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The Effect of Functionalized Silver on Properties of Conductive Adhesives

The Effect of Functionalized Silver on Properties of Conduct...

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Dongsheng Li Qiong Fan Huiwang Cui Johan Liu Zhili Hu Zhichao Yuan Lilei Ye Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building S SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

关键词： Silver Conductivity Viscosity Conductive adhesives Curing Resins Dispersion

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Simulations for A Novel Fluid Dispensing Technology Based on Gas-liquid Slug Flow

Simulations for A Novel Fluid Dispensing Technology Based on...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Peng Peng Jianhua Zhang Jinsong Zhang Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University China School of Mechatronics Engineering and Automation Shanghai University China Yanchang Road 149 Shanghai City China

The fluid dispensing is one of the key technologies in electronic packing. A novel approach of non-contact fluid dispensing has been proposed based on the principle of gasliquid two-phase flow. In view of gas-liquid two-phase dynamics, the flow pattern of slug flow can be obtained stably in the microchannel as the flow rate ratio between the gas and liquid is in an appropriate range. The slug flow can generate fluid droplets and gas bubbles and spray them out of the nozzle with uniform interval, accurate volume, good consistency, high controllability and no back haul. This paper carried out the numerical simulation to investigate the gasliquid two-phase flow in the microchannel for the adhesive dispensing. A 2-D model of microchannel with a diameter for 0.04 mm was established and meshed. The gas-liquid slug flow emerges after iterating over 1 million steps with the gas flow rate for 0.1 m/s, the water flow rate for 0.05 m/s. The wetting property controlled by the contact angle had been discussed to present different liquid materials application. The poor wetting of liquid benefited for conforming droplets shape and avoiding droplets crashing and back haul. While the gas flow rate decreased, the length of liquid droplet and gas bubble increased and decreased, respectively and the total numbers of bubble and droplet decreased in one period. This indicated the fluid parameters have a high relationship with the quantity and volume of droplet.

关键词： Microchannel Fluids Numerical models Mathematical model Shape Equations

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Comparisons of Nano-Additives Influence on Properties of the Bi-Modal Solder Pastes for Special applications

Comparisons of Nano-Additives Influence on Properties of the...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Janusz Sitek Krystyna Bukat Marek Koscielski Aneta Arazna A.Mlozniak Malgorzata Jakubowska Shiwei Ma Yan Zhang Johan Liu Qijie Zha Yulai Ga Tele and Radio Research Institute 03-450 Warsaw 11 Ratuszowa St. Poland Institute of Electronic Materials 133 Wolczynska Str. 01-919 Warsaw Poland Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch School of Materials Science and Engineering Shanghai University Shanghai 200072 China

The paper presented the results of investigation of two solder pastes SnBi and SAC with different nano-particles, which could be applied for special application. It was presented that materials and samples preparation for investigation. The results of SEM analyzer of solder joints executed using these pastes and their shear strength measurements enable to make the comparison of nano-additives influence on properties of the bi-modal solders pastes. It was observed that addition of nano-particles into both solder pastes changed the microstructure of solder joints, and formed a large number of nano-sized grains with uniform distribution. For the SAC solder joints with nano-Ag particles it was also observed that specific Ag3Sn crystallites. We supposed that the Ag3Sn crystals, which created “internal net” and nano-sized grains with uniform distribution must influence the mechanical properties of the solder joints. The results of shear strength measurements of solder joints confirmed the significantly higher shear strength of bimodal solder joints in comparison to reference solder joints without nano-additives.

关键词： Soldering Lead Microstructure Materials Packaging Nanoparticles

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Study of Light Emitting Diodes for the Application of Plant Growth in Green House

Study of Light Emitting Diodes for the Application of Plant ...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Meijuan Fu Lianqiao Yang Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Department of Materials Science and Engineering Shanghai University，P.O.B 143 149 Yanchang Rd. Sh

In this paper, the reliability issue of the LED lamp in high temperature and moisture condition was investigated. Thermal stress and hygroscopic stress in the LED package were obtained by coupled-field analysis using Finite element analysis (FEA). The results demonstrate that the temperature of the module can reach saturation in tens of seconds while the moisture field needs longer to reach balance. 85℃/85RH can reach the same distribution of relative humidity with 65℃/65RH, but the time spent is half. So temperature is the important factor to affect the humidity distribution. The moisture concentration is better than the relative humidity response to the material moisture level. So we made further research on hygroscopic stress. Both the thermal stress and hygroscopic stress contributed to the delaminations in LED packages.

