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A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin array simulation results. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array, that is, 2D fin array can reduce the thermal resistance of the cooler although 2D fin array causes more pressure drop in the architecture than 1D fin array.

关键词： Computational fluid dynamics Cooling Microchannel Carbon nanotubes Thermal conductivity Heat transfer Solid modeling Two dimensional displays Chemical technology Educational technology

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A Study of Effects of Coolants on Heat Transfer Capability of On-chip Cooling with CNT Micro-fin Architectures by Using CFD Simulation

A Study of Effects of Coolants on Heat Transfer Capability o...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yi Fan Xiaolong Zhong Johan Liu Teng Wang Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.

关键词： Coolants Heat transfer Cooling Computational fluid dynamics Computational modeling Thermal conductivity Viscosity Computer architecture Conducting materials Heat sinks

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Realization of Ultra Wideband Bandpass Filter based on LCP Substrate for Wireless Application

Realization of Ultra Wideband Bandpass Filter based on LCP S...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xia Zhang Camilla Karnfelt Johan Liu Shiwei Ma Xu Wang Linqin Meng Herbert Zirath SMIT Center & Department of Microtechnology Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Department of Microtechnology and Nanoscience Chalmers University of Technology MC2 Microwave Electronics Laboratory Gothenburg Sweden School of Communication and Information Engineering Shanghai University China

Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF applications because of the unique combination of features and performance. Although LCP films offer many excellent properties, the poor adhesion between copper and LCP has prevented the use of these materials in flexible microwave circuits. In order to obtain better adhesion between LCP and copper, oxygen plasma pretreatment of the LCP substrate and a thin Ti adhesion layer are introduced before a Cu layer was sputtered on to the substrate. Finally, a novel and compact microstrip ultra wide band (UWB) band pass filter (BPF) is fabricated on LCP substrates using standard processing technology i.e. physical vapor deposition (PVD), lithography and wet etching, which provides LCP substrate the feasibility of the application in RF wireless systems.

关键词： Ultra wideband technology Band pass filters Adhesives Copper Crystalline materials Radio frequency Liquid crystal polymers Microwave circuits Flexible printed circuits Plasma applications

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Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Encapsulation of OLED device by Using Anisotropic Conductive...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yan Zhang Mans Andreasson Hua Zhou Johan Liu Thorvald Andersson Jing-yu Fan Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China

Organic light emitting diodes (OLEDs) is one of the most potential display technologies in the flat panel display (FPD) field, and its applications include simple monochrome large-area lighting to full color, video-capable graphics displays and so on. As organic materials are susceptible to humidity and oxygen, encapsulation is a key issue for OLED device reliability. In the present paper, two kinds of OLED samples have been studied; one encapsulated by adhesive matrix with fillers, and one without encapsulation. Variation of the electrical parameters of the OLED samples with respect to exposure time has been measured. The primary experiment investigation was carried out for the OLED sample sealed with an anisotropic conductive adhesive. Encapsulation material analysis, such as choices of different fillers/absorbent in the adhesive matrix, optimization of polymer matrix etc., will be conducted in future work.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays LED lamps Graphics Organic materials Humidity Materials reliability

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New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging applications

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Na...

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International Symposium on Electronic Materials and Packaging

作者： Wen Xuan Wang Xiuzhen Lu Johan Liu Michael Olugbenga Olorunyomi Tomas Aronsson Dongkai Shangguan Key Laboratory of Advanced Display and System Applications (Chinese Ministry of Education) and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience University of Technology Gothenburg Sweden

Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal conductivity of the film. The produced Nano-TIM has a nano scale structure with embedded nano-SiC distributed randomly. Scanning Electrical Microscope (SEM) was used to determine the morphology of the film. Thermal properties were measured. The results show that the Nano-TIM has good thermal properties and it can be further improved by changing the mass concentration of the SiC nano particles.

关键词： Nanostructured materials Silicon carbide Electronics packaging Thermal conductivity Electronic packaging thermal management Conducting materials Semiconductor materials Scanning electron microscopy Semiconductor device packaging Mechanical factors

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Effects of curing agents on the conductivity of isotropical conductive adhesives (ICAs)

Effects of curing agents on the conductivity of isotropical ...

