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New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging applications

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Na...

引用

International Symposium on Electronic Materials and Packaging

作者： Wen Xuan Wang Xiuzhen Lu Johan Liu Michael Olugbenga Olorunyomi Tomas Aronsson Dongkai Shangguan Key Laboratory of Advanced Display and System Applications (Chinese Ministry of Education) and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience University of Technology Gothenburg Sweden

Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal conductivity of the film. The produced Nano-TIM has a nano scale structure with embedded nano-SiC distributed randomly. Scanning Electrical Microscope (SEM) was used to determine the morphology of the film. Thermal properties were measured. The results show that the Nano-TIM has good thermal properties and it can be further improved by changing the mass concentration of the SiC nano particles.

关键词： Nanostructured materials Silicon carbide Electronics packaging Thermal conductivity Electronic packaging thermal management Conducting materials Semiconductor materials Scanning electron microscopy Semiconductor device packaging Mechanical factors

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Effects of curing agents on the conductivity of isotropical conductive adhesives (ICAs)

Effects of curing agents on the conductivity of isotropical ...

引用

International Symposium on Electronic Materials and Packaging

作者： Xuechun Lin Qinghua Li Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Ministry of Education) School of Mechatronic and Automation Engineering Shanghai University Shanghai China Department of Fine Chemicals and Materials Engineering Shenzhen Polytechnic Shenzhen China

Curing agents greatly influence the electrical conductivity of epoxy resin/Ag composed isotropic conductive adhesives (ICA). In this paper, three kinds of latent curing agents-dicyandiamide (DICY), boron-amine complex (594) and imidazole derivate (MZ) were used for formulating one-package epoxy-based ICA, respectively. The investigation showed that the 70% silver-containing conductive adhesive with imidazole derivate as curing agent has excellent conductivity and its bulk resistivity was 5times10 -4 Omegaldrcm. boron- amine complex also show good conductivity in the same formula. However, the ICA with DICY as curing agent gave poor conductivity performance. The different curing mechanisms were linked to the different conductivity of ICAs cured by different agents. In the ICA with DICY as curing agent, the agent has two strong polar N and -CN group, it has strong molecular adhesion to silver. Basically one DICY molecule can link 4 epoxy groups. During the curing process, the active functional groups (- CN-, -N and -OH) link with silver and possibly form a layer of dense polymer capsulate covering on the surface of silver. This polymer capsulate is the key reason to increase the tunnelling resistance. So the ICA with DICY as curing agent gave poor conductivity. When use imidazole derivant or boron-amine complex as curing agent, which follows the anion or cation-catalytic-polymerization curing mechanism, the curing products were polyether gloss network. In such situation, the interaction between resin and silver is weak, therefore decreases the tunnelling resistance , thus can achieve good conductivity.

关键词： Curing Conductivity Conductive adhesives Independent component analysis Silver Contact resistance Electric resistance Polymers Epoxy resins Surface resistance

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RF characterization of flip-chip anisotropic conductive adhesives joints

RF characterization of flip-chip anisotropic conductive adhe...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xu Wang Zhaonian Cheng J. Liu Key Laboratory of Advanced Display and System Applications and Sino-Swedish Microsystem Integration Technology SMIT Shanghai University Shanghai China SMIT Center and Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

Anisotropic conductive adhesives (ACAs) have been proved to own good performance in high frequency applications. However, the effect of distribution of conductive particles in ACAs on RF (radio frequency) characterization is not fully understood. Finite difference in time domain (FDTD) method based electromagnetic software QuickWave is used to establish the structure and investigate RF characterization of ACA. The effect of distribution of conductive particles both in random and uniform distribution is simulated. Furthermore, the influence of conductor overlap is also investigated. An equivalent lumped circuit is also set up. The results show in a certain particles number, that there is minor influence in different distribution of conductive particles, and that as expected, the conductor overlap should be minimized to improve high frequency performance

关键词： Radio frequency Anisotropic magnetoresistance Conductive adhesives Finite difference methods Conductors Circuit simulation Microwave theory and techniques Time domain analysis Integrated circuit interconnections Bonding

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Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Computational Fluid Dynamics Simulation for On-chip Cooling ...

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International Symposium on Electronic Materials and Packaging

作者： Xiaolong Zhong Teng Wang Johan Liu Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications & Sino-Swedish Microsystem Integration Technology (SMIT) Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Gothenburg Sweden Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The harmfulness condition of nanotube array is an unavoidable limitation for cooling capability of carbon nanotube micro-fin structures, and consequently it is necessary to study the harmful situations of carbon nanotube. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array.

