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International Conference on Intelligent Sensing and Information Processing (ICISIP)

作者： Liquan Shen Zhaoyang Zhang Zhi Liu Wenjun Zhang Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai China Institute of Image Communication& Information Processing Shanghai Jiaotong University China

In this paper, we propose an adaptive fractional pixel search algorithm for reduction computation its load. Based on that SAD (sum of absolute difference) error surface is unimodal within the range of plusmn1 pixel, a novel fractional pixel search bypass strategy is first proposed; Then, a strategy of fractional pixel search early termination based on all-zero block detection is proposed. Finally, an adaptive fractional pixel search algorithm adopting above strategies and improved CBFPS (center biased fractional pixel search) algorithm is proposed. Compared with the fractional pixel full search algorithm and JVT-F017 that adopts CBFPS, simulation results show that the proposed algorithm can reduce 76.60% and 68.22% fractional pixel search points respectively while it still maintains similar coding efficiency.

关键词： Motion estimation Vectors Video coding Testing Paramagnetic resonance Pixel Image communication Information processing Computer displays Redundancy

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High Performance All Oxide Thin Film Transistor With Ink-Jet Printing Metal Oxide Dielectric Pattern

SSRN

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SSRN 2024年

作者： Zhao, Zexian Gui, Zhenghao Xu, Meng Zou, Kefeng Chen, Longlong Li, Xifeng Zhang, Jianhua School of Materials Science and Engineering Shanghai University Shanghai200444 China Key Laboratory of Advanced Display and System Application of Ministry of Education Shanghai University Shanghai200072 China

In this paper, the effect of the printing parameters on the forming behavior of dot, line and plane for hafnium aluminum oxide (HAO) is thorough investigated by simulation and experiment. At first, the spreading process of inkjet droplets has been numerically simulated through the utilization of the volume of fluid (VOF) model. And the optimal contact angle and drop space for printing HAO pattern were obtained. Ultrasonic treatment can remove some polar hydrophilic molecules on the surface of the substrate, which controlled the spread of the printed patterns. The inkjet-print HAO film exhibits the permittivity of 9.3 at 100kHz and afforded a leakage current below 10-6 A/cm2 at 2 MV. Finally, the fabricated TFTs using inkjet print exhibit mobility (μ) of 8.89 cm2v-1s-1, subthreshold swing (SS) of 0.09 V/decade and ON-OFF-current ratio (Ion/Ioff) of 8.69×108. Implied that the ultrasonic treatment can serve as guidelines for high quality printing pattern. © 2024, The Authors. All rights reserved.

关键词： Morphology

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Effects of surface chemical treatment and annealing on p-GaN/ZnO:Ga contact

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Faguang Xuebao/Chinese Journal of Luminescence 2010年第6期31卷 848-853页

作者： Wang, Shu-Fang Li, Xi-Feng Zhang, Jian-Hua Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai 200072 China School of Mechanical and Electronic Engineering and Automation Shanghai University Shanghai 200072 China

ZnO:Ga (GZO) transparent conductive thin film was deposited on p-GaN acting as the current spreading layer, but it leads to a large contact barrier because of the formation of Schottky contact. However, ohmic contact is of great importance to powered LED. In order to decrease the contact barrier, HCl and NaOH treatment of the p-GaN surface and annealing were employed in this work. The effects of different chemical treatment and annealing on p-GaN/GZO contact property were studied. It is obvious that solutions of alkaline treatment of p-GaN surface can decrease the interfacial barrier, which led to ohmic contact, and the barrier can be lightly increased by annealing.

关键词： Zinc oxide

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Reliability of organic light-emitting diodes in low-temperature environment

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Chinese Physics B 2020年第12期29卷 112-118页

作者： Saihu Pan Zhiqiang Zhu Kangping Liu Hang Yu Yingjie Liao Bin Wei Redouane Borsali Kunping Guo School of Microelectronics and Control Engineering Changzhou UniversityChangzhou 213164China School of Mechatronic Engineering and Automation Key Laboratory of Advanced Display and System ApplicationsMinistry of EducationShanghai UniversityShanghai 200072China Universdity of Grenoble Alpes CNRSCERMAVF-38000 GrenobleFrance London Centre for Nanotechnology University College LondonLondon WC1H 0AHUK

Organic light-emitting diode(OLED)is an electroluminescent technology that relies on charge-carrier dynamics and is a potential light source for variable environmental ***,by exploiting a self-developed low-temperature testing system,we investigated the characteristics of hole/electron transport,electro-optic conversion efficiency,and operation lifetime of OLEDs at low-temperature ranging from-40℃to 0℃and room temperature(25℃).Compared to devices operating at room temperature,the carrier transport capability is significantly decreased with reducing temperature,and especially the mobility of the hole-transporting material(HTM)and electron-transporting material(ETM)at-40℃decreases from 1.16×10-6 cm2/V·s and 2.60×10-4 cm2/V·s to 6.91×10-9 cm2/V·s and 1.44×10-5 cm2/V·s,***,the temperature affects differently on the mobilities of HTM and ETM,which favors unbalanced charge-carrier transport and recombination in OLEDs,thereby leading to the maximum current efficiency decreased from 6.46 cd·A-1 at 25℃to 2.74 cd·A-1 at-40℃.In addition,blue fluorescent OLED at-20℃has an above 56%lifetime improvement(time to 80%of the initial luminance)over the reference device at room temperature,which is attributed to efficiently dissipating heat generated inside the device by the low-temperature environment.

