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A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates

A compact V-band planar wideband bandpass filter based on Li...

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Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Dan Kuylenstierna Johan Liu Peng Cai Cristina Andersson James Morris Herbert Zirath Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory o fAdvanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China School of Electronics Jiangxi University of Finance and Economics Nanchang China Department of Electrical & Computer Engineering Portland State University Portland OR USA

The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either expensive or have inadequate performance. Liquid crystal polymers (LCPs), have attracted much more attention as advanced candidates as RF/microwave/mm-wave substrate materials for commercial wireless applications due to their combination of features and performance. In this paper, a compact V-band planar microstrip bandpass filter with sharp-rejection, low insertion-loss and wide-bandwidth based on the dual-mode ring resonator is proposed. The filter is fabricated on a LCP substrate by using standard processing technology. The proposed filter exhibits a return loss level better than 10 dB, an insertion loss of 5 dB, and a 3-dB bandwidth of 30%. The simulated and measured results are compared and agree well, which shows the promising potential of LCP laminates for flexible RF/microwave/mm-wave substrates.

关键词： Wideband Band pass filters Liquid crystal polymers Crystalline materials Radio frequency Microwave filters Resonator filters Microwave theory and techniques Microstrip filters Microstrip resonators

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Heat removal of microchannel coolers with Carbon NanoTube suspension as the coolant

Heat removal of microchannel coolers with Carbon NanoTube su...

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Electronics system-Integration Technology Conference, ESTC

作者： Yi Fan Yifeng Fu Teng Wang Johan Liu Yan Zhang Xiaojing Wang Zhaonian Cheng Key Laboratory of Advanced Display& System Applications (Ministry of Education) SMIT Center and School of AutomatIon and MechanIcal Engineering ShanghaiUniversity China SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanosciences (MC2)Chalmers University of Technology Gothenburg Sweden

The present work aims to study the heat dissipation capability of microchannel coolers with the coolant made of carbon NanoTube (CNT) suspension, which has been reported to have unusually good thermal properties. In this study, silicon microchannel coolers were prepared by the technique of deep ion reactive etching (DIRE). Stable and homogeneous CNT suspension was also produced. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The measurement results of the heat removal of the silicon microchannel cooler using CNT suspension and pure water as coolant were obtained. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop.

关键词： Microchannel Carbon nanotubes Coolants Silicon Cooling system testing Temperature measurement Etching Fluid flow control Temperature control

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Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder

Electrical and thermal properties of electrically conductive...

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Electronics system-Integration Technology Conference, ESTC

作者： Masahiro Inoue Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden The Institute of Scientific and Industrial Research Osaka University Ibaraki Osaka Japan Key Laboratory of Advanced Display and System Applications and SMIT Center Shanghai University Shanghai China

Heat resistant conductive adhesives composed of a multi-functional epoxy matrix containing Ag flakes were developed in this work. The adhesives are potentially stable up to 200-250degC because the primary relaxation mechanism of the matrix resin occurs at ~250degC. However, the adhesives appeared to exhibit another relaxation mechanism at an intermediate temperature range (100-180degC) when a mono-epoxide was added to the mixture as the reactive diluent. Adhesives cured under appropriate curing conditions exhibited relatively low electrical resistivity and high thermal conductivity in the in-plane direction. Because the reactive diluent influences the electrical and thermal properties as well as the thermo-mechanical properties of the adhesives, the selection of the most appropriate reactive diluent will be the key to developing conductive adhesives that exhibit superior heat resistance.

关键词： Thermal conductivity Conductive adhesives Resistance heating Curing Resins Conducting materials Viscosity Thermal management of electronics Thermal resistance Thermomechanical processes

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The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu -0.4Co eutectic solder and ENIG/Cu substrate finish

The effect of reflow temperature and time on the formation a...

