检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

7 篇 会议

馆藏范围

7 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

1 篇 理学
- 1 篇 物理学
1 篇 工学
- 1 篇 控制科学与工程

主题

2 篇 thermal resistan...
2 篇 junctions
2 篇 light emitting d...
2 篇 materials
2 篇 electronic packa...
1 篇 microstrip reson...
1 篇 transient analys...
1 篇 reliability
1 篇 gallium
1 篇 temperature
1 篇 carbon nanotubes
1 篇 packaging
1 篇 compounds
1 篇 microstrip filte...
1 篇 silver
1 篇 moisture
1 篇 thermal analysis
1 篇 life estimation
1 篇 speech recogniti...
1 篇 lead

机构

2 篇 key laboratory o...
1 篇 key laboratory o...
1 篇 school of mechat...
1 篇 key laboratory o...
1 篇 shanghai yaming ...
1 篇 key laboratory o...
1 篇 shanghai researc...
1 篇 key laboratory o...
1 篇 department of el...
1 篇 school of electr...
1 篇 school of mechat...
1 篇 department of ma...
1 篇 key laboratory o...
1 篇 shanghai researc...
1 篇 key laboratory o...
1 篇 key laboratory o...
1 篇 department of mi...
1 篇 shanghai yaming ...

作者

3 篇 luqiao yin
3 篇 lianqiao yang
3 篇 jianhua zhang
2 篇 johan liu
2 篇 shuzhi li
2 篇 guangming xu
2 篇 yu chen
2 篇 huafeng yan
1 篇 cristina anderss...
1 篇 zhili hu
1 篇 dan kuylenstiern...
1 篇 yang lin
1 篇 lu chen hong
1 篇 herbert zirath
1 篇 xia zhang
1 篇 yan zhang
1 篇 james morris
1 篇 hu yue li
1 篇 xicheng wei
1 篇 meijuan fu

语言

7 篇 英文

检索条件"机构=Key Laboratory o fAdvanced Display and System Applications"

共 7 条记录，以下是1-10 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Speech control system for Robot based on Raspberry Pi

引用

2013 3rd International Symposium on Chemical Engineering and Material Properties, ISCEMP 2013

作者： Lu, Chen Hong Hu, Yue Li Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Campus P.O.B.221 149 Yanchang Rd Shanghai 200072 China School of Mechatronics and Automation Shanghai University Shanghai 200072 China

ISBN: (纸本)9783037858363

Raspberry Pi is a credit card sized Linux computer based on ARM 11 architecture. Because of its small size, low power consumption and powerful performance, a robot controller is a suitable role for it to play. As a robot with artificial intelligence, speech recognition for controlling the robot and voice feedback to users is key parts of the entire system. In this essay, a robot called Lisa is assembled, and a speech control and interactive system is implemented based on Google voice API which is a voice recognition engine provided as a cloud service, hi order to analysis complex voice commands, a semantic method is developed to catch key words from command sentences. Then try to make a pattern match between key words and instruction set build-in the robot control system. The speech recognition control and interactive system is effective and well behaved after experimental verification. © (2013) Trans Tech Publications, Switzerland.

关键词： Speech recognition

来源：评论

学校读者我要写书评

暂无评论

Study on the Reliability of High-power LEDs under Temperature Cycle

Study on the Reliability of High-power LEDs under Temperatur...

引用

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Fan Huang Luqiao Yin Shuzhi Li Guangming Xu Huafeng Yan Yu Chen Jianhua Zhang Lianqiao Yang Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron Key Laboratory of Advanced Display and System Applications (Shanghai University Shanghai Research Center of Eengineering and Technology for Semiconductor Lighting Shanghai Yaming Lighting co. Ltd.Ministry of Education.P.O.B 143 149 Yanchang Rd. Shanghai Univer Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron

High-power LEDs have been widely used and have a big potential market due to the many advantages compared to conventional light sources. Reliability is one of the most important issues for the application of LEDs. In order to study the degradation mechanism and the stability of LED withstanding cyclical exposures to temperature variations, life test was carried out under temperature cycle testing. The experiment was designed basing on the EIAJ ED-4701/100. Four groups of 1 W high power LEDs adopting different material and structures were utilized. The temperature cycle accelerated life test under the condition of -25℃/125℃. After the accelerated test, the optical performance of the four kinds of devices were compared and analyzed, and the thermal performance of the LEDs was also tested, analyzed and discussed. At last, the reliability differences of high-power LEDs were analyzed and degradation mechanism of high power LEDs under temperature cycling was discussed.

关键词： Light emitting diodes Life estimation Reliability Thermal analysis Degradation Junctions Electronic packaging thermal management

来源：评论

学校读者我要写书评

暂无评论

A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates

A compact V-band planar wideband bandpass filter based on Li...

引用

Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Dan Kuylenstierna Johan Liu Peng Cai Cristina Andersson James Morris Herbert Zirath Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory o fAdvanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China School of Electronics Jiangxi University of Finance and Economics Nanchang China Department of Electrical & Computer Engineering Portland State University Portland OR USA

The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either expensive or have inadequate performance. Liquid crystal polymers (LCPs), have attracted much more attention as advanced candidates as RF/microwave/mm-wave substrate materials for commercial wireless applications due to their combination of features and performance. In this paper, a compact V-band planar microstrip bandpass filter with sharp-rejection, low insertion-loss and wide-bandwidth based on the dual-mode ring resonator is proposed. The filter is fabricated on a LCP substrate by using standard processing technology. The proposed filter exhibits a return loss level better than 10 dB, an insertion loss of 5 dB, and a 3-dB bandwidth of 30%. The simulated and measured results are compared and agree well, which shows the promising potential of LCP laminates for flexible RF/microwave/mm-wave substrates.

