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检索条件"机构=Key Laboratory for Advanced Display and System Application"
691 条 记 录,以下是591-600 订阅
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A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates
A compact V-band planar wideband bandpass filter based on Li...
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Electronics system-Integration Technology Conference, ESTC
作者: Xia Zhang Dan Kuylenstierna Johan Liu Peng Cai Cristina Andersson James Morris Herbert Zirath Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory o fAdvanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China School of Electronics Jiangxi University of Finance and Economics Nanchang China Department of Electrical & Computer Engineering Portland State University Portland OR USA
The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either... 详细信息
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Heat removal of microchannel coolers with Carbon NanoTube suspension as the coolant
Heat removal of microchannel coolers with Carbon NanoTube su...
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Electronics system-Integration Technology Conference, ESTC
作者: Yi Fan Yifeng Fu Teng Wang Johan Liu Yan Zhang Xiaojing Wang Zhaonian Cheng Key Laboratory of Advanced Display& System Applications (Ministry of Education) SMIT Center and School of AutomatIon and MechanIcal Engineering ShanghaiUniversity China SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanosciences (MC2)Chalmers University of Technology Gothenburg Sweden
The present work aims to study the heat dissipation capability of microchannel coolers with the coolant made of carbon NanoTube (CNT) suspension, which has been reported to have unusually good thermal properties. In t... 详细信息
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Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder
Electrical and thermal properties of electrically conductive...
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Electronics system-Integration Technology Conference, ESTC
作者: Masahiro Inoue Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden The Institute of Scientific and Industrial Research Osaka University Ibaraki Osaka Japan Key Laboratory of Advanced Display and System Applications and SMIT Center Shanghai University Shanghai China
Heat resistant conductive adhesives composed of a multi-functional epoxy matrix containing Ag flakes were developed in this work. The adhesives are potentially stable up to 200-250degC because the primary relaxation m... 详细信息
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The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu -0.4Co eutectic solder and ENIG/Cu substrate finish
The effect of reflow temperature and time on the formation a...
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Electronics system-Integration Technology Conference, ESTC
作者: Lili Zhang Cristina Andersson Johan Liu Zhaonian Cheng Key Laboratory of Advanced Display & System Applications (Ministry of Education) SMIT Center SHU-Intel Joint Packaging Center School of Automation and Mechanical Engineering Shanghai University China SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden
Soldering with lead-free tin-based solder alloys demands substantially higher processing temperatures compared to conventional tin-lead solders, resulting in both significantly greater growth rates of Intermetallic Co... 详细信息
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Recent progress of thermal interface materials
Recent progress of thermal interface materials
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Electronics system-Integration Technology Conference, ESTC
作者: Johan Liu Teng Wang Bjorn Carlberg Masahiro Inoue SMIT Center Chalmers University of Technology Göteborg Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center Shanghai University Shanghai China On leave from The Institute of Scientific and Industrial Research Osaka University Ibaraki Osaka Japan
This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out ... 详细信息
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A Design for Increasing the Immunity to RFI of Protection IC of Lithium-ion Battery
A Design for Increasing the Immunity to RFI of Protection IC...
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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2
作者: Dongfang Cheng Jue Zhang Xiaohui Li Jiongming Wang Key Laboratory of Advanced Displays and system Application Ministry of Education Microelectronic Research & Development Centre Shanghai University Shanghai China
Illustrated by the case of a lithium-ion battery protection IC, the paper focuses on the design of internal immunity to RFI. With analysis of the chip's three major elements of electromagnetic compatibility (EMC),... 详细信息
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Compact Printed Monopole Antenna on Liquid Crystal Polymer (LCP) for EWB applications
Compact Printed Monopole Antenna on Liquid Crystal Polymer (...
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2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)
作者: Xiao-Rong Yan Shun-Shi Zhong Xia Zhang School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterShang
A compact tapered CPW-fed hollowed printed monopole antenna on the liquid crystal polymer (LCP) substrate with an extremely wide bandwidth (EWB) is introduced. The simulated results demonstrate that this antenna achie... 详细信息
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RF performance of flip chip ACA joints for CPW transmission lines
RF performance of flip chip ACA joints for CPW transmission ...
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Electronics system-Integration Technology Conference, ESTC
作者: Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden
In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines a... 详细信息
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Vibration and buckling of a carbon nanotube inserted with a carbon chain
Vibration and buckling of a carbon nanotube inserted with a ...
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International Conference on (ICEPT) Electronic Packaging Technology
作者: Zhili Hu X.M. Guo Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden
An elastic string-elastic shell model is developed to study vibration behaviors of a carbon nanowire. The present model predicts that non-coaxial vibration between the C-chain and the innermost tube does not occur due... 详细信息
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Numerical investigation on the effect of filler distribution on effective thermal conductivity of thermal interface material
Numerical investigation on the effect of filler distribution...
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International Conference on (ICEPT) Electronic Packaging Technology
作者: Cong Yue Yan Zhang Johan Liu Zhaonian Cheng Jing-yu Fan Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China
Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed insid... 详细信息
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