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International Conference on Signal Processing Proceedings (ICSP)

作者： Q. Zhang P. An Z.-Y. Zhang Qiuwen Zhang School of Communication and Information Engineering Shanghai University Shanghai P. R. China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai P. R. China Shanghai University Shanghai Shanghai CN

The intermediate view synthesis from arbitrary view is a challenging topic in multi-view areas, many image-based rendering methods have been proposed to solve this problem. A new multi-view intermediate view synthesis method based on Tikhonov regularization function is proposed to synthesis view from limited number of source views. The experiments show good results of the synthesized views.

关键词： Bidirectional control Cost function Cameras Pixel Image color analysis Image reconstruction PSNR

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Anisotropic thermal conductivity in electrically conductive adhesives with single- and bimodal filler-size distributions containing Ag flakes and micro-particles

Anisotropic thermal conductivity in electrically conductive ...

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Electronics system-Integration Technology Conference, ESTC

作者： Masahiro Inoue Hiroaki Muta Shinsuke Yamanaka Johan Liu Institute of Scientific and Industrial Research Osaka University Osaka Japan Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University Suita Osaka Japan Key Laboratory of Advanced display and System Applications and SMIT Center Shanghai University Mechatronics Engineering Shanghai China

Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.

关键词： Heating Annealing Temperature measurement Variable speed drives Resins

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Anisotropic thermal conductivity in electrically conductive adhesives with single- and bimodal filler-size distributions containing Ag flakes and micro-particles

Anisotropic thermal conductivity in electrically conductive ...

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3rd Electronics system Integration Technology Conference, ESTC 2010

作者： Inoue, Masahiro Muta, Hiroaki Yamanaka, Shinsuke Liu, Johan The Institute of Scientific and Indistrial Research Osaka University 8-1 Mihogaoka Ibaraki Osaka 567-0047 Japan Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University 2-1 Yamadaoka Suita Osaka 565-0871 Japan Department of Microtechnology and Nanoscience Chalmers University of Technology Kemivägen 9 SE-412 96 Göteborg Sweden Key Laboratory of Advanced Display and System Applications SMIT Center Shanghai University Box 282 No. 149 Yan Chang Road Shanghai 200072 China

ISBN: (纸本)9781424485536

关键词： Adhesives

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MDS investigation on the heat transfer properties of CNT micro-channel cooler

MDS investigation on the heat transfer properties of CNT mic...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Shun Wang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0×1.5 - 10 -8 Km 2 /W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.

关键词： Heat transfer Thermal resistance Carbon nanotubes Conductivity Materials

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EXPERIMENTAL STUDY ON THE VORTEX FORMATION AND ENTRAINMENT CHARACTERISTICS FOR A ROUND TRANSVERSE JET IN SHALLOW WATER

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Journal of Hydrodynamics 2009年第3期21卷 386-393页

作者： FAN Jing-yu ZHANG Yan WANG Dao-zeng Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China

The vortex formation and entrainment characteristics for a round transverse jet in shallow water were experimentally investigated by means of a combination of LIF flow visualization and PIV measurement. A scarf vortex wrapped around the main body of the jet is formed in the near-wall region due to the interaction between the resulting wall jet and sufficiently shallow crossflow, with some more or less unsteady flow properties and with spreading ranges as functions of both the velocity ratio and the water depth within the near field. The entrainment of the ambient crossflow fluid into the jet main body is closely associated with the time-evolving features of the shear layer between the jet and surrounding fluid as well as the induced vortical structures near the wall. In the case of slight impingement upon the wall, the interaction between the jet shear layer and the weak, unstable scarf vortex gives rise to an appreciable local entrainment enhancement, confined in the near-wall region in the vicinity of the stagnation point. While in the case of intense impingement upon the wall, the well-organized and stable scarf vortex gives rise to a greatly enhanced entrainment and a greatly increased lateral spreading rate nearly throughout the overall near field as compared to the conventional wall jet. In addition, the entrainment of the ambient crossflow fluid by the scarf vortex in this case occurs largely on the surface of the unique spiral roller structure by itself due to the presence of smaller and unorganized eddies, and accordingly the scarf vortex is likely to keep its spiral roller structure steadily to a relatively great downstream distance within the near field.

