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IEEE International Conference on Communications in China Workshops (ICCC)

作者： Qizheng Sun Caili Guo Rui Tang Chuanhong Liu Yufeng Zhang Beijing Key Laboratory of Network System Architecture and Convergence Beijing University of Posts and Telecommunications School of Information and Communication Engineering Beijing China Beijing Laboratory of Advanced Information Networks Beijing University of Posts and Telecommunications School of Information and Communication Engineering Beijing China China Telecom Dict Application Capability Center Beijing University of Posts and Telecommunications

ISBN: (数字)9798350377675

ISBN: (纸本)9798350377682

Semantic image transmission is promising for both image reconstruction or downstream task execution. However, it is still challenging to simultaneously achieve pleasing visual clarity and superior downstream tasks. To tackle this issue, we propose a semantic-preserving image coding and compression method based on the semantics of pixels (SP). Specifically, we first project the semantic importance onto pixels, which is quantified by a gradient-based mechanism. Then, we design an SP-based loss function to train the image coding and compression network. This loss function not only preserves the semantic information to boost the performance of intelligent tasks but also preserves the pixel information to achieve pleasing visual effects. Experimental results confirm improvements in both aspects of performance. Especially for intelligent task performance, the proposed method achieves up to 22.22 % and 78.40 % performance gain ratio compared with the state of art deep learning-based and the traditional method, respectively.

关键词： Training Fading channels Image coding Image communication Semantics Performance gain Visual effects Generative adversarial networks Encoding Image reconstruction

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山地与极地冰川表面生态系统DNA病毒的多样性与功能

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Science Bulletin 2023年第20期68卷 2418-2433,M0006页

作者：刘勇勤焦念志钟旭臧琳张锐肖湘施一张志好陶晔白丽萍高变利杨芸兰黄星煜计慕侃刘军志刘鹏飞姚檀栋 Center for Pan-third Pole Environment Lanzhou UniversityLanzhou 730000China State Key Laboratory of Tibetan Plateau Earth System Resources and Environment(TPESRE)Institute of Tibetan Plateau ResearchChinese Academy of SciencesBeijing 100101China University of Chinese Academy of Sciences Beijing 100101China State Key Laboratory of Marine Environmental Science College of Ocean and Earth SciencesXiamen UniversityXiamen 361005China Department of Earth Oceanand Atmospheric SciencesThe University of British ColumbiaVancouver V6T 1Z4Canada Institute for Advanced Study Shenzhen UniversityShenzhen 518000China State Key Laboratory of Microbial Metabolism School of Life Sciences and BiotechnologyShanghai Jiao Tong UniversityShanghai 200240China CAS Key Laboratory of Pathogenic Microbiology and Immunology Institute of MicrobiologyChinese Academy of SciencesBeijing 100101China State Key Laboratory of Lake Science and Environment Nanjing Institute of Geography and LimnologyChinese Academy of SciencesNanjing 210008China Key Laboratory of Development and Application of Rural Renewable Energy Biogas Institute of Ministry of Agriculture and Rural AffairsChengdu 610041China

冰川覆盖了地球表面的10%,是典型的极端环境.病毒在冰川表面生态系统中丰富且活跃,在控制微生物群落中发挥关键作用.然而,我们对冰川表面生态系统病毒及其对下游生态系统的潜在影响了解非常有限.本研究构建了冰川表面生态系统DNA病毒基... 详细信息