关键词： Computational fluid dynamics Computational modeling Cooling Carbon nanotubes Computer architecture Heat transfer Thermal conductivity Heat sinks Electronic packaging thermal management Microchannel

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On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling

On the heat transfer enhancement based on micro-scale air im...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Jing-yu Fan Yan Zhang J. Liu Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface

关键词： Heat sinks Heat transfer Microstructure Electronics cooling Thermal management of electronics Educational technology Thermal management Microchannel Mathematics Laboratories

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Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Study on the Multi-Scale Properties of the Internal Structur...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Ragnar Larsson Jing-yu Fan Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging as interconnection materials, and many studies have been done about their electrical features, but limited works have been done on the mechanical properties with respect to the overall reliability of the packaging, and even less attention is paid to the micro-scale constituents of the internal structures in the ACA interconnection. This paper establishes a second order homogenization approach for predicting the mechanical performance of the typical internal structure in the ACA interconnection layer. This interface model is developed in the micropolar theory frame, and the macro- and micro-responses of each constituent are included. The considered structure under shear loading is simulated as application example of this model. The computational results show that the microscopic fluctuation field has a counteraction effect on the overall deformation, and the constituents with various material parameters have different responses to the prescribed loading. And the joint locations are of high possibility for crack/delamination initiation

关键词： Packaging Anisotropic magnetoresistance Conductive adhesives Conducting materials Mechanical factors Materials reliability Computational modeling Microscopy Fluctuations Delamination

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Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging

Homogenization model based on micropolar theory for the inte...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yan Zhang R. Larsson Jing-yu Fan Zhaonian Cheng Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

The increase in microsystem packaging density sets the requirement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaging system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the conventional method show its validity and efficiency

关键词： Microstructure Educational technology Integrated circuit interconnections Residual stresses Electronic packaging thermal management Thermal stresses Delamination Optical interferometry Capacitive sensors Kinematics

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Solution for hybrid bandwidth variation in wireless video environments

Solution for hybrid bandwidth variation in wireless video en...

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2005 Second IEEE International Workshop on Mobile Commerce and Services, WMCS'05

作者： Li, Zhi-Gang Zhang, Zhao-Yang Wu, Biao Zhang, Ying School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Displays and System Application Ministry of Education

ISBN: (纸本)0769523919

With the development of broadband wireless networks, high efficiency of wireless video transmission has been received increasingly greater attentions than before. One should settle the problems of high-compression efficiency and that of adaptation to the random variation of transmission bandwidth, as well as a network friendly design, in wireless environments. SP(Synchronization- Predictive) frame, which enables high efficiency of switching between two or more bitstreams with different qualities, is supported by H.264/AVC Extended Profile suitable for mobile services. On the other hand, FGS(Fine-Granular- Scalability), which can always adapt to the network bandwidth varying but with some sacrifice of coding efficiency, is supported by MPEG-4. This paper proposes a solution for combination these two tools with each other so as to accommodate high bandwidth variations of wireless networks and low bandwidth variations flexibly for transmitted streams. Moreover, it also improves the efficiency of video streaming. Experimental results show that our proposed system outperforms FGS by 0.76dB and the H.264/AVC-based video stream switching approach by 0.51 dB on average under 3GPP /3GPP2 wireless common test conditions. © 2005 IEEE.

关键词： Wireless telecommunication systems

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Extended application of scalable video coding methods

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2nd International Conference on Image Analysis and Recognition, ICIAR 2005

ISBN: (纸本)3540290699

SP(Synchronization-Predictive) frame coding, which enables high efficiency of switching between two video bitstreams with different qualities, is supported by H.264/AVC. And FGS(Finc-Granular-Scalability) coding is supported by MPEG-4 video standard. This paper proposes a solution for combination these two tools with each other so as to adapt to high bandwidth variations of Internet or wireless networks and to low bandwidth variations flexibly for transmitted video streams. Experimental results show that our proposed system outperforms FGS coding by 0.47dB and the H.264/AVC-based video stream switching approach by 0.23dB on average. © Springer-Verlag Berlin Heidelberg 2005.

关键词： Image analysis

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Simulation Study of bump metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex (COF) applications

Simulation Study of bump metallization on the stress and str...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： S.H. Su K. Zhao S.W. Ma J.H. Zhang Laboratory of Advanced Display Technology and System Application Shanghai University Shanghai China College of Mechanical and Electrical Engineering Central South University Changsha China

Anisotropic conductive films (ACFs) are composed of an adhesive polymer matrix and fine conductive fillers using metallic particle or metal-coated polymer balls. Flip chip interconnection using ACF is being widely used in the electronic packaging. In this paper, two-dimensional nonlinear finite element analysis model was built to simulate effects of bumps' metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex (COF) applications. The simulation results show that the bump metallization has big influence on the stress and strain. Under the thermal mechanical simulation, the stress is mainly relied on the Young's modulus of the bump while the strain is mainly depended on the CTE of the bump. In some kinds of bump/pad metallization, such as gold, nickel and copper, the copper has smaller stress, only bigger than gold, and minimum strain. If both chip bump and substrate bump fabricated by same copper, the galvanic corrosion, which occurs between two different metals and the main cause attributed to the shift of the contact resistance of ACF, does not exist. Regarding the cost and reliability synchronously, the copper may be the better substitute of gold as bump material in flip chip using ACF

关键词： Metallization Capacitive sensors Thermal stresses Copper Gold Polymer films Flip chip Anisotropic conductive films Electronics packaging Finite element methods

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