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检索条件"机构=Key Laboratory of Advanced Display and System Application"

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Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes 21

Finite Element Simulation of Electrothermal and Mechanical C...

引用

21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Yang, Zhu Li, Jianxin Fu, Hao Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobuteneBCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes. ©2024 IEEE.

关键词： Computer resource management

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Real-time streaming and robust streaming H.264/AVC video

Real-time streaming and robust streaming H.264/AVC video

引用

International Conference on Image and Graphics (ICIG)

作者： Zhi-Gang Li Zhao-Yang Zhang Shanghai University China Key Laboratory of Advanced Display and System Applications

With the increasingly extensive applications for the new emerging video coding standard, H.264/AVC, it becomes more and more important that we transport H.264/AVC video over MPEG-2 system by exploiting all the existing large amount of the infrastructure of MPEG-2 systems. In this paper, we propose two solutions for it. The key technologies are as follows: firstly we use an H.264/AVC video as an elementary stream of an MPEG-2 system and multiplex it into a TS (transport stream), then extend the T-STD (transport stream-system target decoder) of MPEG-2 standard, so as to transport MPEG-2 TS through Internet and decode it in the client. Ordinarily, the decoded elementary stream should come from a container (a system layer encapsulation including a compression layer), such as AVI. However, we take MPEG-2 TS as a container herein. We encapsulate the H.264/AVC elementary stream into this container in the server, and extract the H.264/AVC video from it to be decoded and be represented. If we use the UDP (user datagram protocol) as a transport protocol, the streaming process will be a real-time one. The experiment result shows that we get a good result, with less than 5% frames whose PSNR<40 dB. We can even get a robust streaming by using the HTTP/TCP (hyper-text transport protocol/transport control protocol) as a transport protocol. All the streaming solutions that we proposed in this paper can also be used for mobile video.

关键词： Streaming media Robustness Automatic voltage control Transport protocols Decoding Transform coding Containers Video coding Internet Encapsulation

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The design and realization of CAN bit timing logic

The design and realization of CAN bit timing logic

引用

2nd Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics, PrimeAsia 2010

作者： Jinyan, Guo Yueli, Hu Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China College of Mechanical and Electronic Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China

ISBN: (纸本)9781424467372

In the CAN bus, mistakes in bit timing will lead to serious decline in bus performance. How to deal with the bit timing of CAN bus communication decided whether the CAN controller can receive or transmit data correctly. According to bus protocol, bit synchronization will fix bit errors resulting from improper setting in many cases. This paper illustrated the structure of nominal bit time and the principle of bit synchronization, gave an optimized method of nominal bit time of CAN2.0 protocol, that the four non-overlapping segments of traditional nominal bit time is simplified to 3 non-overlapping segments, and on this basis, proposed a design method of bit timing processor of CAN bus based on the synchronized state machine. It also provides programmable time segments to compensate for the propagation delay times and phase shifts, and gave simulation and verification of the design. The results show that the design work which obeys the CAN2.0 protocol, can more easily deal with the CAN bus communication bit timing, realized the control of CAN bus protocol on the bit timing and bit synchronization, and better optimizes the CAN network.

关键词： Synchronization

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Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection 21

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interco...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Meng, Xinhui Wang, Kefeng Fan, Hong Yang, Zhu Fu, Hao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED displays have garnered widespread attention due to their high resolution, high brightness, and long lifespan. However, the heterogeneous integration and the reliability of Micro-LEDs pose significant challenges for their commercialization. As Micro-LED products develop towards larger sizes and narrower pitches, the Au/In bonding process has become a prevalent strategy for achieving high-resolution interconnections. To address the issue of the life span being affected by the plastic deformation of indium bumps, which ultimately fail in the form of yielding, an Au/In-resin hybrid bonding technique to improve the reliability of high-resolution Micro-LEDs was proposed in this paper. The reliability of the flip-chip bonding structure of a 4×4 Micro-LED array was analyzed using ANSYS simulation software and finite element methods. The Anand unified viscoplastic constitutive model was employed for both indium bumps and the encapsulating resin. The model was subjected to temperature cycling loads ranging from -55℃ to 125℃ in accordance with the JEDEC temperature cycling standard. The Coffin-Manson fatigue life prediction model, which accounts for plastic strain in materials, was introduced to estimate the thermal cycling fatigue life of the Micro-LED interconnection structures. The equivalent plastic strain range of hybrid bonding device was 6.708×10-3, surpassing the 7.59×10-3observed in device with conventional bump bonding. The hybrid bonding device exhibited a thermal cycling life of 12747 cycles, which was about 36% longer than that of the bump bonding device. It suggests that resin helps to extend the thermal cycling life of the device and enhance its reliability. ©2024 IEEE.

