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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ming Li Ming-ming Peng Jing-sai Jiang Fa-yu Wan Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

Turbo codes have become an attractive forward error correction scheme for wireless communication systems. MAP algorithm is the optimization algorithm for turbo-codes. But its implementation is complex. Max-Log-MAP algorithm is a sub-optimization algorithm of turbo-codes, which offers good compromise between performance and complexity for implementation. The authors present a re configurable turbo decoder based on Max-Log-MAP algorithm implemented with sliding window method and pipeline architecture. The sliding window (SW) method can reduce memory size. Pipeline decoding schemes can reduce decoding delay and improve throughput. The structure we proposed can reduce decoding delay obviously. It can be used in wireless communication.

关键词： Pipelines Turbo codes Iterative decoding Delay Wireless communication Throughput Microelectronics Laboratories displays Forward error correction

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Improvement of electroluminescence utilizing emitting assist dopant for red organic light emission

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Guangdianzi Jiguang/Journal of Optoelectronics Laser 2007年第3期18卷 267-269页

作者： Wei, Fu-Xiang Zhang, Xiao-Bo Cao, Jin Liu, Xiang Zhu, Wen-Qing Jiang, Xue-Yin Zhang, Zhi-Lin Key Laboratory of Advanced Display and System Application Institute of Materials Science and Engineering Shanghai University Shanghai 201800 China

The efficient red organic light emitting diodes (OLED) that employ Coumarin (C545) as an assistant dopant are obtained. The cell structure is indium tin oxide (ITO)/N, N′-bis-(1-naphenyl)-N, N′-biphenyl-1, 1′-biphenyl-4, -4′-diamine (NPB)/tris(8-hydroxyquinoline) aluminum (Alq3):C545:4-(dicyanomethylene)-2-t-butyl-6-(1, 1, 7, 7-tetramethyljulolidyl-9-enyl)-4H-pyran (DCJTB)/Alq3/LiF/Al. The electroluminescent properties of devices with different component ratios of C545 and DCJTB are studied. Compared with devices where the emitting layer is only composed of Alq3 and DCJTB, the emission efficiency and purity of color are improved. We attribute these improvements to the assistant dopant C545 which leads to the more efficient energy transfer from Alq3 to DCJTB.

关键词： Organic light emitting diodes (OLED)

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Improved H.264 GOP-level bit allocation by incremental PID algorithm

Improved H.264 GOP-level bit allocation by incremental PID a...

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2007 IET Conference on Wireless, Mobile and Sensor Networks (CCWMSN07)

作者： Liquan Shen Zhaoyang Zhang Ying Li Zhi Liu Key Lab. of Advanced Display and System Application Ministry of Education Shanghai Univ. 200072 China School of Computer Engineering and Science Shanghai University Shanghai China

Since the current rate control schemes in H.264 do not present the capability of efficient GOP-level bit allocation, the video quality varies greatly for sequences with the scene change or the scene complexity varying from one GOP to another. To overcome the limitation, we propose a novel rate control scheme based on incremental PID algorithm. The incremental PID algorithm is introduced to minimize video quality variations in GOP-level bit allocation. Extensive simulation results show that the proposed rate control scheme, without expensive computational complexity added, decreases the average video quality variations by 15.07%.

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Investigation of Fine Pitch Chip on Glass with Au-Sn Thermocompression Bonding

Investigation of Fine Pitch Chip on Glass with Au-Sn Thermoc...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Fang Yuan Jianhua Zhang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China Shanghai University Shanghai Shanghai CN

Au-Sn thermocompression interconnect technique using nonconductive film (NCF) is proposed to solve the insulation problem between bumps of fine-pitch IC. This paper describes NCF for ultra-fine pitch Chip-On-Glass (COG) application. NCF is a novel material developed for fine-pitch packaging. The effects of bonding temperature and bonding pressure on the microstructure of an NCF-bonded COG package were investigated in this study through optomicroscope and SEM. The contact area between chip bump and substrate pad, thickness of eutectic layer and content percentage of Sn in eutectic layer were observed in present work. High bonding temperature and bonding pressure are beneficial to form larger contact area. Thickness of eutectic layer increases along with bonding pressure decrease and bonding temperature increase, and content percentage of Sn increases accordingly. Reliability test of AHT for Au-Sn thermocompression samples was conducted and some cracks at the root of bump were detected, but no functional failures were detected.

关键词： Glass Bonding Temperature Packaging Tin Insulation application specific integrated circuits Microstructure Substrates Testing

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Electronic paper display technology

Electronic paper display technology

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作者： Zhao, Kun Li, Chunya Zhang, Jianhua Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education No. 149 Yanchang Rd Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai University No. 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)9787561752289

In recent years, flat panel display technology is becoming mature day by day. With the development of a huge rapid-growing display market, an increasing number of companies and research institutes focus on the flexible display technology, which is called paper-like display technology. The main point in flexible display technology is electronic paper display technology, which involves three main display types: microcapsules electrophoresis, gyricon bead, cholesteric texture. This paper not only introduces the initiation and development of electronic paper display technology, but also gives detailed descriptions of the principles, applications and main companies for the three electronic paper display types. When the display elements were prepared, the driver circuit must be assembled with the display module. There will be some problems should be solved by electronic packaging technology, such as chip on flex (COF) technology. Furthermore, the assembling process to make driver elements integrated with display components was illustrated. There are three realization directions to realize electronic paper display, including display-based technology, printing technology, photocopy technology. At last, electronic paper display products were shown to indicate the developing technology and splendid future.

关键词： Electrophoresis

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New interconnection technology for flat panel display applications

New interconnection technology for flat panel display applic...