关键词： Stress Moisture Light emitting diodes Electronic packaging thermal management Temperature Materials Thermal stresses

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IGZO-TFT Driven AM-OLED displays

IGZO-TFT Driven AM-OLED Displays

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第七届全国暨华人有机分子和聚合物发光与光电特性学术会议

作者： Jun Li Liang Zhang Fan Zhou Jia-Hua Zhang Hua-Ping Lin Xue-Yin Jiang Zhi-Lin Zhang Department of Materials Science Shanghai University Jiading Shanghai 201800 People''s Republic of China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 People ''s Republic of China Department of Materials Science Shanghai University Jiading Shanghai 201800 People''s Republic of China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 People ''s Republic of China

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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Study on the adhesion strength of new nano-structured polyme...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Lei Zhang Xiuzhen Lu Xin Luo Björn Carlberg Masoud Zandira Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden

With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.

关键词： Materials Electronic packaging thermal management Thermal resistance Metals Heating Reliability Thermal conductivity

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New Permeation Rate Measurement for Thin Film Encapsulation of Organic Light Emitting Diodes

New Permeation Rate Measurement for Thin Film Encapsulation ...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Hao zhang Jianhua Zhang Bin Wei Minyan Zhang Li Long Renzheng Sang Tao Feng School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai Universi School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 The Linde Group Carl-von-Linde-Strasse 2585716 Unterchleissheim Germany

We have developed a new method to measure the water vapor transmission ratio (WVTR) for thin film encapsulation (TFE) of organic light emitting diodes (OLEDs). It is a nondestructive method to measure WVTR by investigating the change of photoluminescent spectra of organic material. This method can be realized easily by online test. By calibrating the evolution curve (the photoluminescent intensity versus time), we have figured out the relative water transmission which was responded by organic materials. The WVTR of TFE devices is estimated to be about 2.0×10-2gm-2day-1 in a controlled environment of 85% relative humidity (RH) at 38℃. Novel thin film encapsulation devices have also been presented.

关键词： Organic light emitting diodes Encapsulation Films Organic materials Chemical vapor deposition Substrates Equations

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Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders

Recent Progress in The Studies of Low Melting Sn-Based Pb-Fr...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Yang Lin Luqiao Yin Xicheng Wei Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Educati School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20 School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20

Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

关键词： Nanoparticles Compounds Lead Packaging Gallium

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Poster abstracts

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Sleep and Biological Rhythms 2016年第1期5卷 A1-A189页