关键词： organic light-emitting diodes(OLEDs) low temperature reliability operation lifetime

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Photo-controlled degradation of PLGA/Ti3C2 hybrid coating on Mg-Sr alloy using near infrared light

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Bioactive Materials 2021年第2期6卷 568-578页

作者： Li Liu Bo Huang Xiangmei Liu Wei Yuan Yufeng Zheng Zhaoyang Li Kelvin Wai Kwok Yeung Shengli Zhu Yanqin Liang Zhenduo Cui Shuilin Wu Hubei Key Laboratory of Polymer Materials Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional MaterialsSchool of Materials Science&EngineeringHubei UniversityWuhan430062China State Key Laboratory for Turbulence and Complex System and Department of Materials Science and Engineering College of EngineeringPeking UniversityBeijing100871China The Key Laboratory of Advanced Ceramics and Machining Technology by the Ministry of Education of China School of Materials Science&EngineeringTianjin UniversityTianjin300072China Department of Orthopaedics&Traumatology Li Ka Shing Faculty of MedicineThe University of Hong KongPokfulamHong Kong999077China

A PLGA/Ti_(3)C_(2) hybrid coating was successfully deposited on the surface of magnesium-strontium(Mg-Sr)*** with the corrosion current density(icorr)of the Mg-Sr alloy(7.13×10^−5 A/cm^2),the modified samples(Mg/PLGA/Ti_(3)C_(2))was lower by approximately four orders of magnitude(7.65×10^−9 A/cm^2).After near infrared 808 nm laser irradiation,the icorr of the modified samples increased to 3.48×10^−7 A/cm^*** mechanism is that the local hyperthermia induced the free volume expansion of PLGA,and the increase in intermolecular gap enhanced the penetration of ***,the cytotoxicity study showed that the hybrid coating endowed the Mg-Sr alloy with enhanced biocompatibility.

关键词： Magnesium Ti_(3)C_(2)Mxene Coating Photoresponsive Degradation

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High color rendering index white LEDs fabricated using InP/ZnS green-emitting quantum dots and InP/ZnSe/ZnS red-emitting quantum dots

High color rendering index white LEDs fabricated using InP/Z...

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16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (第十六届中国国际半导体照明论坛暨2019国际第三代半导体论坛)

作者： Doudou Zhang Yuxian Yan Fan Cao Gongli Lin Xuyong Yang Wanwan Li Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai UniversityShanghai 200072China Key Laboratory Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education State Key Lab of Metal Matrix Composites School of Materials Science and EngineeringShanghai Jiao T Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education

ISBN: (数字)9781728157566

ISBN: (纸本)9781728157573

Quantum dots(QDs)have the advantages of spectrally adjustable,high quantum yield and narrow half-peak width,and are the most potential light-converting materials for white light that achieve high color rendering index and high *** InGaN blue light chip currently used excites Ce-doped yttrium aluminum garnet(YAG: Ce3+)yellow phosphor,and the white light-emitting diode(WLED)realized exhibits color rendering index(CRI)<80 and an unsatisfactory color coordinate because of lack of red spectral *** order to improve the CRI of white LEDs,in this paper,we fabricated InP/ZnS green-emitting QDs and InP/ZnSe/ZnS red-emitting QDs,and excited YAG: Ce3+yellow phosphor,InP/ZnS green-emitting QDs and InP/ZnSe/ZnS red-emitting QDs with blue chip,made WLED(Ⅰ),and compared with WLED(Ⅱ)generated by using blue LED chip to excite YAG: Ce3+yellow *** result shows that the WLED(Ⅰ)achieves a CRI of 90.3 at a driving current of 5 *** Commission International de L'Eclairage(CIE)chromaticity coordinates are(0.3393,0.3342),and the correlated color temperature(CCT)is 5186K,which is high quality white light close to sunlight.

关键词： Light emitting diodes II-VI semiconductor materials Zinc compounds Phosphors Color Indium phosphide III-V semiconductor materials

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THE REMOTE SENSING IMAGE GEOMETRICAL MODEL of BP NEURAL NETWORK

THE REMOTE SENSING IMAGE GEOMETRICAL MODEL of BP NEURAL NETW...

