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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Mans Andreasson Johan Liu Thorvald Andersson Hsuan-Yi Liao Itsuo Watanabe Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Advanced Interconnect Material Division Hitachi Chemical Company Limited Chikusei Ibaraki Japan

Organic light emitting devices (OLEDs) is one of the most potentially interesting display technologies in the flat panel display (FPD) field. This paper investigates the effects of OLED structures and a perimeter encapsulation to protect the OLED from atmospheric exposure. Firstly, the electric features of the OLED devices with and without a copper phtalocyanine layer were measured, and the one with the additional buffer layer showed a lower turn-on voltage. Then the OLED device sample was encapsulated with a glass cover bonded to the substrate with an adhesive matrix containing micro-particles. The samples were stored in ambient conditions, and the IV characteristics were studied with shelf-time as a parameter. The measurement results indicated that the encapsulation had a significant improvement on the device operation. After two weeks of storage the encapsulated samples showed less degradation and the current density at a given operating bias was about fifty percent higher than without encapsulation.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays Protection Copper Atmospheric measurements Electric variables measurement Buffer layers

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Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

Multi-chip integrated high-power white LED device on the mul...

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Electronic Components and Technology Conference (ECTC)

作者： Luqiao Yin Weiqiao Yang Yansheng Guo Kejun Ma Shuzhi Li Mingfa Chen Jia Li Jianhua Zhang School of Mechatronics and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai China Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Shanghai China Rainbow Optoelectronics Material Shanghai Company Limited Shanghai China Microelectronics Technology Institute of East China Shanghai University Shanghai China

In order to solve the thermal issue and improve the thermal resistance of LED, a device with multi-chip packaged on multi-layer composite ceramic substrate is successfully packaged. The top layer of the substrate is low temperature co-fire ceramic (LTCC), while the base layer is aluminum nitride (AINx) ceramic. 18 chips(one watt) are used in the device, and all of them are simultaneously packaged on a composite ceramic substrate which is 55 mm in length and 20 mm in width. The 18 chips are designed into two rows, and three chips in series for six parallels. At the same time the same chips are packaged on aluminum (Al) substrate and alumina (AlOx) substrate. After wire bonding photoelectric parameters of the three package modules are tested, the results show that the properties of the AINx-based package has the best performances, the thermal resistance of the device is far smaller than the other devices packed on the Al substrate and the AlOx substrate. After phosphor coatings the AINx-based multi-layer ceramic substrate package has 896.1 lm (43.4 lm/W) loading 350 milliampere (mA) to each chip, and has 1081.3 lm (35.4 lm/W) loading 500 mA. The multi-chip module has little light degradation adding 500 mA to each chip after working in the room temperature for one afternoon. At last the module is simulated by ANSYS software, the highest junction temperature of the chips in the module is about 70.8degC when 1.8 watts electric power is loaded to each chip, this temperature is far lower than 125degC which will damage the chip, and he highest simulation temperature of the aluminum heat slug is about 39.3degC. The temperature of the aluminum heat slug is about 41.0degC which is tested by thermocouple in the experiments, and it is closely to the simulation temperature 39.3degC. At last the relationship between pn-junction temperature and thermal conductivity coefficient of the silver (Ag) paste , the relationship between pn-junction temperatures and convection coefficient ha

关键词： Light emitting diodes Ceramics Temperature Packaging Thermal resistance Thermal conductivity Testing Aluminum nitride Wire Bonding

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Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Recent Progress of Carbon Nanotubes as Cooling Fins in Elect...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Johan Liu Yifeng Fu Teng Wang SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China

As power density in electronic system is approaching a level that conventional cooling methods can't handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using Carbon Nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is considered as an ideal material for thermal management in high heat flux microsystems. Fabricated onto a silicon substrate to form microchannels, the CNT based cooling fins show high heat dissipation efficiency. This paper reviews the ongoing research on CNT based microchannel cooler development carried out so far. Both experimental and simulation results are included and presented.

关键词： Microchannel Cooling Arrays Thermal conductivity Carbon nanotubes Heating Heat transfer

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An adaptive and fast H.264 multi-frame selection algorithm based on information from previous searches

An adaptive and fast H.264 multi-frame selection algorithm b...

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IEEE International Conference onMultimedia and Expo, ICME 2007

作者： Liquan, Shen Zhi, Liu Zhaoyang, Zhang Xuli, Shi Key Lab. of Advanced Display and System Application Ministry of Education Shanghai University Shanghai 200072 China

ISBN: (纸本)1424410177

The H.264 video coding standard adopts multiple reference frames for motion estimation. This new feature improves the prediction accuracy of inter-coding blocks significantly, but it results in a considerable increase in encoder complexity, mainly regarding to multi-frame selection and motion estimation. The reference software JM adopts the full search scheme, and the increased computation is in proportion to the number of searched reference frames. However, the reduction of prediction residues is highly dependent on the nature of sequences, not on the number of searched frames. In this paper, we propose an adaptive and fast multi-frame selection algorithm (AFMFS) based on motion vectors and SAD information coming from previous searches to adaptively terminate the procedure of multiple reference frames selection. Compared with the full search algorithm and the flexible multi-reference frame search criterion (FMRFSC), simulation results show that the proposed algorithm can save 55.28% and 40.23% computation cost on average, respectively, while it still maintains similar coding efficiency. © 2007 IEEE.

