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2024 Conference on Spectral Technology and applications, CSTA 2024

作者： Xu, Tingting Li, Xin Zheng, Longhao Wang, Kexin Huang, Lingling Beijing Engineering Research Center of Mixed Reality and Advanced Display School of Optics and Photonics Beijing Institute of Technology Beijing100081 China MOE Key Laboratory of Photoelectronic Imaging Technology and System MIIT Key Laboratory of Photonics Information Technology School of Optics and Photonics Beijing Institute of Technology Beijing100081 China

ISBN: (纸本)9781510683082

Computer-generated holography (CGH) is one of promising technologies in wavefront engineering, and multiplexing holography brings more information channels. Inspired by code division multiplexing (CDM) in communications, CDM holography demonstrate its feasibility to recording independent images with high-density in a single hologram. Here, we design CDM holograms with nonorthogonal coded beams as illumination light to record the optical information of both binary and gray-level target images. The results exhibit that optimization in CDM holography ensures a low-level cross talk between each channel. Also, it is difficult for eavesdroppers to decode any information of coded illuminations. Such a large number of information channels and its outstanding features can offer high security for optical data. © 2024 SPIE.

关键词： Holograms

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Single-Celled Metasurface Full-Color Holography by Independent Phase Control at RGB Wavelengths

Single-Celled Metasurface Full-Color Holography by Independe...

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2024 Conference on Spectral Technology and applications, CSTA 2024

作者： Zhang, Xiaotong Li, Xin Huang, Lingling Wang, Yongtian Beijing Engineering Research Center of Mixed Reality and Advanced Display School of Optics and Photonics Beijing Institute of Technology Beijing100081 China MOE Key Laboratory of Photoelectronic Imaging Technology and System MIIT Key Laboratory of Photonics Information Technology School of Optics and Photonics Beijing Institute of Technology Beijing100081 China

ISBN: (纸本)9781510683082

Color holographic display is one of the most promising future display technologies. Introducing metasurfaces to holographic display brings more possibilities. Spatially multiplexing multicolor holography is a common way and it has lower resolution and irreducible noise. In order to realize full color metasurface holography, we elaborately design a metasurface in which each unit structure can independently manipulate the phase at three wavelengths of red, green and blue (RGB). The computer-generated holograms (CGH) of RGB components are obtained firstly, and the phase modulation of G-CGH is based on geometric phase, and the phase difference between R-G CGH and B-G CGH are based on the propagation phase, hence a full-color hologram can be reconstruct without relying on spatial multiplexing. Our work would have important implications for color holographic projection, near-eye displays, and multi-wavelength control. © 2024 SPIE.

关键词： Holograms

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A Novel Voltage-Controlled Oscillator Suitable for Silicon-Based Microdisplay Driver Clock

A Novel Voltage-Controlled Oscillator Suitable for Silicon-B...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Maoxiang Xu Jianhua Zhang Aiying Guo Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China

In order to provide silicon microdisplay drivers a wide tuning range clock and solve the problem that the tuning range of VCO is not wide enough, a wide tuning range multi-band feedforward differential delay cell based on CMOS inverter is proposed in this paper. The cell achieves the wide-tuned multi-band effect by adjusting the control voltage (VCTRL) and the control voltage sequence bits. In the HLMC 55LP process, the differential VCO can be adjusted from 3.92GHz to 8.63GHz to achieve a wide tuning range of multi-band output with a FOM of −157.02dBc/Hz.

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Oxide Semiconductor Thin-Film Transistors with High Mobility and Stability

Oxide Semiconductor Thin-Film Transistors with High Mobility...

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International Conference on display Technology, 2024

作者： Yan, Guowen Wang, Dejian Sun, Xiaoqi Wen, Pan Peng, Cong Xu, Lin Ding, Lidong Chen, Fa-Hsyang Li, Xifeng Xi, Wangfeng Xing, Rubo Li, Junfeng Hefei Visionox Technology Co. Ltd Anhui Hefei230000 China Kunshan Govisionox Optoelectronics Co. Ltd Jiangsu Suzhou215301 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China

This paper presents a oxide thin film transistors with high mobility by a new fabricate method. The high mobility TFT with ultra-high mobility of 55cm2/Vs has been obtained, and the PBTS and NBTS has also been optimiz... 详细信息

关键词： Thin film transistors

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Multi-depth Hologram Generation with Unsupervised-learning Based Computer-generated Holography

Multi-depth Hologram Generation with Unsupervised-learning B...