引用

Electronics system-Integration Technology Conference, ESTC

作者： Lili Zhang Cristina Andersson Johan Liu Zhaonian Cheng Key Laboratory of Advanced Display & System Applications (Ministry of Education) SMIT Center SHU-Intel Joint Packaging Center School of Automation and Mechanical Engineering Shanghai University China SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Soldering with lead-free tin-based solder alloys demands substantially higher processing temperatures compared to conventional tin-lead solders, resulting in both significantly greater growth rates of Intermetallic Compounds (IMCs) and dissolution of surface finish layers. In this paper, the interfacial reactions between a new lead-free solder composition, eutectic Sn-0.7Cu- 0.4Co, and Electroless Nickel/ Immersion Gold (ENIG)/Cu surface finish have been investigated as a function of reflow temperature and reflow time. Three different soldering temperatures were used, namely, 240, 250 and 260degC, while the reflow time was varied between 2, 5, 10, 30, 60 and 120 min, respectively. The microstructure of the solder joints was observed by means of Scanning Electron Microscopy (SEM) and the chemical composition of the different phases was analyzed by means of Energy Dispersive X-ray (EDX), in order to study the relationship between interface IMC formation and reflow process parameters. The results show that the IMCs in the bulk solder matrix are different from those built at the interface between the solder and the surface finish layer. In the bulk solder only CoSn 2 IMCs were found. The reaction between the molten solder and electroless Ni layer resulted in formation of a ternary (Cu, Ni) 6 Sn 5 IMC at the interface. This interfacial IMC layer was continuous, and with a faceted morphology. The thickness of the IMC layer as a function of both reflow time and temperature was also investigated. The apparent activation energy was also obtained by using one reflow process with different reflow temperatures and times.

关键词： Temperature Kinetic theory Intermetallic Soldering Surface finishing Surface morphology Nickel Environmentally friendly manufacturing techniques Lead Scanning electron microscopy

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Recent progress of thermal interface materials

Recent progress of thermal interface materials

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Electronics system-Integration Technology Conference, ESTC

作者： Johan Liu Teng Wang Bjorn Carlberg Masahiro Inoue SMIT Center Chalmers University of Technology Göteborg Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center Shanghai University Shanghai China On leave from The Institute of Scientific and Industrial Research Osaka University Ibaraki Osaka Japan

This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced. The existing TIM technologies have been categorized into eight main types and comprehensively analyzed. The state-of-the-art-research is then summarized and discussed with an emphasis on the carbon-filled materials. Other aspects of the TIM-related research, including theoretical study, modeling work, and characterization etc., are also briefly covered.

关键词： Conducting materials Thermal conductivity Phase change materials Organic materials Carbon nanotubes Thermal engineering Thermal management Heat sinks Heat transfer Diamond-like carbon

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A Design for Increasing the Immunity to RFI of Protection IC of Lithium-ion Battery

A Design for Increasing the Immunity to RFI of Protection IC...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Dongfang Cheng Jue Zhang Xiaohui Li Jiongming Wang Key Laboratory of Advanced Displays and system Application Ministry of Education Microelectronic Research & Development Centre Shanghai University Shanghai China

Illustrated by the case of a lithium-ion battery protection IC, the paper focuses on the design of internal immunity to RFI. With analysis of the chip's three major elements of electromagnetic compatibility (EMC), the qualitative and quasi-quantitative analysis results of RFI influence to the chip are given out. By using a simple filter circuit and available material physical construction which can isolate, absorb and consume the RFI energy, the protection IC's electromagnetic susceptibility has been reduced effectively. The simulation of the devised structure in the time domain is gained by Winspice, and tool IC_EMC makes it possible of the conversion from time domain to frequency domain in which the spectrum analysis is completed. The design has passed the simulation verification and the layout implement of the devised construction designed is also available.

关键词： Integrated circuits Integrated circuit modeling Power transmission lines Immunity testing Grounding Batteries Electromagnetic compatibility

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Compact Printed Monopole Antenna on Liquid Crystal Polymer (LCP) for EWB applications

Compact Printed Monopole Antenna on Liquid Crystal Polymer (...