冰川覆盖了地球表面的10%,是典型的极端环境.病毒在冰川表面生态系统中丰富且活跃,在控制微生物群落中发挥关键作用.然而,我们对冰川表面生态系统病毒及其对下游生态系统的潜在影响了解非常有限.本研究构建了冰川表面生态系统DNA病毒基因组数据集(SgVG),将已有冰川DNA病毒基因组数量扩展了15倍.数据集包含了来自全球38个山地和极地冰川,涵盖雪、冰、融水和冰尘的10,840个DNA病毒物种.冰川表面DNA病毒特异性高,但对公众健康的潜在风险极低.冰川表面病毒群落结构主要受生境影响,且冰尘病毒最为活跃.裂解性病毒在所有生境中普遍存在,而雪和冰中溶源性病毒的相对比例较高.此外,冰川表面病毒可侵染冰川中83%的门或纲的原核微生物,并且能够编码具有促进宿主代谢和协助宿主适应寒冷环境等功能的多种辅助代谢基因.本研究系统地描述了山地和极地冰川表面生态系统DNA病毒的多样性和功能,为评估冰川DNA病毒的生态功能、安全风险及构建区域生态模型提供了重要科学依据.

关键词：生态系统地球表面生态模型极端环境寒冷环境溶源性原核微生物相对比例

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Multiscale delamination modeling of an anisotropic conductive adhesive interconnect based on micropolar theory and cohesive zone model

Multiscale delamination modeling of an anisotropic conductiv...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yan Zhang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in flip-chip assembly due to its fine pitch I/Os, fewer number of processing steps, lower process temperature and environmental-friendliness. The interconnect behavior is a key issue in the long-term reliability of the system performance. In the present paper, a multiscale interface model was developed on the basis of micropolar theory, in which a cohesive zone model was also introduced to describe the possible delamination process that might occur when the interconnection was subjected to the thermal cycling loading. The delamination model was implemented using finite element method, and the numerical analysis for the reliability of an anisotropic conductive adhesive interconnect was made as the model application.

关键词： Delamination Anisotropic magnetoresistance Conductive adhesives Electronics packaging Costs Signal processing Conducting materials Assembly Temperature system performance

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Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material

Numerical investigation on the effect of filler distribution...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Cong Yue Yan Zhang Johan Liu Zhaonian Cheng Jing-yu Fan Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China

Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model had been developed and implemented by the finite element method. The numerical simulations were carried out to investigate the effect of the filler distributions on the effective thermal conductivity of the thermal interface materials. The volume percentage loadings of the particles ranging from 13% to 74% had been considered, and different particle distribution patterns had also been analyzed. The simulation results were compared with the experimental data as well as other models. A fairly good agreement was obtained for the particle volume percentage loading under consideration, which verified the developed cubic cell model.

关键词： Thermal conductivity Conductivity Materials Mathematical model Electronic packaging thermal management Numerical models Finite element methods

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Room temperature transfer of carbon nanotubes on flexible substrate

Room temperature transfer of carbon nanotubes on flexible su...

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International Workshop on Thermal Investigation of ICs and systems (THERMINIC)

作者： Di Jiang Yifeng Fu Yan Zhang Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Göteborg Sweden SHT Smart High-Tech AB Gothenburg Sweden Key Laboratory of Advanced Display and System Applications & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Göteborg Sweden

In this paper we report a novel method of transferring thermally grown vertically aligned carbon nanotubes (VA-CNTs) onto flexible substrates at room temperature with a single-step process. The transfer process is carried out by placing the CNT forests upside down on a double sided thermal release adhesive tape and peeling off the silicon substrate. Scanning electron microscope (SEM) is used to observe the transfer results. Also a second transfer using the same method but a thermal tape with higher release temperature is repeated on the as-transferred CNTs forests. The results show that this method is able to provide a novel process for transferring CNT forests at room temperature. This process will help to bring close the low cost fabrication of vertically aligned CNT structures for electronics.

关键词： Carbon nanotubes Substrates Plastics Silicon Physics Arrays

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Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Computational Fluid Dynamics Simulation for On-chip Cooling ...

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International Symposium on Electronic Materials and Packaging

作者： Xiaolong Zhong Teng Wang Johan Liu Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications & Sino-Swedish Microsystem Integration Technology (SMIT) Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Gothenburg Sweden Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The harmfulness condition of nanotube array is an unavoidable limitation for cooling capability of carbon nanotube micro-fin structures, and consequently it is necessary to study the harmful situations of carbon nanotube. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array.

