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Digital Holography and Three-Dimensional Imaging, DH 2022

作者： Shui, Xinghua Zheng, Huadong Department of Precision Mechanical Engineering Shanghai University Shanghai200444 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai200072 China

Unsupervised-learning based computer-generated holography provides an approach for 2D hologram generation. We propose an unsupervised learning network for multi-depth hologram generation with fully utilizing the diffe... 详细信息

ISBN: (纸本)9781957171128

关键词： Holograms

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Performance Optimization of Target Detection Based on Edge-to-Cloud Deep Learning 18

Performance Optimization of Target Detection Based on Edge-t...

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Colloidal Nanoparticles for Biomedical applications XVIII 2023

作者： Fan, ZhongKui Guan, YePeng School of Communication and Information Engineering Shanghai University Shanghai China Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai200444 China

ISBN: (纸本)9781510658950

With the development of mobile internet, real-time target detection using mobile devices has wide application prospects, but the computing power of the terminal greatly limits the speed and accuracy of target detection. Edge-cloud collaborative computing is the main method to solve the lack of computing power of mobile terminals. The current method can't settle the problem of computation scheduling in the edge-cloud collaboration system. Given the existing problems, this paper proposes the pruning technology of classical target detection deep learning networks;training and prediction offloading strategy of edge-to-cloud deep learning network;dynamic load balancing migration strategy based on CPU, memory, bandwidth, and disk state-changing in cluster. After testing, the edge-to-cloud deep learning method can reduce the inference delay by 50% and increase the system throughput by 40%. The maximum waiting time for operation can be reduced by about 20%. The efficiency and accuracy of target detection are effectively improved. © 2023 SPIE.

关键词： Deep learning

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Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes 21

Finite Element Simulation of Electrothermal and Mechanical C...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Yang, Zhu Li, Jianxin Fu, Hao Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobuteneBCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes. ©2024 IEEE.

关键词： Computer resource management

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Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection 21

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interco...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Meng, Xinhui Wang, Kefeng Fan, Hong Yang, Zhu Fu, Hao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED displays have garnered widespread attention due to their high resolution, high brightness, and long lifespan. However, the heterogeneous integration and the reliability of Micro-LEDs pose significant challenges for their commercialization. As Micro-LED products develop towards larger sizes and narrower pitches, the Au/In bonding process has become a prevalent strategy for achieving high-resolution interconnections. To address the issue of the life span being affected by the plastic deformation of indium bumps, which ultimately fail in the form of yielding, an Au/In-resin hybrid bonding technique to improve the reliability of high-resolution Micro-LEDs was proposed in this paper. The reliability of the flip-chip bonding structure of a 4×4 Micro-LED array was analyzed using ANSYS simulation software and finite element methods. The Anand unified viscoplastic constitutive model was employed for both indium bumps and the encapsulating resin. The model was subjected to temperature cycling loads ranging from -55℃ to 125℃ in accordance with the JEDEC temperature cycling standard. The Coffin-Manson fatigue life prediction model, which accounts for plastic strain in materials, was introduced to estimate the thermal cycling fatigue life of the Micro-LED interconnection structures. The equivalent plastic strain range of hybrid bonding device was 6.708×10-3, surpassing the 7.59×10-3observed in device with conventional bump bonding. The hybrid bonding device exhibited a thermal cycling life of 12747 cycles, which was about 36% longer than that of the bump bonding device. It suggests that resin helps to extend the thermal cycling life of the device and enhance its reliability. ©2024 IEEE.

关键词： Flip chip devices

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Linker aggregation engineering of TADF materials to tune carrierbalance for highly efﬁcient organic LEDs with long operationallifetime

Aggregate

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Aggregate 2024年第5期5卷 385-393页

作者： Zhen Zhang Rongrong Xia Ke Wang Youjun Wu Panpan Zang Xuemin Gan Zhangcheng Liao Bin Wei Peng Wu Stefan Bräse Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of EducationShanghai UniversityShanghaiChina Institute of Organic Chemistry Karlsruhe Institute of Technology(KIT)KarlsruheGermany Institute of Biological and Chemical Systems-Functional Molecular Systems(IBCS-FMS) Karlsruhe Institute of Technology(KIT)KarlsruheGermany

Thermally activated delayedﬂuorescence(TADF)molecules are regarded as promis-ing materials for realizing high-performance organic light-emitting diodes(OLEDs).The connecting groups between donor(D)and acceptor(A)units in D–A type TADF molecules could affect the charge transfer and luminescence performance of TADF materials in aggregated *** this work,we design and synthesize four TADF molecules using planar and twisted linkers to connect the aza-azulene donor(D)and triazine acceptor(A).Compared with planar linkers,the twisted ones(Az-NP-T and Az-NN-T)can enhance A–A aggregation interaction between adjacent molecules to balance hole and electron *** a result,highly efﬁcient and stable deep-red top-emission OLEDs with a high electroluminescence efﬁciency of 57.3%and an impressive long operational lifetime(LT_(95)∼30,000 h,initial luminance of 1000 cd m^(-2))are *** study provides a new strategy for designing more efﬁ-cient and stable electroluminescent devices through linker aggregation engineering in donor–acceptor molecules.