关键词： Wideband Band pass filters Liquid crystal polymers Crystalline materials Radio frequency Microwave filters Resonator filters Microwave theory and techniques Microstrip filters Microstrip resonators

来源：评论

学校读者我要写书评

暂无评论

Effects of Die-attach Materials on the optical Durability and Thermal Performances of HP-LED

Effects of Die-attach Materials on the Optical Durability an...

引用

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Luqiao Yin Lianqiao Yang Weiqiao Yang Guangming Xu Huafeng Yan Yu Chen Shuzhi Li Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Shanghai Yaming Lighting co. Ltd.P.O.B 143 149 Yanchang Rd. Shanghai University Shanghai 200072 Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat

Die interconnection layer is one of the main factors to improve the HP-LED thermal issue as it is the main thermal transfer media from the HP-LED chip to the substrate or heat sink. Silver epoxy is now widely used for LED interconnection, but it becomes more and more difficult for efficient heat dissipation as the HP-LED electric power density becomes higher and higher. Nowadays more and more attentions have been moved to metallic eutectic interconnection, especially for solder paste and AuSn20 eutectic interconnection which have big potential to be used for HP-LED. In order to further understand the thermal characteristics and reliability of HP-LED interconnected by different die-attach materials, the AuSn20 eutectic, solder paste and silver epoxy were applied to HP-LED respectively. The transient thermal resistance, steady state junction temperature and optical durability of the HP-LEDs are tested and studied. For HP-LED interconnected by AuSn20 eutectic, solder paste and silver epoxy, when applied 450 mA working current, the transient thermal resistance of die attach layer are 2.5 K/W, 3.2 K/W and 4 K/W respectively, and the junction temperature variation are 0.4%, 9.6% and 6.6% respectively after about 1180 hours 85 ℃/85 H aging. The results show the AuSn20 eutectic has better thermal performances and optical durability than the solder paste and silver epoxy.

关键词： Thermal resistance Microassembly Materials Silver Junctions Transient analysis

来源：评论

学校读者我要写书评

暂无评论

MDS study on the adhesive heat transfer in micro-channel cooler

MDS study on the adhesive heat transfer in micro-channel coo...

引用

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Shun Wang Yan Zhang Zhili Hu Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University P.O.B. 282 Shanghai 200072 China

Carbon nanotube (CNT) can be used in micro-channel cooler construction due to its excellent thermal conductivity. When fabricating CNTs directly onto the chip, the chip could be damaged because of the high temperature required for CNT growth (about 750℃). As a solution, a transfer technique is developed where the desired carbon nanotube pattern can be obtained by taking off a pre-fabricated CNT forest with a designed adhesive, and the transfer process could make the chip or other components immune from the high temperature required for the CNT growth process. This process can also improve the bonding/adhesive strength. Nevertheless, the use of adhesive in the CNT-based microchannel structure might affect the thermal conduction of the cooling system. In particular, the heat transfer between the heat generator and the CNT fin in the micro-channel cooler shall be evaluated. In this paper the thermal conductivity of the adhesive is studied by molecular dynamics simulation (MDS). The adhesive considered in the present MDS model consists of the epoxy and the curing agent. After the curing process, the epoxy molecules construct a network, which is established in the epoxy matrix generation before the simulation. Nonequilibrium Molecular Dynamics Method (NEMD) is adopted in the modeling and periodic boundary conditions are applied. Furthermore, the heat transfer through CNT and adhesive interface is simulated in this work based on the adhesive results, which can provide information for future macro-analysis of the thermal performance of the CNT microchannel cooler.

关键词： Carbon nanotubes Polymers Thermal resistance Heat transfer Curing

来源：评论

学校读者我要写书评

暂无评论

Study of Light Emitting Diodes for the Application of Plant Growth in Green House

Study of Light Emitting Diodes for the Application of Plant ...

引用

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Meijuan Fu Lianqiao Yang Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Department of Materials Science and Engineering Shanghai University，P.O.B 143 149 Yanchang Rd. Sh

In this paper, the reliability issue of the LED lamp in high temperature and moisture condition was investigated. Thermal stress and hygroscopic stress in the LED package were obtained by coupled-field analysis using Finite element analysis (FEA). The results demonstrate that the temperature of the module can reach saturation in tens of seconds while the moisture field needs longer to reach balance. 85℃/85RH can reach the same distribution of relative humidity with 65℃/65RH, but the time spent is half. So temperature is the important factor to affect the humidity distribution. The moisture concentration is better than the relative humidity response to the material moisture level. So we made further research on hygroscopic stress. Both the thermal stress and hygroscopic stress contributed to the delaminations in LED packages.

关键词： Stress Moisture Light emitting diodes Electronic packaging thermal management Temperature Materials Thermal stresses

来源：评论

学校读者我要写书评

暂无评论

Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders

Recent Progress in The Studies of Low Melting Sn-Based Pb-Fr...

引用

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Yang Lin Luqiao Yin Xicheng Wei Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Educati School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20 School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20

Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

关键词： Nanoparticles Compounds Lead Packaging Gallium

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共1页 << < 1 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：