关键词： Flip chip devices

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Building an AMBA AHB compliant memory controller

Building an AMBA AHB compliant memory controller

引用

International Conference on Measuring Technology and Mechatronics Automation

作者： Hu, Yueli Yang, Ben Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China College of Mechanical and Electronic Engineering and Automation Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769542966

Microprocessor performance has improved rapidly these years. In contrast, memory latencies and bandwidths have improved little. The result is that the memory access time has been a bottleneck which limits the system performance. Memory controller (MC) is designed and built to attacking this problem. The memory controller is the part of the system that, well, controls the memory. The memory controller is normally integrated into the system chipset. This paper shows how to build an advanced Microcontroller Bus Architecture (AMBA) compliant MC as an advanced High-performance Bus (AHB) slave. The MC is designed for system memory control with the main memory consisting of SRAM and ROM. Additionally, the problems met in the design process are discussed and the solutions are given in the paper.

关键词： Buses

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ITO interlayer to improve the electrical performance of HfInZnO-TFTs 21

ITO interlayer to improve the electrical performance of HfIn...

引用

21st International display Workshops 2014, IDW 2014

作者： Li, Jun Zhang, Jian-Hua Zhang, Hao Jiang, Xue-Yin Zhang, Zhi-Lin School of Material Science and Engineering Shanghai University Jiading Shanghai201800 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China

ISBN: (纸本)9781510827790

We have fabricated hafnium-indium-zinc-oxide (HflnZnO) thin film transistors (TFT) with indium-tin-oxide (ITO) interlayer. Compared with conventional HflnZnO-TFT, the electrical performance and bias stability of HflnZnO-TFTs with ITO interlayer are improved. The performance enhancement is attributed to a decrease in interface trap state and an increase in carrier concentration. © 2014 ITE and SID.

关键词： Tin oxides

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Metal-oxide field-effect transistors for display and beyond 19

Metal-oxide field-effect transistors for display and beyond

引用

19th International Conference on Optical Communications and Networks, ICOCN 2021

作者： Li, Linkang Fu, Wenhui Li, Jun Zhang, Jianhua Zhang, Zhilin School of Material Science and Engineering Shanghai University Shanghai Jiading201800 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China

ISBN: (纸本)9781665424462

Metal oxide field-effect transistors (FETs) have potential applications in display, flexible electronic device. Here, we will report the advance of our OLED display, metal oxide FETs, and application in beyond display. We have paid more attention to the stability improvement, interface trap of MO-TFT, and application in CMOS circuit, artificial synapse and gas sensor. © 2021 IEEE.

关键词： Field effect transistors

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High-performance thin film encapsulation for the application of white organic light-emitting diodes

引用

作者： Liao, Yingjie Liu, Jizhong Zhang, Yong Li, Long Yu, Fangfang Wei, Bin Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai 200072 China School of Mechanical and Electronic Engineering and Automation Shanghai University Shanghai 200072 China

ISBN: (纸本)0878492119

Color conversion method has been used to fabricate chromatic-stability white organic light-emitting diodes (OLEDs). Experimental results found little CIE coordinate migration while changing operation voltage from 5 V to 12 V. A simple thin-film encapsulation (TFE) structure has been developed through vacuum thermal deposition in combination with plasma enhanced chemical vapor deposition. The luminance of the encapsulated white OLED remain unchanged during the test time. The novel approach is being expected to lower the cost and achieve high-performance TFE. © (2011) Trans Tech Publications.

关键词： Plasma enhanced chemical vapor deposition

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Motion foreground detection based on wavelet transformation and color ratio difference

Motion foreground detection based on wavelet transformation ...

引用

2010 3rd International Congress on Image and Signal Processing, CISP 2010

作者： Guan, Ye-Peng Cheng, Xiao-Qing Jia, Xin-Li School of Communication and Information Engineering Shanghai University China Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai China School of Communication and Information Engineering Shanghai University Shanghai China

ISBN: (纸本)9781424465149

An algorithm is presented for detecting foreground objects with multi-scale wavelet transformation and color ratio difference. Multi-scale wavelet transformation method is used to segment moving objects based on spatial property. Ratio differences between two adjacent pixels in four different directions are used to classify object pixels. RGB color space is selected to segment moving foregrounds and eliminate cast shadows instead of complex color models. The developed approach does not require any complex supervised training phase, manual calibration or hypothesis in removing shadow. Experiments have highlighted that the proposal is efficient to segment foregrounds and suppress shadows. ©2010 IEEE.

关键词： Pixels

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Remote sensing image interpolation via the nonsubsampled contourlet transform

Remote sensing image interpolation via the nonsubsampled con...

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2nd International Conference on Image Analysis and Signal Processing, IASP'2010

作者： Xu, Tongyang Fang, Yong School of Comm. and Info. Eng. Key Lab of Specialty Fiber Optics and Optical Access Networks Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai China

ISBN: (纸本)9781424455553

A novel nonsubsampled contourlet Bi-linear interpolation algorithm for remote sensing image is proposed, which is based on the estimation of detail nonsubsampled contourlet coefficients at high resolution scales. The method employs Bi-linear interpolation algorithm to anticipate the high frequency component on high resolution from the high frequency component on low resolution. The experiment results demonstrate that the algorithm can get a higher PSNR and keep more image detail information than traditional interpolation algorithms. ©2010 IEEE.

关键词： Interpolation

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