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SSRN 2025年

作者： Lin, Yang Zhu, Yangyang Zhao, Ben Gu, Jialu Xu, Yachen Lan, Weixia Chen, Guo Shi, Wei Kido, Junji Wei, Bin Shanxi Datong University China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China Shanghai Engineering Research Center for Integrated Circuits and Advanced Display Materials Shanghai University Shanghai200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China Nanan Institute Shanghai University Nan'an Fujian Quanzhou362300 China Frontier Center for Organic Materials Yamagata University 4-3-16 Jonan Yonezawa992-8510 Japan

Top-emitting organic light-emitting diodes (TEOLEDs) based on metal/transparent conductive oxide composite anodes, which were Al/ITO and Ag/ITO, were studied. The microcavity effect was optimized by adjusting the microcavity thickness and microcavity order to achieve high color gamut RGB monochromatic light display. Through mathematical modeling and spectral simulation, TEOLEDs with different microcavity structures were designed. The results showed that the full width at half maximum and the color purity of the light of the TEOLED based on the second-order microcavity were significantly optimized compared to those of the TEOLED based on the first-order microcavity. Meanwhile, the TEOLEDs based on the Ag/ITO composite electrode exhibited better optoelectronic performance, with the significantly enhanced external quantum efficiency of up to 19.40%, narrower full width at half maximum of down to 20 nm, and improved color purity. The corresponding red, green, and blue TEOLEDs had achieved excellent color coordinates of (0.697, 0.301), (0.154, 0.769), and (0.139, 0.050), and the color gamut area of the device had reached 172.4% of the color gamut area of the bottom-emitting OLED, 125.6% of the National Television system Committee standard color gamut, and 93.8% of the ITU-R Recommendation BT.2020 standard color gamut. © 2025, The Authors. All rights reserved.

关键词： Organic light emitting diodes (OLED)

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Thermodynamic simulation of 6×6 Micro-LED array in flip-chip bonding

Thermodynamic simulation of 6×6 Micro-LED array in flip-chi...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Mechatronics and Automation Shanghai University Shanghai China School of Microelectronics Shanghai University Shanghai China

In this paper, we first simulated the influence of different diameters, heights and shapes on the In bumps by ANSYS simulation software. The results show that the changes of these conditions affect the deformation and stress of the In bumps to varying degrees. The height of the bumps has the least effect on the stress, while the diameter and shape of the bumps have a great effect on the deformation as well as stress. Finally, a sapphire based Mirco-LED array with a pixel pitch size of 7.5 μm was used to bond with silicon substrates with In bumps of different heights, and turn it on with electricity. We found that the In bumps height does affect the yield of Micro-LED, and the best yield in the experiment is > 90%. This study provides a theoretical basis for reducing the deformation and stress of In bumps during flip-chip bonding, and an experimental basis for improving bond yield and device performance.

关键词： Thermodynamics Deformation Shape Simulation Software Silicon Flip-chip devices

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A lightweight model for long-term multivariate time series forecasting via high-dimensional feature maps

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Applied Soft Computing 2025年 178卷

作者： Tang, Shixiang Guan, Yepeng School of Communication and Information Engineering Shanghai University Shanghai200444 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai200072 China Ministry of Education Shanghai200444 China

In practical applications, both performance and computational cost are crucial for long-term time series forecasting (LTSF). Transformers excel in capturing long-sequence interactions but suffer from slow training and high computational demands, limiting timely predictions. On the other hand, lightweight linear models often lack accuracy. These challenges may arise from the limited representational capacity of time series in their one-dimensional (1D) form. To address these limitations, TSMNet, a novel lightweight model, is proposed. TSMNet decouples the time series into higher dimensions, significantly enhancing feature representation efficiency while avoiding information redundancy. By segmenting 1D time series into multiple time series maps (TSMs) and employing periodic feature mixing and sub-TSM stacking strategies, local dependencies and global correlations are captured simultaneously. Additionally, an encoder based on two-dimensional (2D) dilated convolutions is introduced, with expandable channels and progressively widening convolutional kernels, enabling the comprehensive extraction of complex temporal variations. Finally, the extracted features are efficiently decoded and predicted via a multilayer perceptron (MLP) flatten head. Experiments on ten benchmark long-term time series forecasting datasets demonstrate that TSMNet achieves relative improvements of 8.40% compared with the state-of-the-art (SOTA) method. Furthermore, TSMNet operates approximately 10–41 times faster with extremely low computational resources. © 2025 Elsevier B.V.

