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International Conference on Artificial Intelligence and Computational Intelligence (AICI)

作者： Yue-li Hu Yan Zhang Bin Sun Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China Shanghai University Shanghai Shanghai CN

KEELOQ code hopping technology is a nonlinear anti-encryption algorithm designed for secure Remote keyless Entry (RKE) systems. It combines a 66-bits transmission length, so as to prevent the system from code predicting, code grabbing and code scanning. Because of its feature of high-security, it effectively overcomes the disadvantages of the traditional fixed code technology. This paper researched on KEELOQ encryption algorithm and presented a designed RKE system based on KEELOQ technology. When the software and hardware were designed, the whole RKE system was afterwards made as a prototype for the functionality tests. The experimental results showed that the design achieved the anticipative effects.

关键词： Cryptography Decoding Information security Counting circuits Automation Laboratories Algorithm design and analysis NIST Data security Manufacturing

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Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Adhesion behavior between epoxy molding compound and differe...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Li, Xu Xiuzhen, Lu Johan, Liu Xinyu, Du Yan, Zhang Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane. ©2009 IEEE.

关键词： Adhesion

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Scheduling of balancing WSC for minimum IP testing time

Scheduling of balancing WSC for minimum IP testing time

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Institution of Engineering and Technology International Communication Conference on Wireless Mobile and Computing

作者： Zhang, Jinyi Cai, Wanlin Li, Jiao Huang, Xuhui Weng, Hanyi Key Laboratory of Special Fiber Optics and Optical Access Networks Ministry of Education Shanghai University No. 149 Yanchang Road Shanghai 200072 China Microelectronic Research and Development Center Shanghai University No. 149 Yanchang Road Shanghai 200072 China Key Laboratory of Advanced Displays and system Application Ministry of Education Shanghai University No. 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9781849191388

Today the research on designing for testability is becoming very important in the filed of SoC. However, the traditional research is limited in top level of SoC. It does not really guarantee to improve the utilization of test resource of SoC and reduce the test time effectively in theory. This paper proposes that the focus of study will be extended to the IP core level. We can reduce the percentage of idle test time and achieve the minimum of test time in various IP cores through the establishment of scheduling strategy of balancing WSC (Wrapper Scan Chain) and the exchange ISC (Inter Scan Chain) heuristic algorithm. In this paper, we verify the scheduling strategy of balancing WSC in algorithm and reusability upon the ITC'02 benchmarks. The results show that the vast majority of percentage of idle test time is much less than 1% in the relationship set between the number m of balanced WSC and the test time TIP within each IP core. The results also can verify the importance of the research programme which is implemented in IP core level for improving the utilization of test resource and reducing the test time effectively in SOC.

关键词： Scheduling

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A remote medical monitoring system based on GSM network

A remote medical monitoring system based on GSM network

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Institution of Engineering and Technology International Communication Conference on Wireless Mobile and Computing

作者： Meihua, Xu Yu, Fei Fangjie, Zhao Qian, Zhu Microelectronic Research and Development Center Shanghai University 149 Yanchang Rd. Shanghai China School of Mechatronical Engineering and Automation Shanghai University 149 Yanchang Rd. Shanghai China Key Laboratory of Advanced Displays and system Application Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai China

ISBN: (纸本)9781849191388

This paper presents a remote medical monitoring system based on GSM (Global system for Mobile communications) network. It is a kind of family medical network system. Firstly, the system structure of the monitoring system is proposed, and then the design of each module is introduced. This system takes advantage of the powerful GSM network to implement remote communication in the form of short messages and uses FPGA as the control center to realize the family medical monitoring network.

关键词： Field programmable gate arrays (FPGA)

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Modeling of heat transfer performance for an array of micro jets impinging upon dimpled surface

Modeling of heat transfer performance for an array of micro ...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Tian-yi Geng Jing-yu Fan Yan Zhang Shun Wang Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai China

The present paper paid particular attention to the flow and heat transfer performance for an array of micro jets impinging upon the dimpled surface by means of CFD modeling. The modeling of a three-by-four jet array impinging upon the smooth, concave- and convex-dimpled surfaces was carried out based on the solution of the steady, incompressible and three-dimensional RANS and energy equations by employing the RNG k-epsiv turbulence model. It has been demonstrated from the present study that the heat transfer performance for an array of the micro jets impinging onto the concave- or convex-dimpled surfaces tends to be somewhat attenuated or augmented in the impingement region, respectively, as compared with that onto the smooth one. And the variational trend with respect to the Nusselt number distribution in the inter-jet region appears to be inconsistent with that in the impingement region. In addition, the flow pattern and primary mechanism by which the smooth, concave- and convex-dimpled surfaces significantly affect the flow field and heat transfer are analyzed and discussed.

关键词： Heat transfer Heat sinks Rough surfaces Surface roughness Microstructure Microchannel Temperature Thermal stresses Electronics cooling Geometry

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Carbon nanotubes as cooling fins in microelectronic systems

Carbon nanotubes as cooling fins in microelectronic systems

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IEEE Conference on Nanotechnology

作者： Yifeng Fu Teng Wang Johan Liu Xiaojing Wang Yan Zhang SMIT Center & Bionano Systems Laboratory Department of Microtechnology and nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Shanghai University Shanghai China

ISBN: (纸本)9781424448326

Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.