关键词： Computational fluid dynamics Computational modeling Cooling Carbon nanotubes Computer architecture Heat transfer Thermal conductivity Heat sinks Electronic packaging thermal management Microchannel

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MDS investigation on the heat transfer properties of CNT micro-channel cooler

MDS investigation on the heat transfer properties of CNT mic...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Shun Wang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0×1.5 - 10 -8 Km 2 /W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.

关键词： Heat transfer Thermal resistance Carbon nanotubes Conductivity Materials

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A High Performance Ag Alloyed Nano-scale n-type Bi 2 Te 3 Based Thermoelectric Material

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Materials Today: Proceedings 2015年第2期2卷 610-619页

作者： Si Chen Nikolaos Logothetis Lilei Ye Johan Liu SMIT Center School of Automation and Mechanical Engineering Key Laboratory of Advanced Display and System Applications Shanghai University No. 149 Yanchang Road Shanghai 200072 P. R. China Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Kemivägen 9 41296 Gothenburg Sweden SHT Smart High-Tech AB Aschebergsgatan 46 411 33 Gothenburg Sweden

A silver alloyed n-type bismuth telluride (Bi 2 Te 3 )thermoelectric (TE) bulk material with nano crystalline structure was studied and characterized in this paper. The Bi 2 Te 3 nanopowders used in this study were first fabricated viaa patented explosion based process. Then, the various concentrations of Ag nanoparticles (0-20 wt. %) were added into the Bi 2 Te 3 nanopowders in order to increase the electrical conductivity. Combining the benefits of high electrical conductivity (1.51×10 5 S·m -1 ) and low thermal conductivity (0.441 W·m -1 ·K -1 ), the dimensionless figure of merit (ZT value) of 1.48 for this n-type Bi 2 Te 3 TE material is achieved at 300 K temperature.

关键词： Thermoelectric Bismuth-Telluride Silver Nano-scale Nanoparticles

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Anisotropic thermal conductivity in electrically conductive adhesives with single- and bimodal filler-size distributions containing Ag flakes and micro-particles

Anisotropic thermal conductivity in electrically conductive ...

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Electronics system-Integration Technology Conference, ESTC

作者： Masahiro Inoue Hiroaki Muta Shinsuke Yamanaka Johan Liu Institute of Scientific and Industrial Research Osaka University Osaka Japan Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University Suita Osaka Japan Key Laboratory of Advanced display and System Applications and SMIT Center Shanghai University Mechatronics Engineering Shanghai China

Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.

关键词： Heating Annealing Temperature measurement Variable speed drives Resins

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Real-Time of Channel Temperature Monitoring of P-Gan Hemts Based on Gate Leakage Current

SSRN

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SSRN 2023年

作者： Yin, Luqiao Wu, Shuang Ren, Kailin Zhang, Wenkui Zhang, Jianhua School of Microelectronics Shanghai University Shanghai200444 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai200444 China Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai University Shanghai200444 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200444 China

The thermal response of Lateral GaN-based High Electron Mobility Transistor is much faster than that of Si-based power devices, owing to its higher power density. This makes temperature-related effects even more critical for GaN HEMTs, highlighting the necessity of monitoring their operating temperature to improve the efficiency and reliability of power circuits. In this article, a real-time monitoring method for channel temperature of p-GaN HEMTs using gate leakage current as a medium is proposed. The dependence of gate current on temperature is demonstrated by electro-thermal TCAD simulation on the reference p-GaN HEMT structure. An improved gate driver circuit is proposed that integrates a monitoring circuit utilizing the current amplification capability of bipolar transistors and an RC integrator network. The efficiency of the proposed solution is confirmed through SPICE electrothermal simulations and experimental validation on commercially available devices. In conclusion, the implementation of the monitoring circuit has been proved effective, offering a promising pathway to improve the reliability of p-GaN HEMTs. © 2023, The Authors. All rights reserved.

关键词： High electron mobility transistors

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