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Investigation of Fine Pitch Chip on Glass with Au-Sn Thermocompression Bonding

Investigation of Fine Pitch Chip on Glass with Au-Sn Thermoc...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Fang Yuan Jianhua Zhang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China Shanghai University Shanghai Shanghai CN

Au-Sn thermocompression interconnect technique using nonconductive film (NCF) is proposed to solve the insulation problem between bumps of fine-pitch IC. This paper describes NCF for ultra-fine pitch Chip-On-Glass (COG) application. NCF is a novel material developed for fine-pitch packaging. The effects of bonding temperature and bonding pressure on the microstructure of an NCF-bonded COG package were investigated in this study through optomicroscope and SEM. The contact area between chip bump and substrate pad, thickness of eutectic layer and content percentage of Sn in eutectic layer were observed in present work. High bonding temperature and bonding pressure are beneficial to form larger contact area. Thickness of eutectic layer increases along with bonding pressure decrease and bonding temperature increase, and content percentage of Sn increases accordingly. Reliability test of AHT for Au-Sn thermocompression samples was conducted and some cracks at the root of bump were detected, but no functional failures were detected.

关键词： Glass Bonding Temperature Packaging Tin Insulation Application specific integrated circuits Microstructure Substrates Testing

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Electronic paper display technology

Electronic paper display technology

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作者： Zhao, Kun Li, Chunya Zhang, Jianhua Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education No. 149 Yanchang Rd Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai University No. 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)9787561752289

In recent years, flat panel display technology is becoming mature day by day. With the development of a huge rapid-growing display market, an increasing number of companies and research institutes focus on the flexible display technology, which is called paper-like display technology. The main point in flexible display technology is electronic paper display technology, which involves three main display types: microcapsules electrophoresis, gyricon bead, cholesteric texture. This paper not only introduces the initiation and development of electronic paper display technology, but also gives detailed descriptions of the principles, applications and main companies for the three electronic paper display types. When the display elements were prepared, the driver circuit must be assembled with the display module. There will be some problems should be solved by electronic packaging technology, such as chip on flex (COF) technology. Furthermore, the assembling process to make driver elements integrated with display components was illustrated. There are three realization directions to realize electronic paper display, including display-based technology, printing technology, photocopy technology. At last, electronic paper display products were shown to indicate the developing technology and splendid future.

关键词： Electrophoresis

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FEM Analysis of Moisture Distribution in Stacked Die Package

FEM Analysis of Moisture Distribution in Stacked Die Package

引用

第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

作者： Z K Hua J H Zhang C Y Li L Q Cao Y X Luo Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Intel Technology Development (Shanghai) Co. Ltd.

Stacked Die Packaging technology is the key technique to meet the requirements of higher density, smaller size of electronic products. Moisture has big influence on the reliability of packaging, in which the major failures are corrosion, delamination and crack. In stacked die packages,the main risks of the moisture also exist. The focus of this paper is to investigate the hygroscopic characteristc of stacked die using commercial FEA software. In this study,according to the JEDEC standard, the moisture diffusion characteristic under different conditions is *** show that the substrate and bottom adhesive absorb rapidly in moisture diffusion simulation. This reduces the mechanical properties of the stacked die and the result may give a proper answer to those failure observed in *** tests are needed in order to get a more precise investigation.

关键词： Moisture Electronics packaging Water pollution Water resources Finite element methods Lead Reliability engineering Corrosion Environmentally friendly manufacturing techniques Temperature

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New interconnection technology for flat panel display applications

New interconnection technology for flat panel display applic...

引用

作者： Yuan, Fang Zhang, Jianhua Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education No. 149 Yanchang Rd. Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai University No. 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)9787561752289

As electronic packaging technology trends in the small flat panel display move toward faster, more cost-effective, higher electrical performance and better reliability, flip chip technology gains popularity as one of the best chip packaging candidates. This technology has offered numerous advantages over conventional solder joining and the assembly uses polymer adhesives such as isotropic conductive adhesives (ICAs), anisotropic conductive films (ACFs) and nonconductive adhesives(NCAs). ICAs and AC As contain conductive particles and adhesive polymer resins and have been widely used for the flat panel display module. However, as the consumer electronics tends to become ligher, thinner, and also featured in high resolution and low power consumption to satisfy the increasing market requirements, it is propelling to improve the approaches to a flip chip adhesive process. The paper mainly presents the study of Non-conductive adhesives in flip chip for plat panel display. The NCAs technology is emerging as an attractive lead-free solder interconnects due to its environmental friendliness, lower processing temperatures, lower cost and extendability to fine pitch application. In fine pitch application below 30 μm, decreasing the pad pitch could increase the risk of short circuit to the ICA joints and lead to a reduction in current-carrying capacity of the AC A interconnetions. But the technology using NCAs in flip chip can solve the problems very well. This paper will review the latest research in NCA interconnection technology for flat panel display applications. Meanwhile, the new methods of NCA interconnection for very fine pitch LCD driver is also proposed and verified.

关键词： Cost effectiveness

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Application of Semantic Network in Recognition of Skin Symptom

Application of Semantic Network in Recognition of Skin Sympt...

引用

International Conference on Fuzzy systems and Knowledge Discovery (FSKD)

作者： Yue-li Hu Jing Liu Key lab of advanced display and system applications (Shanghai University) Ministry of Education School of Mechanical and Electronic Engineering Shanghai University Shanghai China

When building skin intelligent diagnostic support system, the knowledge representation for skin symptoms is a fundamental design question. Here we present a semantic network as such a representation, and a skin symptom fuzzy inferential system based on semantic network is proposed by introducing the fuzzy inference to recognition and classification of skin microscopic images.

