检索结果-内蒙古大学图书馆

Monolithically Integrated Temperature Sensor Based on p-GaN/AlGaN/GaN Heterostructure

Monolithically Integrated Temperature Sensor Based on p-GaN/...

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Qingxin Liu Kailin Ren Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai China Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

A monolithically integrated temperature sensor circuit based on a p-GaN/AlGaN/GaN heterojunction is proposed. The sensor comprises two parts: the first part is a temperature-sensitive voltage source formed by a two-dimensional electron gas (2DEG) resistor and a schottky barrier diode (SBD) in series, and the second part is a resistor-transistor logic (RTL) inverter formed by a 2DEG resistor and a p-GaN high electron mobility transistor (HEMT) in series. The output voltage of the temperature-sensitive voltage source is connected to the gate of the p-GaN HEMT in the second part, providing the gate voltage. According to data obtained from TCAD simulation results, the output voltage of the temperature-sensitive voltage source exhibits positive temperature dependence. The output voltage of the RTL inverter exhibits a negative temperature dependence. When the temperature sensor is properly biased, the voltage division between the SBD and the 2DEG resistor in the temperature-sensitive voltage source reallocates as the temperature rises, causing the gate voltage of the connected RTL inverter to increase. This increasement enhances the temperature-induced variation in the RTL inverter's output voltage, increasing the sensitivity of the temperature sensing circuit from 4 mV/K with a fixed gate voltage to 14 mV/K. This simulation demonstrates a compact monolithic integration sensor for monitoring the on-chip temperature of GaN power integrated circuits for protection and control.

关键词： Temperature sensors Resistors Temperature dependence Sensitivity HEMTs Logic gates Thermal management Inverters system-on-chip MODFETs

来源：评论

学校读者我要写书评

暂无评论

The effect of thermal cycling on nanoparticle reinforced composite lead-free solder

The effect of thermal cycling on nanoparticle reinforced com...

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Si Chen Zhaonian Cheng Johan Liu Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

The effects of thermal cycling on shear strength and fracture mode of the nanosized Sn-3.0Ag-0.5Cu particulates reinforced Sn-58Bi composite solder were investigated in this paper. By using a self developed top-down method named Consumable-electrode Direct Current Arc technique, the Sn-3.0Ag-0.5Cu nanoparticles were successfully manufactured. The primary particle size of Sn-3.0Ag-0.5Cu nanoparticles ranged from 20nm to 80nm. Sn-3.0Ag-0.5Cu nanoparticles with different weight percentages were mixed into commercial Sn-58Bi solder paste in order to develop a composite solder paste which is lead-free and possess high strength and low melting point. Following the conventional surface-mount technology process, the 1206 chip resistor and ENIG/Cu pad were joined by the composite solder. Scanning electron microscope, transmission electron microscope and optical microscope were employed to observe the morphology of nanoparticles, microstructure of solder matrix, fracture mode after shear test and crack after thermal cycling. The experimental results indicated that before thermal cycling all composite solders' shear strength increased greatly compared to Sn-58Bi solder making them comparable to Sn-3.0Ag-0.5Cu solder. The fracture surfaces of all composite solder joints occurred at the interface between the solder matrix and the resistor termination. After thermal cycling, the shear strength of the composite solders was at a constant value. However, when the weight percentages of Sn-3.0Ag-0.5Cu nanoparticles exceeded a certain value, the shear strength of composite solder joints decreased rapidly and the case of solder brittle fracture increased as the nanoparticles content increased.

关键词： Environmentally friendly manufacturing techniques Lead Nanoparticles Optical microscopy Scanning electron microscopy Transmission electron microscopy Resistors Soldering Surface-mount technology Electron optics

来源：评论

学校读者我要写书评

暂无评论

A Molecular Strategy to Ni45pt55@Nc Nanoparticles as Efficient and Robust Electrocatalyst for Hydrogen Evolution Reaction

SSRN

引用

SSRN 2022年

作者： Dong, Qingchen Xia, Weizhen Cheng, Xiaozhe Wu, Jian Gou, Wangyan Qu, Yongquan MOE Key Laboratory of Advanced Display and System Applications Shanghai University 149 Yanchang Road Jingan District Shanghai200072 China School of Mechanical & Electronic Engineering and Automation Shanghai University 99 Shangda Road Baoshan District Shanghai200444 China MOE Key Laboratory of Interface Science and Engineering in Advanced Materials Taiyuan University of Technology 79 Yingze West Street Taiyuan030024 China