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Digital Holography and Three-Dimensional Imaging, DH 2022

作者： Shui, Xinghua Zheng, Huadong Department of Precision Mechanical Engineering Shanghai University Shanghai200444 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai200072 China

Unsupervised-learning based computer-generated holography provides an approach for 2D hologram generation. We propose an unsupervised learning network for multi-depth hologram generation with fully utilizing the diffe... 详细信息

ISBN: (纸本)9781957171128

关键词： Holograms

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Mechanical Properties of Flip-Chip Bonding Structures for Micro-Led Devices: Cu-Cu Bonding with Passivation Layer and Indium Bumps Bonding

Mechanical Properties of Flip-Chip Bonding Structures for Mi...

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2023 China Semiconductor Technology International Conference, CSTIC 2023

作者： Wang, Kefeng Chen, Zehua Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Ministry of Education Key Laboratory of Advanced Display and System Applications Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China

ISBN: (纸本)9798350311006

A traditional bonding structure with indium bumps and a new bonding structure with passivation layer using Cu bumps were simulated to bond Micro-LED and substrate. Anand model and bilinear isotropic hardening model were used to characterize the viscoplastic behavior of In and the plastic behavior of composite structure simplified from the combination of Cu and Au, respectively. Mechanical properties of two kinds of micro-display devices with different bonding structures were analyzed by the ANSYS finite element method and the thermo-mechanical coupling field. The deformation and stress of the micro-display device using Cu-Cu bonding structure with passivation layer are reduced by 19.5% and 59.1% compared with the device bonded by In bumps. © 2023 IEEE.

关键词： display devices

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Simulation Study on Electrothermal and Mechanical Coupling of Bumps in 5×5 Micro-LED Array 20

Simulation Study on Electrothermal and Mechanical Coupling o...

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20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

作者： Yang, Zhu Fu, Hao Wang, Kefeng Ji, Xiaoxiao Chen, Liang Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai2000072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai2000072 China

ISBN: (纸本)9798350385373

As a frontier research field of next-generation display technology, Micro-LED technology has the advantages of high brightness, high contrast and high energy efficiency. With the development trend of high-power, multi-array LEDs, the research on thermal stability of LEDs is gradually deepened. In order to explore the thermal stability of bumps during the working of Micro-LED, COMSOL Multiphysics simulation software and finite element method were used to analyze the electrothermal and mechanical coupling of bumps in 5×5 Micro-LED array in this paper. Flip-chip bonding was employed for interconnection of Micro-LED array and Si driver chip with the gap except Micro-LED devices between sapphire and silicon substrate filled with underfill to alleviate the stress concentration. The effects of different filling materials, applied current densities, and dimensions of In bumps (cylindrical) on thermal stress and displacement of the Micro-LED array were analyzed in detail. The results show the stress and displacement of the bumps with polyimide (PI) underfill were the smallest than that of bumps with benzocyclobutene (BCB) and epoxy resin (EP) underfill. Additionally, the temperature, thermal stress, and displacement of the bumps were also affected by the applied current density and the size of the bumps. © 2023 IEEE.

关键词： Light emitting diodes

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Fabrication and Study of Micro-LED Quantum Dot Color Conversion Layer Based on Inkjet Printing 20

Fabrication and Study of Micro-LED Quantum Dot Color Convers...