关键词： Mapping

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High-order Finite-Volume Central Targeted ENO Family Scheme for Compressible Flows in Unstructured Meshes

arXiv

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arXiv 2023年

作者： Ma, Qihang Chong, Kai Leong Feng, Feng Zhang, Jianhua Wang, Bofu Zhou, Quan Shanghai Key Laboratory of Mechanics in Energy Engineering Shanghai Institute of Applied Mathematics and Mechanics School of Mechanics and Engineering Science Shanghai University Shanghai200072 China China Academy of Aerospace Science and Innovation Beijing100176 China Shanghai Institute of Aircraft Mechanics and Control Zhangwu Road Shanghai200092 China School of Microelectronics Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China Shanghai Frontier Science Center of Mechanoinformatics Shanghai University Shanghai200072 China

The high-order Target ENO (TENO) scheme, known for its innovative weighting strategy, has demonstrated strong potential for complex flow predictions. This study extends the TENO weighting approach to develop non-oscillatory central TENO (CTENO and CTENOZ) family schemes for unstructured meshes. The CTENO schemes employ compact directional stencils, which increase the likelihood of finding stencils within smooth regions. The design is intentionally compact to simplify the implementation of directional stencils. An effective scale separation strategy is adopted using an ENO-like stencil selection method, which employs large central stencils in smooth regions to achieve high-order accuracy, and smaller directional stencils near discontinuities to improve shock-capturing capabilities. Extensive tests involving CWENO, TENO, CTENO, and CTENOZ schemes were conducted to assess their performance in terms of accuracy, robustness, parallel scalability, and computational efficiency. The findings indicate that the proposed CTENO and CTENOZ schemes deliver high-order precision, lower numerical dissipation, and excellent shock-capturing performance. © 2023, CC BY.

关键词： Mesh generation

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Hybrid bonding thermodynamic simulation of 3×3 array of Micro-LED fabricated based on flip-chip bonding

Hybrid bonding thermodynamic simulation of 3×3 array of Mic...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jianxin Li Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

In this paper, ANSYS was used to perform a hybrid bonding thermodynamic simulation of Micro-LED fabricated based on flip-chip *** simulated the effects of different ILDs (interlayer dielectrics) and different diameters of In bumps on the mean stress of the bonding surface. The results show that filling BCB (Benzo cyclobutene)/PI (Polyimide)/SiO 2 can significantly reduce the mean stress on the In bumps bonding area, among which, filling BCB/PI is better than filling SiO 2 . And when the diameter of the In bumps is 5 μm, the mean stress on the In bumps bonding area is lowest. For the mean stress on the bonding area of the ILDs, filling BCB/PI is also much better than filling SiO 2 . Changing the diameter of the In bumps has little effect on the mean stress of the ILDs bonding area filled with BCB/PI. As for the bonding area of the ILDs filled with SiO 2 , the mean stress increases as the diameter of the In bumps increases. This paper uses simulation experiments to study the mean stress on different bonding areas during the hybrid bonding process of preparing Micro-LED, which provides a theoretical basis for improving the bonding strength and yield of Micro-LED, and provides ideas for realizing the industrialization of Micro- LED.

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Transient Thermodynamic Simulation of Micro LED Array Bonding

Transient Thermodynamic Simulation of Micro LED Array Bondin...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jinwen Pan Haojie Zhou Xiaoxiao Ji Liang Chen Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

Micro LED display technology is considered to be the next generation of display technology and finds widespread applications in displays and visible light communication. key cooperation plays a crucial role in achieving electrical interconnections for Micro LED, which significantly impact their luminous quality and reliability. This study aims to analyze the stress-strain evolution during the bonding process of Micro LED arrays with cylindrical and spherical In bumps using COMSOL. The results demonstrate that the displacement of the bumps after bonding decreases by up to 97% compared to the displacement observed during the temperature-holding phase. Furthermore, the stresses during the temperature rise and fall stages approximately exhibit a linear relationship with temperature, and residual stresses exist after bonding. Additionally, residual stresses remain present after bonding. This study provides theoretical guidance for optimizing the bonding process of Micro LED and further exploration for the commercialization of Micro LED.

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Ag_(3)PO_(4) decorated black urchin-like defective TiO_(2) for rapid and long-term bacteria-killing under visible light

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Bioactive Materials 2021年第6期6卷 1575-1587页

作者： Yingde Xu Xiangmei Liu Yufeng Zheng Changyi Li Kelvin Wai Kwok Yeung Zhenduo Cui Yanqin Liang Zhaoyang Li Shengli Zhu Shuilin Wu School of Materials Science&Engineering The Key Laboratory of Advanced Ceramics and Machining Technology By the Ministry of Education of ChinaTianjin UniversityTianjin300072China Hubei Key Laboratory of Polymer Materials Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional MaterialsSchool of Materials Science&EngineeringHubei UniversityWuhan430062China College of Engineering State Key Laboratory for Turbulence and Complex SystemDepartment of Materials Science and EngineeringPeking UniversityBeijing100871China Stomatological Hospital Tianjin Medical UniversityTianjin300070China Department of Orthopaedics&Traumatology Li Ka Shing Faculty of MedicineThe University of Hong KongPokfulamHong Kong999077China