Metallopolymers have garnered enormously attention as one of the most promising functional materials in recent years. The earth-abundant transition metal alloyed Pt-based nanoparticles (NPs) as pyrolyzed from metallopolymers show appealing prospects in decreasing the Pt-loading amount and enhancing the long-term stability of electrocatalysts. Herein, we reported a molecular strategy for preparation of efficient electrocatalyst of N-doped Ni45Pt55@NC NPs by employing a new-designed metallopolymer P-NiPt as precursor. The morphology, size, and composition of the resultant Ni45Pt55@NC NPs were fully characterized. The results of electrocatalysis experiments indicate that the resultant Ni45Pt55@NC NPs possess outstanding HER electrocatalytic activity with a low Pt-loading amount of 8.35 wt% in 0.5 M H2SO4 electrolyte. The calculated mass activity of Ni45Pt55@NC NPs at the overpotential of 30 mV is 0.232 A/mgPt, which was twice of that of commercial Pt/C (0.085 A/mgPt). In the meantime, the Ni45Pt55@NC NPs display excellent long-term catalytic stability in acid media. We found that such improved HER catalytic activity and stability with low Pt-loading amount could be mainly credited to the interaction between Ni and Pt atoms by the DFT calculation modelling. In a word, this work demonstrates a promising approach to develop efficient and robust electrocatalysts with controllable Pt-loading amount via the molecular strategy. © 2022, The Authors. All rights reserved.

关键词： Electrocatalysts

来源：评论

学校读者我要写书评

暂无评论

Thermodynamic simulation of 6×6 Micro-LED array in flip-chip bonding

Thermodynamic simulation of 6×6 Micro-LED array in flip-chi...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Mechatronics and Automation Shanghai University Shanghai China School of Microelectronics Shanghai University Shanghai China

In this paper, we first simulated the influence of different diameters, heights and shapes on the In bumps by ANSYS simulation software. The results show that the changes of these conditions affect the deformation and stress of the In bumps to varying degrees. The height of the bumps has the least effect on the stress, while the diameter and shape of the bumps have a great effect on the deformation as well as stress. Finally, a sapphire based Mirco-LED array with a pixel pitch size of 7.5 μm was used to bond with silicon substrates with In bumps of different heights, and turn it on with electricity. We found that the In bumps height does affect the yield of Micro-LED, and the best yield in the experiment is > 90%. This study provides a theoretical basis for reducing the deformation and stress of In bumps during flip-chip bonding, and an experimental basis for improving bond yield and device performance.

关键词： Thermodynamics Deformation Shape Simulation Software Silicon Flip-chip devices

来源：评论

学校读者我要写书评

暂无评论

Compact Printed Monopole Antenna on Liquid Crystal Polymer (LCP) for EWB applications

Compact Printed Monopole Antenna on Liquid Crystal Polymer (...

引用

2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)

作者： Xiao-Rong Yan Shun-Shi Zhong Xia Zhang School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterShang

A compact tapered CPW-fed hollowed printed monopole antenna on the liquid crystal polymer (LCP) substrate with an extremely wide bandwidth (EWB) is introduced. The simulated results demonstrate that this antenna achieves an impedance bandwidth from 0.435GHz to 14.52GHz (33:1) for VSWR≤,and exhibits a nearly omnidirectional radiation pattern,while its area is only about 0.18λ1×0.13λ1,where λ1 is the wavelength of the lowest operating frequency.

关键词： Liquid crystal polymers Bandwidth Impedance Frequency Antenna radiation patterns Coplanar waveguides Packaging Computational modeling Broadband antennas Costs

来源：评论

学校读者我要写书评

暂无评论

FEM simulation of bimodal and trimodal thermally conductive adhesives

FEM simulation of bimodal and trimodal thermally conductive ...

引用

IEEE Conference on Nanotechnology

作者： Nabi Nabiollahi Johan Liu Zhu Hilli Yan Zhang Yue Cong Zhaonian Cheng Masahiro Inoue Bio Nano science laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Ministry of Education and SMIT Center Shanghai University Shanghai China The Institute of Scientific and Industrial Research Osaka University Osaka Japan

ISBN: (纸本)9781424448326

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

关键词： Thermal conductivity Conductive adhesives Thermal resistance Mathematical model Analytical models Finite element methods Contact resistance MATLAB Electric resistance Conducting materials

来源：评论

学校读者我要写书评

暂无评论

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Study on the adhesion strength of new nano-structured polyme...

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Lei Zhang Xiuzhen Lu Xin Luo Björn Carlberg Masoud Zandira Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden

With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.