关键词： transverse jet shallow water vortex formation entrainment PIV measurement

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Efficient VLSI architecture of CAVLC decoder with power optimized

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Journal of Shanghai University(English Edition) 2009年第6期13卷 462-465页

作者：陈光化胡登基张金艺郑伟峰曾为民 Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai Key Laboratory of Power Station Automation Technology School of Mechatronics Engineering and Automation Shanghai University

This paper presents an efficient VLSI architecture of the contest-based adaptive variable length code （CAVLC） decoder with power optimized for the H.264/advanced video coding （AVC） standard. In the proposed design, according to the regularity of the codewords, the first one detector is used to solve the low efficiency and high power dissipation problem within the traditional method of table-searching. Considering the relevance of the data used in the process of runbefore＇s decoding, arithmetic operation is combined with finite state machine （FSM）, which achieves higher decoding efficiency. According to the CAVLC decoding flow, clock gating is employed in the module level and the register level respectively, which reduces 43% of the overall dynamic power dissipation. The proposed design can decode every syntax element in one clock cycle. When the proposed design is synthesized at the clock constraint of 100 MHz, the synthesis result shows that the design costs 11 300 gates under a 0.25 μm CMOS technology, which meets the demand of real time decoding in the H.264/AVC standard.

关键词： H.264/advanced video coding （AVC） contest-based adaptive variable length code （CAVLC） decoder

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Micropolar interface model of thin-layered interconnection components with heterogeneous internal microstructures

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Journal of Shanghai University(English Edition) 2009年第5期13卷 345-348页

作者：张燕樊靖郁 Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University

Being a wide variety of thin-layered interconnection components in electronics packaging with relatively small scale and heterogeneous materials, conventional numerical methods may be time consuming and even inefficacious to obtain an accurate prediction for the interface behavior under mechanical and/or thermal loading. Rather than resort to a fully spatial discretization in the vicinity of this interface zone, an interface model was proposed within the framework of micropolar theory by introducing discontinuous approximation. A fracture description was used to represent the microscopic failure progress inside the interface. The micropolar interface model was then numerically implemented with the finite element method. As an application, the interface behavior of a packaging system with anisotropic conductive adhesive (ACA) joint was analyzed, demonstrating its applicability and great efficiency.

关键词： interface model micropolar theory discontinuous approximation

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Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

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ECS Transactions 2010年第1期27卷

作者： Xia Zhang Teng Wang Pär Berggren Si Chen Johan Liu Shanghai University Chalmers University of Technology SHT Smart High-Tech AB SMIT Ltd Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China

Carbon Nanotube (CNT) has been proposed as a promising candidate material to build next generation flip chip interconnects in electronics. In this paper, flip chip assembly using CNT bumps and ACF is performed. To realize CNT-based interconnects, post-growth processes including deposition of metallic layers on CNT bundles and low temperature transfer of CNT bundles have been developed to overcome the problems of the high growth temperature of CNT as well as the poor adhesion between CNT bumps and substrates. Moreover, ACF has been used to assemble the CNT bumps on another Si substrate. The electrical test is performed also to verify the good contact between CNT bumps and ACF.

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A jetting system for chip on glass package

A jetting system for chip on glass package

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Haili, Jia Zikai, Hua Maoyu, Li Jinsong, Zhang Jianhua, Zhang School Engineering and Engineering and Automation Shanghai University Shanghai City 200072 China Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University Shanghai City 200072 China

ISBN: (纸本)9781424446599

Jetting is regarded as the next generation dispensing technology due to its features of non-contact and high precision dispensing. In this paper, we developed a jetting system for chip-on-glass package consisting of a jetting dispenser and a 3-axis movement system. The jetting dispenser applied a concept of modular design to construct four modules, which were nozzle, actuator, feeder and temperature controller. To analyze the factors influencing the fluid jetting, the proper fluid and structure models were set up. In the jetting dispenser, we used a solenoid valve (f >100Hz) to provide a high-speed movement for a needle. In a dispensing process, a piston drove a needle to move reciprocate, and its stroke was measured and controlled by a micrometer. A 3-axis system was a platform for the installation of jetting dispenser, and supported a reciprocating motion to follow the programmed route. ©2009 IEEE.

关键词： Needles

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An improved dual field modular inversion algorithm and VLSI implementation

An improved dual field modular inversion algorithm and VLSI ...

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1st International Conference on Information Science and Engineering, ICISE2009

作者： Chen, Guanghua Zhu, Jingming Liu, Ming Zheng, Weifeng School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education and Microelectronic Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769538877

An improved dual filed modular inversion algorithm which can support inversion operation in both GF(P) and GF(2∧m) is proposed in this paper. Compared with previous ones based on Extended Euclidean algorithm, it not only finishes modular inversion arithmetic in dual fields, but also operates much faster by more effective shift operations and avoiding time-consuming magnitude comparison. The simple addition/subtraction becomes the most complex operation in the new algorithm while the multiplication/division is replaced by cheap shifting, and thus only two adders and one subtraction device are required to complete its hardware implementation. The 256-bit modular inversion circuit based on the improved algorithm is implemented in SMIC 0.18 CMOS standard cell technology. The synthesis result indicates that the design is about 17% faster than that of previous algorithms while the area is only 5% larger. ©2009 IEEE.

关键词： VLSI circuits

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