关键词： acceptor stacking balanced carrier transfer host materials long device lifetime thermally activated delayedﬂuorescence

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Advancements in graphene-based composites: A review of the emerging applications in healthcare

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Smart Materials in Medicine 2025年第1期6卷 120-138页

作者： Batool, Farwa Muhammad, Saz Muazzam, Rabia Waqas, Muhammad Ullah, Zia Roy, Shubham Zhang, Yinghe Wang, Ke Guo, Bing Department of Chemistry Lahore Garrison University DHA Phase VI Lahore Pakistan School of System Design and Intelligent Manufacturing Southern University of Science and Technology Shenzhen518055 China School of Science Shenzhen Key Laboratory of Flexible Printed Electronics Technology Shenzhen Key Laboratory of Advanced Functional Carbon Materials Research and Comprehensive Application Harbin Institute of Technology Shenzhen518055 China Government Queen Mary Graduate College Lahore Pakistan

Graphene and related materials are emerging revolutionary materials due to fascinating stimuli-responsive physiochemical properties having widespread applications in developing advanced nano-systems for detection, diagnostics, and therapeutics in biomedical fields. Various materials like metal nanoparticles, polymers, dyes, drugs, and proteins could be combined yielding graphene-based composite materials (GBCMs) to synergistically fulfill different biomedical requirements. The 2D conjugated structure, easy surface functionalization via covalent or van der Waal interactions, and combination with different components for versatile functionalities altogether contribute to the development of GBCM for healthcare applications. This review specifically focuses on GBCMs and discusses specific material properties relevant to their material applications in healthcare. Furthermore, the synthesis, toxicity, and biocompatibility of these GBCMs, and their interactions with biological materials are thoroughly discussed. Importantly, the recent cutting-edge applications in the field of healthcare, including its role in the development of antibacterial, anti-viral, and photothermal therapies, wound healing, drug delivery, neurodegenerative disease therapy, and biosensing based on GBCMs are well-updated. Additionally, the applications of GBCMs in point-of-care devices, wearable electronics, and tissue engineering are well summarized. We hope this review opens up more possibilities to design more innovative healthcare materials derived from graphene. © 2025 The Authors

关键词： Biocompatibility

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Color liquid crystal grating based color holographic 3D display system with large viewing angle

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Light(Science & applications) 2024年第1期13卷 103-112页

作者： Di Wang Yi-Long Li Fan Chu Nan-Nan Li Zhao-Song Li Sin-Doo Lee Zhong-Quan Nie Chao Liu Qiong-Hua Wang School of Instrumentation and Optoelectronic Engineering Beihang UniversityBeijing 100191China State Key Laboratory of Virtual Reality Technology and Systems Beihang UniversityBeijing 100191China Display Technology Research Center Seoul National UniversityGwanak-ro 1Gwanak-guSeoul 08826Republic of Korea Key Lab of Advanced Transducers and Intelligent Control System Ministry of EducationTaiyuan University of TechnologyTaiyuan 030024China

Holographic 3D display is highly desirable for numerous applications ranging from medical treatments to military ***,it is challenging to simultaneously achieve large viewing angle and high-fidelity color reconstruction due to the intractable constraints of existing ***,we conceptually propose and experimentally demonstrate a simple and feasible pathway of using a well-designed color liquid crystal grating to overcome the inevitable chromatic aberration and enlarge the holographic viewing angle,thus enabling large-viewing-angle and color holographic 3D *** use of color liquid crystal grating allows performing secondary diffraction modulation on red,green and blue reproduced images simultaneously and extending the viewing angle in the holographic 3D display *** principle,a chromatic aberration-free hologram generation mechanism in combination with the color liquid crystal grating is proposed to pave the way for on such a superior holographic 3D *** proposed system shows a color viewing angle of~50.12°,which is about 7 times that of the traditional system with a single spatial light *** work presents a paradigm for achieving desirable holographic 3D display,and is expected to provide a new way for the wide application of holographic display.