关键词： Carbon nanotubes Microelectronics Heat sinks Laboratories Electronics cooling Thermal management of electronics Thermal management Heat engines Electronic components Inorganic materials

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Novel moving object segmentation algorithm using kernel density estimation and edge information

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Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics 2009年第2期21卷 223-228页

作者： Gu, Jiandong Liu, Zhi Zhang, Zhaoyang School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Application Shanghai 200072 China

This paper proposes a novel moving object segmentation algorithm based on kernel density estimation and edge information to solve the color similarity problem between foreground and background. During the stage of foreground/background modeling, both color feature and edge feature arc used to build two probability models. Under the framework of Markov random field (MRF), three energy terms associated with the likelihood of foreground/background, spatial continuity and temporal consistency are introduced to construct a graph, and the graph cut method is exploited to reliably segment moving objects. Experimental results demonstrate that the proposed algorithm reduces the segmentation error when foreground and background show similar colors, and greatly enhances the segmentation robustness during the whole video sequence.

关键词： Color

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Study on moisture behavior in flip chip BGA packages and bake process optimization

Study on moisture behavior in flip chip BGA packages and bak...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： W.Q. Dai Z.K. Hua J.H. Dai E.W. Pang L. Jiang C.Y. Li P. Liao J.H. Zhang Intel Products (Shanghai) Company Limited China Key Laboratory of Advanced Display and System Applications Ministry of Education School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai China

The lead-free (LF) and halogen-free (HF) ldquogreenrdquo initiatives are driving the advanced packaging manufacturers to develop new generation materials and assembly technologies. However, the moisture related reliability issues become the significant technical challenge to meet stringent reliability and quality standards comparing to the previous Lead and halogen technology. In this study, the moisture absorption and desorption performance of halogen free and lead free material were investigated. The experimental data revealed that after fully baked process there was still some resident moisture which was mainly contained at substrate level. The modeling data of moisture absorption and desorption behavior with 125degC bake comparison was discussed and was fully aligned with experimental data. Moreover, a dasiasoft bakepsila method via Nitrogen and dry air was introduced. In low RH effect test, under 25degC / 60%RH precondition process, all the moisture absorbed for 1100 hours can be removed by dasiasoftpsila bake. This indicates that not only no moisture absorption in low RH environment, but also an additional dasiasoft bakepsila process occurring during the storage time. The results demonstrated that the storage of moisture-sensitive material in the optimized environment is an attractive facility solution which can reduce the risk of popcorn and cracking problems.

关键词： Moisture Flip chip Packaging Environmentally friendly manufacturing techniques Absorption Material storage Hafnium Assembly Nitrogen Testing

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Research on Fuzzy Semantic Service Matchmaking

Research on Fuzzy Semantic Service Matchmaking

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International Conference on BioMedical Engineering and Informatics (BMEI)

作者： Dexin Zhao Zhiyong Feng Degan Zhang Key Laboratory of Advanced Displays and System Application Ministry of Education Tianjin China Tianjin Key Laboratory of Intelligence Computing & Novel Software Technology Tianjin University of Technology Tianjin China School of Computer Science and Technology Tianjin University TJU Tianjin China

ISBN: (纸本)9781424441327

The traditional syntactic service matchmaking is lack of semantic information with machine understandable, so it can not achieve intelligent service discovery. In this paper, the fuzzy nature of matchmaking is considered, and the conceptions of linguistic variables in fuzzy logics are introduced into service matchmaker. The matchmaking linguistic variables and the fuzzy relationship matrix are defined, and conjunction degree of fuzzy key words sets is proposed to solve the semantic match problem between service description and service request. The research provides a new valuable way for studying intelligent service discovery.

关键词： Web services Fuzzy logic Machine intelligence Laboratories Fuzzy sets Semantic Web Service oriented architecture Intelligent networks Natural languages Computer vision

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Scheduling of balancing WSC for minimum IP testing time

Scheduling of balancing WSC for minimum IP testing time

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IET International Communication Conference on Wireless Mobile and Computing (CCWMC 2009)

作者： Jinyi Zhang Wanlin Cai Jiao Li Xuhui Huang Hanyi Weng Key Laboratory of Advanced Displays and system Application Ministry of Education Shanghai University Shanghai China Microelectronic Research & Development Center Shanghai University Shanghai China Key Laboratory of Special Fiber Optics and Optical Access Networks (Shanghai University) Ministry of Education

Today the research on designing for testability is becoming very important in the filed of SoC. However, the traditional research is limited in top level of SoC. It does not really guarantee to improve the utilization of test resource of SoC and reduce the test time effectively in theory. This paper proposes that the focus of study will be extended to the IP core level. We can reduce the percentage of idle test time and achieve the minimum of test time in various IP cores through the establishment of scheduling strategy of balancing WSC (Wrapper Scan Chain) and the exchange ISC (Inter Scan Chain) heuristic algorithm. In this paper, we verify the scheduling strategy of balancing WSC in algorithm and reusability upon the ITC'02 benchmarks. The results show that the vast majority of percentage of idle test time is much less than 1% in the relationship set between the number m of balanced WSC and the test time T IP within each IP core. The results also can verify the importance of the research programme which is implemented in IP core level for improving the utilization of test resource and reducing the test time effectively in SOC.

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