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20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

作者： Wang, Xinyi Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Zhang, Jianhua School of Microelectronics Shanghai University Shanghai200444 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai200072 China School of Materials Science and Engineering Shanghai University Shanghai200072 China

ISBN: (纸本)9798350385373

In this study, red and green quantum dot color conversion layer was successfully fabricated using inkjet printing (IJP) technology on a blue micro-light-emitting diode (Micro-LED) backlight. To reduce the optical crosstalk between different sub-pixels, a black matrix (BM) layer with a thickness of 15 μm was proposed. Furthermore, to protect quantum dots (QDs), a SiO2 passivation layer with a thickness of 3 nm was uniformly deposited on the entire pattern by Atomic Layer Deposition (ALD). Subsequently, a pixel array featuring a sub-pixel size of 37.5 μm and a line width of 2 μm was fabricated on the BM layer treated with Reactive Ion Etching (RIE), and the thickness of the QDCC layer was controlled by RIE. The external quantum efficiencies of the red and green QDCC layer were 12.9% and 18.2%, respectively, and the emission spectra had blue light being transmitted, accompanied by a slight redshift. This research addresses the gaps in display applications and holds promise for the future advancement of Micro-LED display technology. © 2023 IEEE.

关键词： Atomic layer deposition

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Simulation of Bonding and Reliability for Micro-Led Array Based on Copper Pillar Bump

Simulation of Bonding and Reliability for Micro-Led Array Ba...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Hao Fu Zhu Yang Xinhui Meng Hong Fan Xiuzhen Lu Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

With the rapid development of automotive electronics and near-eye displays, more stringent requirements have appeared for the heterogeneous integration technology of Micro-LED. Copper pillar bumps, which offer enhanced electrical conductivity, thermal conductivity, and mechanical properties, can meet the demands for higher density and smaller size packaging in Micro-LED array applications. In Micro-LED system integration, bonding plays a critical role as the bonding conditions significantly influence the performance and reliability of Micro-LED. Consequently, it is essential to investigate the effects of bonding conditions on Micro-LED devices to ensure optimal performance and reliability of copper pillar bumps. A model with copper pillar bumps and Micro-LED chips was presented with a bonding simulation and parameter analysis performed in this paper. The finite element method was utilized to examine the thermal-mechanical coupling of one quarter of a $5 \times 5$ Micro-LED array model in this paper. The stress and deformation of the bumps during the bonding process and the effects of bonding conditions on the stress and deformation of the bumps was investigates.

关键词： Performance evaluation Deformation Conductivity Fatigue Bonding forces Thermal conductivity Copper Reliability Bonding Stress

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Efficient and stable hybrid perovskite-organic light-emitting diodes with external quantum efficiency exceeding 40 per cent

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Light(Science & applications) 2024年第7期13卷 1364-1371页

作者： Lingmei Kong Yun Luo Qianqian Wu Xiangtian Xiao Yuanzhi Wang Guo Chen Jianhua Zhang Kai Wang Wallace CHChoy Yong-Biao Zhao Hongbo Li Takayuki Chiba Junji Kido Xuyong Yang Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai UniversityShanghai 200072China. Institute of Nanoscience and Applications Department of Electrical and Electronic EngineeringSouthern University of Science and TechnologyShenzhen 518055China. Department of Electrical and Electronic Engineering The University of Hong KongHong KongChina. Department of Physics and Lakeside AR/VR Laboratory International Joint Research Center for Optoelectronic and Engineering ResearchYunnan UniversityKunming 650091China. Experimental Center of Advanced Materials School of Materials Science and EngineeringBeijing Institute of TechnologyBeijing 100081China. Graduate School of Organic Materials Science Frontier Center for Organic MaterialsYamagata University4-3-16 JonanYonezawa 992–8510Japan

Light-emitting diodes(LEDs)based on perovskite semiconductor materials with tunable emission wavelength in visible light range as well as narrow linewidth are potential competitors among current light-emitting display technologies,but still suffer from severe instability driven by electric ***,we develop a stable,efficient and highcolor purity hybrid LED with a tandem structure by combining the perovskite LED and the commercial organic LED technologies to accelerate the practical application of *** LED and organic LED with close photoluminescence peak are selected to maximize photon emission without photon reabsorption and to achieve the narrowed emission *** designing an efficient interconnecting layer with p-type interface doping that provides good opto-electric coupling and reduces Joule heating,the resulting green emitting hybrid LED shows a narrow linewidth of around 30 nm,a peak luminance of over 176,000 cd m^(−2),a maximum external quantum efficiency of over 40%,and an operational half-lifetime of over 42,000 h.

关键词： diodes narrow quantum

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