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International Symposium on Electronic Materials and Packaging

作者： Xuechun Lin Qinghua Li Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Ministry of Education) School of Mechatronic and Automation Engineering Shanghai University Shanghai China Department of Fine Chemicals and Materials Engineering Shenzhen Polytechnic Shenzhen China

Curing agents greatly influence the electrical conductivity of epoxy resin/Ag composed isotropic conductive adhesives (ICA). In this paper, three kinds of latent curing agents-dicyandiamide (DICY), boron-amine complex (594) and imidazole derivate (MZ) were used for formulating one-package epoxy-based ICA, respectively. The investigation showed that the 70% silver-containing conductive adhesive with imidazole derivate as curing agent has excellent conductivity and its bulk resistivity was 5times10 -4 Omegaldrcm. boron- amine complex also show good conductivity in the same formula. However, the ICA with DICY as curing agent gave poor conductivity performance. The different curing mechanisms were linked to the different conductivity of ICAs cured by different agents. In the ICA with DICY as curing agent, the agent has two strong polar N and -CN group, it has strong molecular adhesion to silver. Basically one DICY molecule can link 4 epoxy groups. During the curing process, the active functional groups (- CN-, -N and -OH) link with silver and possibly form a layer of dense polymer capsulate covering on the surface of silver. This polymer capsulate is the key reason to increase the tunnelling resistance. So the ICA with DICY as curing agent gave poor conductivity. When use imidazole derivant or boron-amine complex as curing agent, which follows the anion or cation-catalytic-polymerization curing mechanism, the curing products were polyether gloss network. In such situation, the interaction between resin and silver is weak, therefore decreases the tunnelling resistance , thus can achieve good conductivity.

关键词： Curing Conductivity Conductive adhesives Independent component analysis Silver Contact resistance Electric resistance Polymers Epoxy resins Surface resistance

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RF characterization of flip-chip anisotropic conductive adhesives joints

RF characterization of flip-chip anisotropic conductive adhe...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xu Wang Zhaonian Cheng J. Liu Key Laboratory of Advanced Display and System Applications and Sino-Swedish Microsystem Integration Technology SMIT Shanghai University Shanghai China SMIT Center and Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

Anisotropic conductive adhesives (ACAs) have been proved to own good performance in high frequency applications. However, the effect of distribution of conductive particles in ACAs on RF (radio frequency) characterization is not fully understood. Finite difference in time domain (FDTD) method based electromagnetic software QuickWave is used to establish the structure and investigate RF characterization of ACA. The effect of distribution of conductive particles both in random and uniform distribution is simulated. Furthermore, the influence of conductor overlap is also investigated. An equivalent lumped circuit is also set up. The results show in a certain particles number, that there is minor influence in different distribution of conductive particles, and that as expected, the conductor overlap should be minimized to improve high frequency performance

关键词： Radio frequency Anisotropic magnetoresistance Conductive adhesives Finite difference methods Conductors Circuit simulation Microwave theory and techniques Time domain analysis Integrated circuit interconnections Bonding

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Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Computational Fluid Dynamics Simulation for On-chip Cooling ...

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International Symposium on Electronic Materials and Packaging

作者： Xiaolong Zhong Teng Wang Johan Liu Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications & Sino-Swedish Microsystem Integration Technology (SMIT) Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Gothenburg Sweden Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The harmfulness condition of nanotube array is an unavoidable limitation for cooling capability of carbon nanotube micro-fin structures, and consequently it is necessary to study the harmful situations of carbon nanotube. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array.

关键词： Computational fluid dynamics Computational modeling Cooling Carbon nanotubes Computer architecture Heat transfer Thermal conductivity Heat sinks Electronic packaging thermal management Microchannel

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On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling

On the heat transfer enhancement based on micro-scale air im...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Jing-yu Fan Yan Zhang J. Liu Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface

关键词： Heat sinks Heat transfer Microstructure Electronics cooling Thermal management of electronics Educational technology Thermal management Microchannel Mathematics laboratories

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Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Study on the Multi-Scale Properties of the Internal Structur...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Ragnar Larsson Jing-yu Fan Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging as interconnection materials, and many studies have been done about their electrical features, but limited works have been done on the mechanical properties with respect to the overall reliability of the packaging, and even less attention is paid to the micro-scale constituents of the internal structures in the ACA interconnection. This paper establishes a second order homogenization approach for predicting the mechanical performance of the typical internal structure in the ACA interconnection layer. This interface model is developed in the micropolar theory frame, and the macro- and micro-responses of each constituent are included. The considered structure under shear loading is simulated as application example of this model. The computational results show that the microscopic fluctuation field has a counteraction effect on the overall deformation, and the constituents with various material parameters have different responses to the prescribed loading. And the joint locations are of high possibility for crack/delamination initiation

关键词： Packaging Anisotropic magnetoresistance Conductive adhesives Conducting materials Mechanical factors Materials reliability Computational modeling Microscopy Fluctuations Delamination

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