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Electronic Components and Technology Conference (ECTC)

作者： Luqiao Yin Weiqiao Yang Yansheng Guo Kejun Ma Shuzhi Li Mingfa Chen Jia Li Jianhua Zhang School of Mechatronics and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai China Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Shanghai China Rainbow Optoelectronics Material Shanghai Company Limited Shanghai China Microelectronics Technology Institute of East China Shanghai University Shanghai China

In order to solve the thermal issue and improve the thermal resistance of LED, a device with multi-chip packaged on multi-layer composite ceramic substrate is successfully packaged. The top layer of the substrate is low temperature co-fire ceramic (LTCC), while the base layer is aluminum nitride (AINx) ceramic. 18 chips(one watt) are used in the device, and all of them are simultaneously packaged on a composite ceramic substrate which is 55 mm in length and 20 mm in width. The 18 chips are designed into two rows, and three chips in series for six parallels. At the same time the same chips are packaged on aluminum (Al) substrate and alumina (AlOx) substrate. After wire bonding photoelectric parameters of the three package modules are tested, the results show that the properties of the AINx-based package has the best performances, the thermal resistance of the device is far smaller than the other devices packed on the Al substrate and the AlOx substrate. After phosphor coatings the AINx-based multi-layer ceramic substrate package has 896.1 lm (43.4 lm/W) loading 350 milliampere (mA) to each chip, and has 1081.3 lm (35.4 lm/W) loading 500 mA. The multi-chip module has little light degradation adding 500 mA to each chip after working in the room temperature for one afternoon. At last the module is simulated by ANSYS software, the highest junction temperature of the chips in the module is about 70.8degC when 1.8 watts electric power is loaded to each chip, this temperature is far lower than 125degC which will damage the chip, and he highest simulation temperature of the aluminum heat slug is about 39.3degC. The temperature of the aluminum heat slug is about 41.0degC which is tested by thermocouple in the experiments, and it is closely to the simulation temperature 39.3degC. At last the relationship between pn-junction temperature and thermal conductivity coefficient of the silver (Ag) paste , the relationship between pn-junction temperatures and convection coefficient ha

关键词： Light emitting diodes Ceramics Temperature Packaging Thermal resistance Thermal conductivity Testing Aluminum nitride Wire Bonding

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Effect of encapsulation on OLED characteristics with anisotropic conductive adhesive

Effect of encapsulation on OLED characteristics with anisotr...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Mans Andreasson Johan Liu Thorvald Andersson Hsuan-Yi Liao Itsuo Watanabe Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Advanced Interconnect Material Division Hitachi Chemical Company Limited Chikusei Ibaraki Japan

Organic light emitting devices (OLEDs) is one of the most potentially interesting display technologies in the flat panel display (FPD) field. This paper investigates the effects of OLED structures and a perimeter encapsulation to protect the OLED from atmospheric exposure. Firstly, the electric features of the OLED devices with and without a copper phtalocyanine layer were measured, and the one with the additional buffer layer showed a lower turn-on voltage. Then the OLED device sample was encapsulated with a glass cover bonded to the substrate with an adhesive matrix containing micro-particles. The samples were stored in ambient conditions, and the IV characteristics were studied with shelf-time as a parameter. The measurement results indicated that the encapsulation had a significant improvement on the device operation. After two weeks of storage the encapsulated samples showed less degradation and the current density at a given operating bias was about fifty percent higher than without encapsulation.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays Protection Copper Atmospheric measurements Electric variables measurement Buffer layers

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Wigner-Ville distribution and cross Wigner-Ville distribution of noisy signals

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Journal of systems Engineering and Electronics 2008年第5期000卷

作者： Chen Guanghua Ma Shiwei Liu Ming Zhu Jingming Zeng Weimin Key Laboratory of Advanced Display and System Applications Ministry of Education & Microelectronic Research and Development CenterShanghai Univ.Shanghai 200072P.R.China

The Wigner-Ville distribution (WVD) and the cross Wigner-Ville distribution (XWVD) have been shown to be efficient in the estimation of instantaneous frequency (IF).But the statistical result of the IF estimation from XWVD peak is much better than using WVD *** reason is given from a statistical point of *** studies show that XWVD of the analyzed signal can be estimated from XWVD of the noise-contaminated *** estimation is unbiased,and the variance is equal to that of *** this case,WVD cannot be estimated from WVD of the noise-contaminated ***,higher SNR is required when WVD is used to analyze signals.

关键词： Wigner-Ville distribution cross Wigner-Ville distribution instantaneous frequency expectation vari-ance

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Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Recent Progress of Carbon Nanotubes as Cooling Fins in Elect...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Johan Liu Yifeng Fu Teng Wang SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China

As power density in electronic system is approaching a level that conventional cooling methods can't handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using Carbon Nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is considered as an ideal material for thermal management in high heat flux microsystems. Fabricated onto a silicon substrate to form microchannels, the CNT based cooling fins show high heat dissipation efficiency. This paper reviews the ongoing research on CNT based microchannel cooler development carried out so far. Both experimental and simulation results are included and presented.

关键词： Microchannel Cooling Arrays Thermal conductivity Carbon nanotubes Heating Heat transfer

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Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Manufacture, Microstructure and Microhardness Analysis of Sn...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Lili Zhang Wenkai Tao Johan Liu Yan Zhang Zhaonian Cheng Cristina Andersson Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed Consumable-electrode Direct Current Arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.