关键词： Materials Electronic packaging thermal management Thermal resistance Metals Heating Reliability Thermal conductivity

来源：评论

学校读者我要写书评

暂无评论

Microstructures of ZnO electrospun nanofibers on AZO glass

Microstructures of ZnO electrospun nanofibers on AZO glass

引用

The 2014 International Conference on Materials Science and Engineering Technology(MSET 2014)

作者： Xiuzhen Lu Yanyan Chang Mingtao Xu Bo Peng Key Laboratory of Advanced Display and System Applications Ministry of Education andSMIT CenterSchool of Mechatronic Engineering and AutomationShanghai University

ISBN: (纸本)9783038351023

ZnO electrospun nanofibers were considered to be potential novel materials in applications of photovoltaic devices and sensorsAZO glass was usually used in those devices as transparent electrodesZnO nanofibers on AZO glass were synthesized by electrospinning and calcination processScanning electron microscopy(SEM), transmission electron microscopy(TEM), Raman spectroscopy and photoluminescence(PL) spectrum was employed to investigate the morphology, structure and optical performance of ZnO nanofibersNetwork structure composed of sheet ZnO was observedRaman spectra and PL spectrum indicated the existence of defect states in the ZnO nanofibers.

关键词： ZnO nanofibers electrospinning AZO glass

来源：评论

学校读者我要写书评

暂无评论

Enhanced performance of ultraviolet organic light-emitting diode by using graphene oxide and MoO3 dual hole injection layer

引用

Physica Status Solidi (C) Current Topics in Solid State Physics 2017年第1-2期14卷 n/a-n/a页

作者： Liu, Liming You, Fengjiao Zheng, Qinghong Mo, Bingjie Zeng, Baoqing Wang, Honghang Zhang, Xiaowen Wei, Bin School of Physical Electronics University of Electronic Science and Technology of China Chengdu610054 China Guangxi Key Laboratory of Information Materials and School of Materials Science and Engineering Guilin University of Electronic Technology Guilin541004 China Zhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Zhongshan Institute Zhongshan528402 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China

A dual hole injection layer (d-HIL) composed of graphene oxide (GO) and transition metal oxide MoO3 is constructed and proven to be effectively promotes the radiance and external quantum efficiency (EQE) of ultraviolet organic light-emitting diode (UV OLED). The device with d-HIL behaves a maximum radiance of 4.7 mW/cm2 at 237.5 mA/cm2 and EQE of 1.36% at 3.75 mA/cm2, which have been enhanced by 27% and 19%, respectively, in comparison with the coun- terpart using conventional MoO3single HIL. The ultraviolet photoelectron spectroscopy elucidates that GO/MoO3 modification to the greatest extent enhances work function. The current-voltage characteristics and impedance spectroscopy of Hole-only devices clarify that GO/MoO3 d-HIL considerably promotes hole injection capacity. Our results indicate that the d-HIL of GO/MoO3 paves a way for constructing efficient UV OLED. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

关键词： Transition metals

来源：评论

学校读者我要写书评

暂无评论

High-order Finite-Volume Central Targeted ENO Family Scheme for Compressible Flows in Unstructured Meshes

arXiv

引用

arXiv 2023年

作者： Ma, Qihang Chong, Kai Leong Feng, Feng Zhang, Jianhua Wang, Bofu Zhou, Quan Shanghai Key Laboratory of Mechanics in Energy Engineering Shanghai Institute of Applied Mathematics and Mechanics School of Mechanics and Engineering Science Shanghai University Shanghai200072 China China Academy of Aerospace Science and Innovation Beijing100176 China Shanghai Institute of Aircraft Mechanics and Control Zhangwu Road Shanghai200092 China School of Microelectronics Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China Shanghai Frontier Science Center of Mechanoinformatics Shanghai University Shanghai200072 China

The high-order Target ENO (TENO) scheme, known for its innovative weighting strategy, has demonstrated strong potential for complex flow predictions. This study extends the TENO weighting approach to develop non-oscillatory central TENO (CTENO and CTENOZ) family schemes for unstructured meshes. The CTENO schemes employ compact directional stencils, which increase the likelihood of finding stencils within smooth regions. The design is intentionally compact to simplify the implementation of directional stencils. An effective scale separation strategy is adopted using an ENO-like stencil selection method, which employs large central stencils in smooth regions to achieve high-order accuracy, and smaller directional stencils near discontinuities to improve shock-capturing capabilities. Extensive tests involving CWENO, TENO, CTENO, and CTENOZ schemes were conducted to assess their performance in terms of accuracy, robustness, parallel scalability, and computational efficiency. The findings indicate that the proposed CTENO and CTENOZ schemes deliver high-order precision, lower numerical dissipation, and excellent shock-capturing performance. © 2023, CC BY.

关键词： Mesh generation

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：