineering Sungkyunkwan University Suwon16419 Korea Republic of Sungkyunkwan University 2066 Seobu-ro Gyeonggi Suwon16419 Korea Republic of Department of Chemical and Biomolecular Engineering National University of Singapore 4 Engineering Drive 4 117585 Singapore Division of Advanced Materials Engineering Jeonbuk National University 567 Baekje-daero Jeonbuk Jeonju54896 Korea Republic of Jeonbuk National University 567 Baekje-daero Jeonbuk Jeonju54896 Korea Republic of Department of Physics Inha University 100 Inha-ro Incheon22212 Korea Republic of School of Materials Science & Engineering Yeungnam University Gyeongbuk Gyeongsan38541 Korea Republic of 291 Daehak-ro Daejeon34141 Korea Republic of School of Materials Science and Engineering Nanyang Technological University 50 Nanyang Avenue 639798 Singapore Institute of Flexible Electronics Technology of Tsinghua Zhejiang Jiaxing314000 China Nanomaterials and System Lab Major of Mechatronics Engineering Faculty of Applied Energy System Jeju National University Jeju632-43 Korea Republic of School of Engineering University of Glasgow GlasgowG128QQ United Kingdom Seoul02792 Korea Republic of Department of Physics Inha University Incheon22212 Korea Republic of Suwon16419 Korea Republic of Department of

Serious climate changes and energy-related environmental problems are currently critical issues in the world. In order to reduce carbon emissions and save our environment, renewable energy harvesting technologies will serve as a key solution in the near future. Among them, triboelectric nanogenerators (TENGs), which is one of the most promising mechanical energy harvesters by means of contact electrification phenomenon, are explosively developing due to abundant wasting mechanical energy sources and a number of superior advantages in a wide availability and selection of materials, relatively simple device configurations, and low-cost processing. Significant experimental and theoretical efforts have been achieved toward understanding fundamental behaviors and a wide range of demonstrations since its report in 2012. As a result, considerable technological advancement has been exhibited and it advances the timeline of achievement in the proposed roadmap. Now, the technology has reached the stage of prototype development with verification of performance beyond the lab scale environment toward its commercialization. In this review, distinguished authors in the world worked together to summarize the state of the art in theory, materials, devices, systems, circuits, and applications in TENG fields. The great research achievements of researchers in this field around the world over the past decade are expected to play a major role in coming to fruition of unexpectedly accelerated technological advances over the next decade. © 2023 The Authors. Published by American Chemical Society

关键词： Nanogenerators

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Room-temperature waveguide integrated quantum register in a semiconductor photonic platform

arXiv

引用

arXiv 2023年

作者： Hu, Haibo Zhou, Yu Yi, Ailun Bao, Tongyuan Liu, Chengying Luo, Qi Zhang, Yao Wang, Zi Li, Qiang Lu, Dawei Liu, Zhengtong Xiao, Shumin Ou, Xin Song, Qinghai Ministry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System Guangdong Provincial Key Laboratory of Semiconductor Optoelectronic Materials and Intelligent Photonic Systems Harbin Institute of Technology Shenzhen518055 China Pengcheng Laboratory Shenzhen518055 China Shenzhen518045 China National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai200050 China The Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing100049 China Institute of Advanced Semiconductors Zhejiang Provincial Key Laboratory of Power Semiconductor Materials and Devices ZJU-Hangzhou Global Scientific and Technological Innovation Center Zhejiang Hangzhou311200 China State Key Laboratory of Silicon Materials and Advanced Semiconductors School of Materials Science and Engineering Zhejiang University Hangzhou310027 China Shenzhen Institute for Quantum Science and Engineering Department of Physics Southern University of Science and Technology Shenzhen518055 China Collaborative Innovation Center of Extreme Optics Shanxi University Shanxi Taiyuan030006 China

Quantum photonic integrated circuits are reshaping quantum networks and sensing by providing compact, efficient platforms for practical quantum applications. Despite continuous breakthroughs, integrating entangled registers into photonic devices on a CMOS-compatible platform presents significant challenges. Herein, we present single electron-nuclear spin entanglement and its integration into a silicon-carbide-on-insulator (SiCOI) waveguide. We demonstrate the successful generation of single divacancy electron spins and near-unity spin initialization of single 13C nuclear spins. Both single nuclear and electron spin can be coherently controlled and a maximally entangled state with a fidelity of 0.89 has been prepared under ambient conditions. Based on the nanoscale positioning techniques, the entangled quantum register has been further integrated into SiC photonic waveguides for the first time. We find that the intrinsic optical and spin characteristics of the register are well preserved and the fidelity of the entangled state remains as high as 0.88. Our findings highlight the promising prospects of the SiCOI platform as a compelling candidate for future scalable quantum photonic applications. Copyright © 2023, The Authors. All rights reserved.

关键词： Silicon on insulator technology

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基于有限状态机控制的低功耗广播式测试压缩结构

基于有限状态机控制的低功耗广播式测试压缩结构

引用

第七届中国测试学术会议

作者： Feng Xiangchen 冯祥晨 Feng Jianhua 冯建华 Cui Xiaole 崔小乐 Department of Microelectronics Peking University Beijing 100871 Key Lab of Integrated Micro Syste 北京大学微电子学系北京100871 北京大学深圳研究生院集成微系统科学工程与应用重点实验室深圳518055 Key Lab of Integrated Micro System Science Engineering and Application Shenzhen Graduate School of 北京大学深圳研究生院集成微系统科学工程与应用重点实验室深圳518055

测试压缩下的功耗问题已经成为近期研究的热点。本文提出了一种新的低功耗广播式测试压缩结构,通过有限状态机控制一半的内部扫描链在扫描过程中接收持续的常数0,另一半的内部扫描链接收来自扫描通道的测试激励,实现了广播式压缩环境下... 详细信息

测试压缩下的功耗问题已经成为近期研究的热点。本文提出了一种新的低功耗广播式测试压缩结构,通过有限状态机控制一半的内部扫描链在扫描过程中接收持续的常数0,另一半的内部扫描链接收来自扫描通道的测试激励,实现了广播式压缩环境下对内部扫描链选通的自动动态控制。为了提高故障覆盖率,在低功耗广播扫描模式之后增加了串行扫描模式。实验结果表明扫描移位功耗和捕获功耗可降低50％-60％,故障覆盖率可达到无损,不需要对电路结构做大的修改,更适用于大规模的工业电路。

关键词：电路测试低功耗测试扫描模式有限状态机

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