关键词： Soldering Microstructure Lead Materials Grain boundaries Nanoparticles Packaging

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A high-speed GRAM built in TFT-LCD driver IC

A high-speed GRAM built in TFT-LCD driver IC

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作者： Yan, Limin Liu, Shujun Key Laboratory of Advanced Display and System Applications Shanghai University Microelectronics R and D Center Shanghai University Campus 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9787561752289

LCD display solution always contains three main parts: controller, source driver and gate driver, which is commonly designed separately in large-sized panel, but integrated on single chip for medium-sized or small, such as digital cellular phones and small PDAs. This paper describes a high-speed GRAM (Graphics RAM) supporting 1-chip solution for TFT-LCD panel, which capacity is 132(width) × l76(length) × 16(RGB) bits, storing 65k-color image, which read access time is 546 ps.

关键词： Thin film transistors

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Optimization of microcavity top-emitting organic light-emitting devices with MoOx as hole iqjection layer

Optimization of microcavity top-emitting organic light-emitt...

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作者： Cao, Jin Zhu, Wenqing Jiang, Xueyin Zhang, Zhilin Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China Department of Materials science Shanghai University Shanghai 200072 China

ISBN: (纸本)9787561752289

Top-emitting organic light-emitting devices (TOLEDs) using a thin MoO x film deposited on a thick Ag as the reflective anode and LiF/Al/Ag as the semitransparent cathode are demonstrated. The hole injection of Ag anode can be significantly improved with surface modification using a MoOx thin film. For microcavity TOLEDs, optical length pay important role in determing the efficiency and color of the devices. By changing the optical length, the cavity resonance can be tuned to be consistent with the peak wavelength of spontaneous emission. In this way, the optimized efficiency is obtained. With Alq3 as the emitting layer, the optimized TOLEDs with MoOx as hole injection layer shows a tune-on voltage of 2. 68 V and a maximum current efficiency of 7.44 cd/A, which are much better than those (3.37 V, 4.67 cd/A) obtained from the conventional OLED. The good performance of TOLED is attributed to the efficient hole injection from the Ag/MoOx anode as well as the optimized microcavity effect.

关键词： Anodes

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A new optimized gray scale control method based on parallel sub-frame and bit scan

A new optimized gray scale control method based on parallel ...

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作者： Yan, Limin Wang, Tianxiong Gao, Hui Key Laboratory of Advanced Display and System Applications Shanghai University Microelectronic R and D Center Shanghai University Campus 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9787561752289

Gray scale is one of the most important parameters to judge the display quality of Flat Panel display (FPD). The widely used technique to control the FPD's gray scales nowadays is Pulse Width Modulation (PWM) and Sub-frame, which orderly scan display pixels by row, column and frame to obtain the gray scale display. It results in lots of time waste in the scanning process. This paper dissertates the construction of the space-time mapping topology architecture that cast grayscale matrix in space to a gray-scale scanning space-time plane. By the construction, it presents a new optimized gray scale control method which based on scanning by bit and parallel Sub-frame transmission. The method proposed in this paper aims at the time redundancy which commonly exists in the FPD imaging process, and break through the traditional imaging method by decomposing one plane into multi-planes. Based on this novel idea and the construction of the scanning space-time mapping topology architecture, a Box Insert Model is proposed in the paper. The theoretic model have significant meaning to solve the bottle problem of transfer speed from memory space to display plane, and provide a new way of enhancing scan efficiency and reducing refresh frequency.

关键词： Mapping

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LARGE-EDDY SIMULATION OF THREE-DIMENSIONAL VORTICAL STRUCTURES FOR AN IMPINGING TRANSVERSE JET IN THE NEAR REGION

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Journal of Hydrodynamics 2007年第3期19卷 314-321页

作者： FAN Jing-yu ZHANG Yan WANG Dao-zeng Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications （Shanghai University） Ministry of Education and SMIT Center Shanghai University Shanghai 200072 China Department of Applied Mechanics Chalmers University of Technology SE-412 96 Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China

The three-dimensional vortical structures for an impinging transverse jet in the near region were numerically investigated by means of Large-Eddy Simulation （LES）. The LES results reproduced the skewed jet shear layer vortices close to the jet nozzle and the scarf vortex in the near-wall zone in good agreement with the experimental observations. Different vortical modes in the skewed jet shear layer close to the jet nozzle were identified depending upon the velocity ratio between jet and crossflow, namely changing from an approximately axisymmetric mode to a helical one with the velocity ratios varying from 20 to 8. Moreover, the scarf vortex wrapped around the impinging jet in the near-wall zone showed distinct asymmetry with regard to its bilateral spiral legs within the near region. And the entrainment of the ambient crossflow fluids by the scarf vortex in the near-wall zone was appreciably influenced by its asymmetry and in a large part occurred on the surface of the spiral roller structures in the course of spreading downstream.

关键词： Large-Eddy Simulation （LES） impinging jet crossflow vortical structure entrainment

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Design of PWM Controller in a MCS-51 Compatible MCU

Design of PWM Controller in a MCS-51 Compatible MCU

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yue-Li Hu Wei Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

This paper presents a design of pulse-width modulated (PWM) controller module in a MCU based on MCS-51 structure. The design can generate 2-channel programmable periodic PWM signals. These output PWM signals from MCU can be used for a variety of applications including motor control. The function of the design allows users to select independent or complementary inversion timing relationships between 2 PWM wave forms. The latter mode selection also includes optional dead time function to support driving H-bridges and inverters. Therefore, users can control the output PWM signals through setting the duty-cycle registers. After the successful simulation at the front end, practical experiments made on a NIOS development board verify the design.

关键词： Pulse width modulation Signal generators Space vector pulse width modulation Voltage control Frequency Control systems Motor drives Clocks Switches Pins

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