关键词： holographic angle crystal

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Global optimization of process parameters for low-temperature SiN_(x) based on orthogonal experiments

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Advances in Manufacturing 2023年第2期11卷 181-190页

作者： Lian-Qiao Yang Chi Zhang Wen-Lei Li Guo-He Liu Jia-Qi Wu-Ma Jin-Qiang Liu Jian-Hua Zhang School of Materials Science and Engineering Shanghai UniversityShanghai200444People's Republic of China Key Laboratory of Advanced Display and System Applications Ministry of EducationShanghai UniversityShanghai200072People's Republic of China Huawei Technologies Co. LtdShanghai200120People's Republic of China

Low-temperature silicon nitride(SiNx)films deposited by plasma-enhanced chemical vapor deposition(PECVD)have huge application potential in the flexible ***,the applicability of SiNx largely depends on the film’s general properties,including flexibility,deposition rate,residual stress,elastic modulus,fracture strain,dielectric constant,refraction index,*** optimization towards specific application by conventional experiment design needs lots of work due to the interaction of muti quality and process ***,an efficient global optimization approach for the process technology was proposed based on the Taguchi orthogonal experiment method considering muti-factor *** of all,the Taguchi orthogonal experiment design and analysis was used to rank the influences of main process parameters on the quality characteristics,including radio frequency(RF)power,pressure,silane flow rate,ammonia flow rate and nitrogen flow ***,the global optimization approach was carried out utilizing the multi-response optimizer considering the combination target of film formation rate,residual stress,dielectric constant,elastic modulus,fracture strain,refractive ***,the optimal solution of the SiNx film was finally obtained and verified.

关键词： Plasma-enhanced chemical vapor deposition(PECVD) Low-temperature silicon nitride(SiNx) Flexible display Taguchi orthogonal experiment Process optimization

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Analysis and Research Based on Electrohydrodynamic Inkjet Printing 21

Analysis and Research Based on Electrohydrodynamic Inkjet Pr...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Chen, Zhaoyu Wang, Xinyi Yin, Luqiao Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai200072 China School of Microelectronics Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University 201800 China

ISBN: (纸本)9798331541149

Electrohydrodynamic (EHD) inkjet printing has the advantages of high precision and high automation, and its forming mechanism is complex. In this paper, the stress of Taylor cone and its influencing factors were analyzed systematically, and explored the influence of different process parameters on the printing process and effect. The results showed that the larger the voltage, the larger the droplet;the longer the cycle and voltage duration, the larger the droplet;the droplet size was linear with voltage and period. The influence of the printing height on the droplet size was very obvious. Excessive voltage made the printing process very unstable and inaccurate, and the droplet size gap was large and the droplet printing position deviated. Hope to provide some ideas for related research. ©2024 IEEE.

关键词： Ink jet printing

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Flexible Active-matrix Micro-LED display Utilizing InSnO TFTs with High Mobility of 39.1 cm2V-1s-1 and Mass-production Compatible Process

Flexible Active-matrix Micro-LED Display Utilizing InSnO TFT...

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2024 IEEE International Electron Devices Meeting, IEDM 2024

作者： Yu, Zuoxu Sang, Yimeng Zhang, Yuzhen Zhang, Yiyang Shi, Runxiao Liu, Siyang Tao, Tao Li, Xifeng Peng, Cong Zhang, Rong Wu, Wangran Zhuang, Zhe Liu, Bin Sun, Weifeng School of Integrated Circuits National ASIC System Engineering Research Center Southeast University Nanjing China Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials School of Electronic Science and Engineering Nanjing University Nanjing China School of Integrated Circuits Nanjing University Suzhou China Key Laboratory of Advanced Display and System Applications of the Ministry of Education Shanghai University Shanghai China

ISBN: (纸本)9798350365429

The increasing pursuit of ultrahigh resolution displays has driven the demand for thin film transistors (TFTs) with higher mobility, especially on flexible substrates. In this work, we developed InSnO (ITO) TFTs on flexible substrates and achieved a remarkable average mobility of 39.1 cm2V-1s-1, via mass-production compatible processes utilizing SiO2 gate dielectric. Benefiting from the ultra-flat surface and extremely low coefficient of thermal expansion (CTE) of our PI substrate, the ITO TFTs exhibit excellent wafer-scale uniformity, reliable mechanical flexibility, and robust bending durability. Based on the ITO TFTs, we fabricated flexible 2T1C pixel circuits that can operate in both PAM and PWM schemes. The flip-chip micro-LEDs (μ-LEDs) were transferred to a flexible PI holder nondestructively with the assistance of UV tape and present superior robustness and endurance under cyclic bending. Moreover, we bonded μ-LEDs to the 2T1C pixel circuits and demonstrated a flexible active-matrix μ-LED display. The feasibility of flexible illumination and image control has been verified, providing great potential for high-resolution flexible displays in the future. © 2024 IEEE.

关键词： Thin film transistors

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