关键词： Skin Fuzzy neural networks Fuzzy systems Image recognition Intelligent systems Artificial intelligence Intelligent networks Intelligent structures Microscopy Target recognition

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Research on the Models of OLED-On-Silicon Pixel Circuits

Research on the Models of OLED-On-Silicon Pixel Circuits

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Li-min Yan Hao Wang Key Laboratory of Advanced Display & System Applications Ministry of Education Shanghai University Microelectronic Research and Development Center Shanghai University Shanghai China

In modern information society, the display devices play an important role. Presently, Organic Light-Emitting Diode (OLED) has been emphasized and regarded as one of the best technology for its many advantages, such as active-matrix driver mode, high brightness, fast response time, high efficiency, wide visual angle, thin and light-weight etc. Much work of this paper has been done in AM-OLED technology, mainly focusing on the models of AM-OLED pixel circuit structure design and parameters assurance, AC-driving pixel circuit design and application. This research is prepared for integrated peripheral driving circuit design and application in the future.

关键词： Organic light emitting diodes Flat panel displays Thin film transistors Light emitting diodes Active matrix technology Brightness Threshold voltage Circuit synthesis Liquid crystal displays Active matrix organic light emitting diodes

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Second order multi-scale micropolar model for microsystem interconnections

Second order multi-scale micropolar model for microsystem in...

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第五届国际非线性力学会议

作者： Johan Liu Ragnar Larsson Key Laboratory of Advanced Display and System Applications Shanghai University SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Department of Applied Mechanics Chalmers University of Technology

Anisotropic conductive adhesives(ACAs)are widely used in microsystem packaging due to their superior *** ACA joints are usually much smaller in scale than the neighboring adherends,and there are even finer internal structures included in the thin interconnection *** great difference in scale among these constituents is a high challenge to both experimental technology and conventional numerical methods.A second order model based on micropolar theory is developed to take the mechanical responses of a typical internal structure in the ACA flip chip interconnection into *** addition,by considering the typical structure under unit deformation,this model could also provide the supplementary information with regard to the stiffness coefficients for a previously developed homogenization interface *** the simulation result obtained from the combination of two interface models agrees well with experimental observation.

关键词： ACA Second order multi-scale micropolar model for microsystem interconnections

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Reducing the Power Consumption of the AES S-Box by SSC

Reducing the Power Consumption of the AES S-Box by SSC

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第三届IEEE无线通讯、网络技术暨移动计算国际会议

作者： Jinyi Zhang Qinghua Zuo Tianbao Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research & Development Center Shanghai University No.149 Yanchang Road Shanghai 200072 P.R.China

The advanced Encryption Standard (AES) algorithm has been accepted as the default choice in present security services. The S-Box as the key part in AES plays an important role for low-power design in the hardware implementation of the algorithm. About 75％ power consumption of an AES core is caused by the S-Box, so reducing the power of the S-Box is very efficient for the low-power design of the AES core. In this paper, the bus coding technique called Sequence-Switch Coding (SSC) is applied in the S-Box design. Input data are encoded in a certain sequence to reduce the transitions of the S-Box circuits. As a result, the power consumption in the combinational logic is brought down. The verification results show that about 10％ power has been reduced averagely in the experimental S-Box.

关键词： S-Box sequence-switch coding (SSC) AES

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Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Investigation of Dielectric Strength of Electrospun Nanofibe...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xu Wang Wenxuan Wang Xin Li Bjorn Carlberg Xiuzhen Lu Zhaonian Cheng Johan Liu Dongkai Shangguan Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Centre Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

Electrospinning is a historical technology which has existed for over seventy years. Recently, it has been introduced to make a novel electrospun nanofiber based thermal interface material (nano-TIM). Until now, there are few articles on the dielectric properties of nanofiber. Since the electrical insulation property is an important parameter for thermal interface materials, we investigated the dielectric strength of electrospun nano-TIM in this paper. The experiment data have shown that the nano-TIM materials have dielectric strength of 5.82 kV/mm, which is believed to be adequate for microelectronics applications. Further analysis and FEM simulation further revealed the breakdown mechanism. Reasons for the low dielectric strength as compared with that of bulk polymer were also discussed in this paper.

关键词： Dielectric breakdown Dielectric materials Polymers Electronic packaging thermal management Nanostructured materials Conducting materials Voltage Surface morphology Heat transfer Surface resistance

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An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu

An aging study of intermetallic compounds formation in Sn-0....

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Lili Zhang Si Chen Peng Sun Zhaonian Cheng Johan Liu Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Gothenburg Sweden

Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h, 200 h, 550 h and 1000 h, respectively. In the solder matrix of the Sn-0.4Co-0.7Cu alloy, the intermetallic compounds (IMC) CoSn 2 were found. At the interface between the solder alloy and the electroless nickel substrate, a ternary (Cu, Ni) 6 Sn 5 intermetallic compound was detected. The intermetallic compound layer became thicker as a function of thermal aging time. The IMCs were continuous and their morphology was faceted at the interface. No voids and gaps were observed at the interface between the nickel layer and the Sn-0.4Co-0.7Cu eutectic alloy after thermal aging.

关键词： Aging Intermetallic Temperature Environmentally friendly manufacturing techniques Lead Soldering Copper alloys Nickel alloys Testing Bonding

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