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2020 International Conference on Geomatics in the Big Data Era, ICGBD 2020

作者： Yue, C.Y. Sun, T. Xie, J.F. Beijing Institute of Space Mechanics and Electricity Beijing China Beijing Key Laboratory of Advanced Optical Remote Sensing Technology Beijing China Key Laboratory of Technology in Geo-spatial Information Processing and Application System Aerospace Information Research Institute Chinese Academy of Sciences Beijing China Land Satellite Remote Sensing Application Center Ministry of Natural Resources of P. R. China Beijing China

Imagery geometry models (IGMs) of the high-resolution satellite images (HRSIs) are always of great interest in the photogrammetry and remote sensing community for the raising new kinds of sensors and imaging systems. Especially the generalized sensor models (GSMs) have been widely used for positioning of satellite images, and the accuracy are already validated. Since Back propagation (BP) neural network is a better choice for the two key reasons of the replacement of physical sensor models by generalized sensor models, numerous mathematical estimations for every specialized sensor, and secret equations of the IGMs. Experiments are carried out to test the approximation accuracy of the new generalized sensor model. And the experimental results show that, the BP neural network is of extremely high accuracy for satellite imagery photogrammetric restitution. © 2020 C. Y. Yue et al.

关键词： Backpropagation

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Mechanical Properties of Flip-Chip Bonding Structures for Micro-Led Devices: Cu-Cu Bonding with Passivation Layer and Indium Bumps Bonding

Mechanical Properties of Flip-Chip Bonding Structures for Mi...

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2023 China Semiconductor Technology International Conference, CSTIC 2023

作者： Wang, Kefeng Chen, Zehua Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Ministry of Education Key Laboratory of Advanced Display and System Applications Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China

ISBN: (纸本)9798350311006

A traditional bonding structure with indium bumps and a new bonding structure with passivation layer using Cu bumps were simulated to bond Micro-LED and substrate. Anand model and bilinear isotropic hardening model were used to characterize the viscoplastic behavior of In and the plastic behavior of composite structure simplified from the combination of Cu and Au, respectively. Mechanical properties of two kinds of micro-display devices with different bonding structures were analyzed by the ANSYS finite element method and the thermo-mechanical coupling field. The deformation and stress of the micro-display device using Cu-Cu bonding structure with passivation layer are reduced by 19.5% and 59.1% compared with the device bonded by In bumps. © 2023 IEEE.

关键词： display devices

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Research on panoramic illumination imaging system based on SURF algorithm 18

Research on panoramic illumination imaging system based on S...

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18th China International Forum on Solid State Lighting and 7th International Forum on Wide Bandgap Semiconductors, SSLChina: IFWS 2021

作者： Wang, Fei Ji, Xiaoxiao Yin, Luqiao Guo, Aiying Zhang, Jianhua Shanghai University School of Microelectronics Shanghai201800 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China

ISBN: (纸本)9781665495462

Underwater lighting systems and imaging systems are mainly used in underwater pipeline internal inspection, underwater environment information collection, resource detection, etc. This article explores a panoramic lighting imaging system based on an underwater environment. Mainly from the intelligent lighting system, panoramic imaging system, and system integration optimization. The intelligent lighting system mainly explores a high-brightness intelligent lighting device with a high-brightness lighting system. The imaging system mainly works in conjunction with the lighting system. The imaging system mainly collects 250° panoramic picture information and 250° video information for scientific research and other tasks. Provide appropriate information and data. Finally, system integration optimization and joint work are carried out. © 2021 IEEE.

关键词： Imaging systems

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Simulation Study on Electrothermal and Mechanical Coupling of Bumps in 5×5 Micro-LED Array 20

Simulation Study on Electrothermal and Mechanical Coupling o...

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20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

作者： Yang, Zhu Fu, Hao Wang, Kefeng Ji, Xiaoxiao Chen, Liang Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai2000072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai2000072 China

ISBN: (纸本)9798350385373

As a frontier research field of next-generation display technology, Micro-LED technology has the advantages of high brightness, high contrast and high energy efficiency. With the development trend of high-power, multi-array LEDs, the research on thermal stability of LEDs is gradually deepened. In order to explore the thermal stability of bumps during the working of Micro-LED, COMSOL Multiphysics simulation software and finite element method were used to analyze the electrothermal and mechanical coupling of bumps in 5×5 Micro-LED array in this paper. Flip-chip bonding was employed for interconnection of Micro-LED array and Si driver chip with the gap except Micro-LED devices between sapphire and silicon substrate filled with underfill to alleviate the stress concentration. The effects of different filling materials, applied current densities, and dimensions of In bumps (cylindrical) on thermal stress and displacement of the Micro-LED array were analyzed in detail. The results show the stress and displacement of the bumps with polyimide (PI) underfill were the smallest than that of bumps with benzocyclobutene (BCB) and epoxy resin (EP) underfill. Additionally, the temperature, thermal stress, and displacement of the bumps were also affected by the applied current density and the size of the bumps. © 2023 IEEE.

关键词： Light emitting diodes

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