关键词： Motion estimation

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Wigner-Ville distribution and cross Wigner-Ville distribution of noisy signals

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Journal of systems Engineering and Electronics 2008年第5期000卷

作者： Chen Guanghua Ma Shiwei Liu Ming Zhu Jingming Zeng Weimin Key Laboratory of Advanced Display and System Applications Ministry of Education & Microelectronic Research and Development CenterShanghai Univ.Shanghai 200072P.R.China

The Wigner-Ville distribution (WVD) and the cross Wigner-Ville distribution (XWVD) have been shown to be efficient in the estimation of instantaneous frequency (IF).But the statistical result of the IF estimation from XWVD peak is much better than using WVD *** reason is given from a statistical point of *** studies show that XWVD of the analyzed signal can be estimated from XWVD of the noise-contaminated *** estimation is unbiased,and the variance is equal to that of *** this case,WVD cannot be estimated from WVD of the noise-contaminated ***,higher SNR is required when WVD is used to analyze signals.

关键词： Wigner-Ville distribution cross Wigner-Ville distribution instantaneous frequency expectation vari-ance

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Performance analysis of region of interest video transmission system

Performance analysis of region of interest video transmissio...

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IET Conference on Wireless, Mobile and Sensor Networks 2007, CCWMSN'07

作者： Wang, Yongfang Zhang, Zhaoyang Liu, Zhi School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 200072 China

ISBN: (纸本)9780863418365

We investigate the video transmission efficiency of channel code, modulation mode and layered space time code for region of interest video transmission system. Excellent channel code achieves more coding gains, suitable modulation mode adaptively overcomes different channel fading and layered space time code achieves not only coding gain but only diversity gain. Based on the above analysis, we propose an adaptive video transmission system according to channel environment and video constructed quality require. We derive an analytic bound for the error probability, and conduct experiments for H.264 interest of region video streaming. It is shown that the proposed system enhances the PSNR performance of region of interest significantly by adaptive choice of channel code, modulation mode, and layered space time code in the wireless channel.

关键词： Modulation

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Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Manufacture, Microstructure and Microhardness Analysis of Sn...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Lili Zhang Wenkai Tao Johan Liu Yan Zhang Zhaonian Cheng Cristina Andersson Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed Consumable-electrode Direct Current Arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.

关键词： Soldering Microstructure Lead Materials Grain boundaries Nanoparticles Packaging

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Visual attention based video object segmentation in MPEG compressed domain

Visual attention based video object segmentation in MPEG com...

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IET Conference on Wireless, Mobile and Sensor Networks 2007, CCWMSN'07

作者： Ning, Zuowu Zhang, Zhaoyang Liu, Zhi School of Communication and Information Engineering Shanghai University China Key Lab of Advanced Display and System Application Shanghai University Ministry of Education China

ISBN: (纸本)9780863418365

A novel approach of visual attention based video object segmentation in MPEG compressed domain is proposed in this paper. DCT coefficients and motion vectors (MVs) are firstly parsed from compressed streams. Analysis of the scene texture is then proposed to decide the best appropriate information for region growing. MVs are exploited to perform region growing if texture is complex, otherwise DC coefficients and MVs are used together to perform region growing. Meanwhile, MVs of I frames are calculated by backward projection of MVs of subsequent P frames, then global motion compensation is performed using the MVs of I frames to obtain local MVs. Subsequently statistical region growing is exploited to segment the image into homogeneous regions. Finally an improved attention model is proposed to extract visual attention objects, which is based on position, clearness and local MVs. The attention model makes the segmentation results more accordant with human's perception. The experimental results conducted on standard test sequences demonstrate the efficient, real-time, robust performance of the proposed approach.

关键词： Motion compensation

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Organic thin film transistors with PMMA modified insulator

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Optoelectronics Letters 2007年第6期3卷 435-437页

作者： LIU Xiang BAI Yu ZHU Wen-qing JING Xue-yin ZHANG Zhi-lin Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China. Department of Materials Science Shanghai University Jiading Campus Shanghai 201800 China

A double insulation layer structure organic thin films transistor （OTFT） was investigated for improving the performance of the SiO2 gate insulator. A 50 nm PMMA layer was coated on top of the SiO2 gate insulator as the organic insulator layer. The results demonstrated that using inorganic/organic compound insulator as the gate dielectric layer is an effective method to fabricate OTPTs with improved electric characteristics and decreased leakage current. Electrical parameters of carrier mobility and on/off ratio were calculated. OTPT based on Si substrate with a field-effect mobility of 4.0 × 10^-3cm^2/Vs and on/off ratio of l0^4 was obtained.

关键词：薄膜晶体管绝缘体灯管电源

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Effect of buffer layer on the performances of top emitting oled and bottom emitting OLEDs

Effect of buffer layer on the performances of top emitting o...

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作者： Zhang, Zhilin Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai 200072 China Department of Material Sciences Shanghai University Shanghai 201800 China

ISBN: (纸本)9787561752289

Buffer layer is a crucial issue for driving voltage, efficiency and stability of OLEDs Several buffer layers were used in Top-OLED (TOLED) and Bottom-OLEDs (BOLED) for comparison. It is found that starburst material mMTDATA based devices exhibited much high current efficiency than others, while metal oxide MoOx showed superior characteristics of low driving voltage and much long lifetime of devices. By combining the measurement of work function of the metal oxide, using a method of contact potential difference previously reported by us, with the investigation of relative Hole-only or Electron-only devices, the mechanism of formed low driving voltage, high efficiency and high stability were analyzed.

关键词： Buffer layers

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