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2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)

作者： Xiao-Rong Yan Shun-Shi Zhong Xia Zhang School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterShang

A compact tapered CPW-fed hollowed printed monopole antenna on the liquid crystal polymer (LCP) substrate with an extremely wide bandwidth (EWB) is introduced. The simulated results demonstrate that this antenna achieves an impedance bandwidth from 0.435GHz to 14.52GHz (33:1) for VSWR≤,and exhibits a nearly omnidirectional radiation pattern,while its area is only about 0.18λ1×0.13λ1,where λ1 is the wavelength of the lowest operating frequency.

关键词： Liquid crystal polymers Bandwidth Impedance Frequency Antenna radiation patterns Coplanar waveguides Packaging Computational modeling Broadband antennas Costs

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RF performance of flip chip ACA joints for CPW transmission lines

RF performance of flip chip ACA joints for CPW transmission ...

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Electronics system-Integration Technology Conference, ESTC

作者： Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines are being used widely as its lower loss compared to conventional MS lines. In this paper, we studied RF performance of the ACA joints for CPW lines using the simulation software HFSS. Firstly, we investigated the high frequency performance by varying distance and number of ACA particles. It shows that the S11 parameter greatly deteriorated at the lower frequency band. To further study this phenomenon, we extracted the equivalent circuit. The extracted circuit value showed that when particle number increased, the electromagnetic interaction between each particles gradually dominant the overall performance. As a result, the mutual inductance increased the equivalent inductance, and the equivalent capacitances was also increased in the interconnect region. The particle distance was found to have little influence on the RF performance. Secondary, we studied the influences of resin compound (epoxy matrix) with different dielectric constant. Resin compound greatly influence the effective constant and impedance at the output port, thus induced impedance mismatch and slightly changed S11 response in the frequency range. Finally, we performed ANOVA analysis to evaluate the impact factors among ACA resin, joint height, signal to ground bump distance, conductor overlap and particle number. The dielectric constant of resin was found to be the most important factor in flip chip CPW-CPW ACA joints. Conductor overlap and ground to signal distance are still the two main factors. To optimize the performance, the dielectric constant of resin should be as lower as possible, and the conductor overlap length and ground to signal distance should be minimized. Moreover, particle number and bump height proved to have least effect. To achieve best performance, the particle numbe

关键词： Radio frequency Flip chip Coplanar waveguides Transmission lines Resins Dielectric constant Conductors Coplanar transmission lines Inductance Impedance

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Vibration and buckling of a carbon nanotube inserted with a carbon chain

Vibration and buckling of a carbon nanotube inserted with a ...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Zhili Hu X.M. Guo Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

An elastic string-elastic shell model is developed to study vibration behaviors of a carbon nanowire. The present model predicts that non-coaxial vibration between the C-chain and the innermost tube does not occur due to negligible bending rigidity of the C-chain. In addition, it is found that the C-chain has most significant effect on the lowest frequency associated with radial vibration mode for circumferential wave-number 2 (n=2). In particular, the effect of the C-chain on axisymmetric radial breathing frequencies (n=0) predicted by the present model is found to be in reasonable agreement with known experimental and modeling results available in the literature.

关键词： Electron tubes Mathematical model Vibrations Equations Strain Carbon Force

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Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material

Numerical investigation on the effect of filler distribution...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Cong Yue Yan Zhang Johan Liu Zhaonian Cheng Jing-yu Fan Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China

Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model had been developed and implemented by the finite element method. The numerical simulations were carried out to investigate the effect of the filler distributions on the effective thermal conductivity of the thermal interface materials. The volume percentage loadings of the particles ranging from 13% to 74% had been considered, and different particle distribution patterns had also been analyzed. The simulation results were compared with the experimental data as well as other models. A fairly good agreement was obtained for the particle volume percentage loading under consideration, which verified the developed cubic cell model.

关键词： Thermal conductivity Conductivity Materials Mathematical model Electronic packaging thermal management Numerical models Finite element methods

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