Both phototherapy via photocatalysts and physical puncture by artificial nanostructures are promising substitutes for antibiotics when treating drug-resistant bacterial infectious ***,the photodynamic therapeutic efficacy of photocatalysts is seriously restricted by the rapid recombination of photogenerated electron-hole ***,the nanostructures of physical puncture are limited to two-dimensional(2D)platforms,and they cannot be fully used ***,this research developed a synergistic system of Ag_(3)PO_(4) nanoparticles(NPs),decorated with black urchin-like defective TiO_(2)(BU-TiO_(2-X)/Ag_(3)PO_(4)).These NPs had a decreased bandgap compared to BU-TiO_(2-X),and BU-TiO_(2)-X/Ag_(3)PO_(4)(3:1)exhibited the lowest bandgap and the highest separation efficiency for photogenerated electron-hole *** combination with BU-TiO_(2-X),the photostability of Ag_(3)PO_(4) improved because the oxygen vacancy of BU-TiO_(2-X) retards the reduction of Ag^(+) in Ag_(3)PO_(4) into Ag^(0),thus reducing its *** addition,the nanospikes on the surface of BU-TiO_(2-X) can,from all directions,physically puncture bacterial cells,thus assisting the hybrid’s photodynamic therapeutic effects,alongside the small amount of Ag^(+) released from Ag_(3)PO_(4).This achieves synergy,endowing the hybrid with high antibacterial efficacy of 99.76±0.15%and 99.85±0.09%against Escherichia coli and Staphylococcus aureus,respectively,after light irradiation for 20 min followed by darkness for 12 *** is anticipated that these findings may bring new insight for developing synergistic treatment strategies against bacterial infectious diseases or pathogenic bacterial polluted environments.

关键词： Antibacterial Ag_(3)PO_(4) Defective TiO_(2) Photocatalytic Puncture

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山地与极地冰川表面生态系统DNA病毒的多样性与功能

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Science Bulletin 2023年第20期68卷 2418-2433,M0006页

作者：刘勇勤焦念志钟旭臧琳张锐肖湘施一张志好陶晔白丽萍高变利杨芸兰黄星煜计慕侃刘军志刘鹏飞姚檀栋 Center for Pan-third Pole Environment Lanzhou UniversityLanzhou 730000China State Key Laboratory of Tibetan Plateau Earth System Resources and Environment(TPESRE)Institute of Tibetan Plateau ResearchChinese Academy of SciencesBeijing 100101China University of Chinese Academy of Sciences Beijing 100101China State Key Laboratory of Marine Environmental Science College of Ocean and Earth SciencesXiamen UniversityXiamen 361005China Department of Earth Oceanand Atmospheric SciencesThe University of British ColumbiaVancouver V6T 1Z4Canada Institute for Advanced Study Shenzhen UniversityShenzhen 518000China State Key Laboratory of Microbial Metabolism School of Life Sciences and BiotechnologyShanghai Jiao Tong UniversityShanghai 200240China CAS Key Laboratory of Pathogenic Microbiology and Immunology Institute of MicrobiologyChinese Academy of SciencesBeijing 100101China State Key Laboratory of Lake Science and Environment Nanjing Institute of Geography and LimnologyChinese Academy of SciencesNanjing 210008China Key Laboratory of Development and Application of Rural Renewable Energy Biogas Institute of Ministry of Agriculture and Rural AffairsChengdu 610041China

冰川覆盖了地球表面的10%,是典型的极端环境.病毒在冰川表面生态系统中丰富且活跃,在控制微生物群落中发挥关键作用.然而,我们对冰川表面生态系统病毒及其对下游生态系统的潜在影响了解非常有限.本研究构建了冰川表面生态系统DNA病毒基... 详细信息

冰川覆盖了地球表面的10%,是典型的极端环境.病毒在冰川表面生态系统中丰富且活跃,在控制微生物群落中发挥关键作用.然而,我们对冰川表面生态系统病毒及其对下游生态系统的潜在影响了解非常有限.本研究构建了冰川表面生态系统DNA病毒基因组数据集(SgVG),将已有冰川DNA病毒基因组数量扩展了15倍.数据集包含了来自全球38个山地和极地冰川,涵盖雪、冰、融水和冰尘的10,840个DNA病毒物种.冰川表面DNA病毒特异性高,但对公众健康的潜在风险极低.冰川表面病毒群落结构主要受生境影响,且冰尘病毒最为活跃.裂解性病毒在所有生境中普遍存在,而雪和冰中溶源性病毒的相对比例较高.此外,冰川表面病毒可侵染冰川中83%的门或纲的原核微生物,并且能够编码具有促进宿主代谢和协助宿主适应寒冷环境等功能的多种辅助代谢基因.本研究系统地描述了山地和极地冰川表面生态系统DNA病毒的多样性和功能,为评估冰川DNA病毒的生态功能、安全风险及构建区域生态模型提供了重要科学依据.

关键词：生态系统地球表面生态模型极端环境寒冷环境溶源性原核微生物相对比例

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37-2:Invited Paper:Intermolecular Charge Transfer for High-Performance Organic Light-Emitting Diodes

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 312-312页

作者： Zhen Zhang Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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P-15.30: Thermally Activated Delayed Fluorescent Host for Highly Efficient Deep-Red OLEDs

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 1524-1524页

作者： Panpan Zang Youjun Wu Zhen Zhang Peng Wu Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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