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作者： Yuan, Fang Zhang, Jianhua Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education No. 149 Yanchang Rd. Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai University No. 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)9787561752289

As electronic packaging technology trends in the small flat panel display move toward faster, more cost-effective, higher electrical performance and better reliability, flip chip technology gains popularity as one of the best chip packaging candidates. This technology has offered numerous advantages over conventional solder joining and the assembly uses polymer adhesives such as isotropic conductive adhesives (ICAs), anisotropic conductive films (ACFs) and nonconductive adhesives(NCAs). ICAs and AC As contain conductive particles and adhesive polymer resins and have been widely used for the flat panel display module. However, as the consumer electronics tends to become ligher, thinner, and also featured in high resolution and low power consumption to satisfy the increasing market requirements, it is propelling to improve the approaches to a flip chip adhesive process. The paper mainly presents the study of Non-conductive adhesives in flip chip for plat panel display. The NCAs technology is emerging as an attractive lead-free solder interconnects due to its environmental friendliness, lower processing temperatures, lower cost and extendability to fine pitch application. In fine pitch application below 30 μm, decreasing the pad pitch could increase the risk of short circuit to the ICA joints and lead to a reduction in current-carrying capacity of the AC A interconnetions. But the technology using NCAs in flip chip can solve the problems very well. This paper will review the latest research in NCA interconnection technology for flat panel display applications. Meanwhile, the new methods of NCA interconnection for very fine pitch LCD driver is also proposed and verified.

关键词： Cost effectiveness

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FEM Analysis of Moisture Distribution in Stacked Die Package

FEM Analysis of Moisture Distribution in Stacked Die Package

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第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

作者： Z K Hua J H Zhang C Y Li L Q Cao Y X Luo Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Intel Technology Development (Shanghai) Co. Ltd.

Stacked Die Packaging technology is the key technique to meet the requirements of higher density, smaller size of electronic products. Moisture has big influence on the reliability of packaging, in which the major failures are corrosion, delamination and crack. In stacked die packages,the main risks of the moisture also exist. The focus of this paper is to investigate the hygroscopic characteristc of stacked die using commercial FEA software. In this study,according to the JEDEC standard, the moisture diffusion characteristic under different conditions is *** show that the substrate and bottom adhesive absorb rapidly in moisture diffusion simulation. This reduces the mechanical properties of the stacked die and the result may give a proper answer to those failure observed in *** tests are needed in order to get a more precise investigation.

关键词： Moisture Electronics packaging Water pollution Water resources Finite element methods Lead Reliability engineering Corrosion Environmentally friendly manufacturing techniques Temperature

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Research on the Models of OLED-On-Silicon Pixel Circuits

Research on the Models of OLED-On-Silicon Pixel Circuits

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Li-min Yan Hao Wang Key Laboratory of Advanced Display & System Applications Ministry of Education Shanghai University Microelectronic Research and Development Center Shanghai University Shanghai China

In modern information society, the display devices play an important role. Presently, Organic Light-Emitting Diode (OLED) has been emphasized and regarded as one of the best technology for its many advantages, such as active-matrix driver mode, high brightness, fast response time, high efficiency, wide visual angle, thin and light-weight etc. Much work of this paper has been done in AM-OLED technology, mainly focusing on the models of AM-OLED pixel circuit structure design and parameters assurance, AC-driving pixel circuit design and application. This research is prepared for integrated peripheral driving circuit design and application in the future.

关键词： Organic light emitting diodes Flat panel displays Thin film transistors Light emitting diodes Active matrix technology Brightness Threshold voltage Circuit synthesis Liquid crystal displays Active matrix organic light emitting diodes

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Image Mosaic Based View Synthesis for Interactive Stereoscopic display

Image Mosaic Based View Synthesis for Interactive Stereoscop...

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2007亚洲显示国际会议

作者： Giuyan Guo Key Laboratory of Advanced Displays and System Application Ministry of EducationShanghai 200072China School of Communication and Information EngineeringShanghai UniversityShanghai 200072China

In stereoscopic display,view synthesis is a key technology to realize interactivity what is the ability to look around with- in a three dimensional(3D)scene by freely choosing a *** paper presents an intermediate view synthesis al- gorithm,combining view interpolation with view morphing based on image ***,the original stereo image pairs are ***,the disparity of only object area is estimated by a predict recursion method to improve the matching speed and ***,credible areas in left and right views should be determined and chosen to create a transi- tional *** last,a method combining view interpolation and morphing is used to synthesis the intermediate view from the transitional *** results show that the edge of created intermediate view object is clear and smooth,and the processing speed of view synthesis is obviously *** algorithm can be used in interactive stereoscopic dis- play in varius 3D video application which an arbitrary view needs to be rendered in real-time.

关键词： View Synthesis View Morphing Image Mosaic Transitional View

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Architecture research and IC design for embedded ultra-micro processor

Architecture research and IC design for embedded ultra-micro...

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International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

作者： Chen, Zhang-Jin Jin, Zhe-Ming Xu, Mei-Hua Ran, Feng Computer Center Shanghai University 149 Yanchang Rd. Shanghai 200072 China Microelectronic Research and Development Center Shanghai University 149 Yanchang Rd. Shanghai 200072 China Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)1424412536

In an embedded system design, the mere serial function of a processor is generally used to improve its correctness and decrease the design period without making use of the entire functions of the processor. To reduce the area and the loss of cost-effectiveness brought about by the general processor, a new embedded ultra-micro processor circuit is proposed. It lies between the simplex parallel logic and a general processor. The processor can be easily tailored or expanded according to the design goals and whereby the flexibility and cost performance of the entire system are achieved. © 2007 IEEE.

关键词： Embedded systems

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