作者： J. Ferrie M. Shipley F. Cappuccio E. Brunner M. Miller M. Kumari M. Marmot A. Coenen J. L. Castillo F. Araya G. Bustamante L. Montecino C. Torres S. Oporto J. Gronli E. Fiske R. Murison B. Bjorvatn E. Sorensen R. Ursin C. M. Portas S. Rajaraman A. Gribok N. Wesensten T. Balkin J. Reifman N. Dursunoglu S. Ozkurt S. Baser O. Delen S. Sarikaya P. Sadler P. Mitchell D. Françon M. Decobert B. Herve A. Richard G. Griebel P. Avenet B. Scatton G. L. Fur D. Eckert A. Jordan A. Wellman S. Smith A. Malhotra D. White D. Bruck I. Thomas A. Kritikos W. Oertel K. Stiasny-Kolster D. Garcia-Borreguero W. Poewe B. Hoegl R. Kohnen E. Schollmayer J. Keffel C. Trenkwalder A. Valle S. Roizenblatt F. Fregni P. Boggio S. Tufik K. Ward L. Robertson L. Palmer P. Eastwood D. Hillman J. Lee S. Mukherjee V. de Padova G. Barbato G. Ficca I. Zilli P. Salzarulo M. Veldi T. Hion V. Vasar M. Kull L. Nowak J. Davis Y. Latzer O. Tzischinsky S. Crowley M. Carskadon M. Anca-Herschkovitsch D. Frey J. Ortega C. Wiseman C. Farley K. Wright A. Campbell A. Neill K. Spiegel R. Leproult E. Tasali N. Scherberg E. van Cauter A. T. Noradina N. A. Karim I. Norlinah A. A. Raymond R. Sahathevan B. Hamidon E. Werth R. Poryazova R. Khatami C. Bassetti R. G. Beran L. Ainley G. Holand J. Duncan H. Kinney B. Davis B. Hood S. Frey C. Schmidt M. Hofstetter P. Peigneux C. Cajochen W.-P. Hu J.-D. Li C. Zhang L. Boehmer J. Siegel Q.-Y. Zhou Y. Sagawa H. Kondo T. Takemura H. Kanayama Y. Kaneko M. Sato T. Kanbayashi Y. Hishikawa T. Shimizu A. Viola L. James L. Schlangen D.-J. Dijk R. Andretic Y.-C. Kim K.-A. Han F. Jones R. Greenspan L. Sanford L. Yang X. Tang K. Dieter E. Uta H. Sven M. Richard N. Oyane S. Pallesen F. Holsten Y. Inoue M. Fujita N. Emura K. Kuroda N. Uchimura A. Johnston J. Astbury G. Kennedy K. Hoedlmoser M. Schabus T. Pecherstorfer S. Moser G. Gruber P. Anderer W. Klimesch N. Naidoo M. Ferber A. Pack D. Neu O. Mairesse G. Hoffmann A. Dris L. Lambrecht P. Linkowski P. Verbanck O. Le Bon N. Matsuura M. Yamao N. Adachi R. Aritomi Y. Komada H. Tanaka S. Shirak University College London London UK University College London London USA Warwick Medical School London UK Warwick Medical School Coventry USA Radboud University Nijmegen Nijmegen Netherlands Department of Neurology University of Chile Santiago Chile Neurology Service Hospital del Salvador Santiago Chile Family Health Center Juan Pablo II Santiago Chile Department of Biomedicine Section on Physiology Univeristy of Bergen Bergen Norway Department of Public Health and Primary Health Care Univeristy of Bergen Bergen Norway Department of Public Health and Primary Health Care University of Bergen Bergen Norway Norwegian Competence Center for Sleep Disorders Haukeland University Hospital Bergen Norway Department of Child and Adolescent Psychiatry Haukeland University Hospital Univeristy of Bergen Bergen Norway Department of Biomedicine University of Bergen Bergen Norway US Army Medical Research and Materiel Command Fort Detrick Frederick USA Walter Reed Army Institute of Research Silver Spring USA Department of Behavioral Biology Walter Reed Army Institute of Research Silver Spring USA Faculty Department of Pulmonology Pamukkale University Medical Denizli Turkey University of Ballarat Ballarat Australia Sanofi-Aventis Recherche et Developpement Paris France Brigham and Women’s Hospital Harvard Medical School Boston USA The University of Queensland Adelaide Australia School of Psychology University of Queensland Brisbane Australia The University of Queensland Brisbane Australia Victoria University Melbourne Australia Department of Psychology Victoria University Melbourne Australia School of Psychology Victoria University Melbourne Australia Philips-Universität Marburg Germany Philips-Universitaet-Marburg Marburg Germany Instituto de Investigaciones del Sueno Madrid Spain Universitätsklinik für Neurologie Innsbruck Austria Universitaetsklinik fuer Neurologie Innsbruck Austria IMEREM GmbH Nuernberg Germany Schwarz Pharma AG Monheim Germany

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Compressed sensing based channel estimation for fast fading OFDM systems

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Journal of systems Engineering and Electronics 2010年第4期21卷 550-556页

作者： Xiaoping Zhou Yong Fang Min Wang Key Laboratory of Specialty Fiber Optics and Optical Access Networks School of Communication and Information Engineering Shanghai University Shanghai 200072 P. R. China Key Laboratory of Advanced Display and System Applications Shanghai 200072 P. R. China

A compressed sensing（CS） based channel estimation algorithm is proposed by using the delay-Doppler sparsity of the fast fading channel.A compressive basis expansion channel model with sparsity in both time and frequency domains is *** pilots in accordance with a novel random pilot matrix in both time and frequency domains are sent to measure the delay-Doppler sparsity *** relatively nonzero channel coefficients are tracked by random pilots at a sampling rate significantly below the Nyquist *** sparsity channels are estimated from a very limited number of channel measurements by the basis pursuit *** proposed algorithm can effectively improve the channel estimation performance when the number of pilot symbols is reduced with improvement of throughput efficiency.

关键词： compressed sensing sparse channel channel estimation fast fading.

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