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2008 International Conference on advanced Infocomm Technology, ICAIT '08

作者： Feng, Ran Ruipeng, Yao Zhijie, Tang Meihua, Xu Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai 200072 China Microelectronic Research and Development Center Shanghai University Shanghai 200072 China Electromechanical Engineering and Automation Institute Shanghai University Shanghai 200072 China School of Mechatronical Engineering and Automation Shanghai University Shanghai 200072 China

ISBN: (纸本)9781605580883

This paper presents an efficient pulse width modulation (EPWM) drive method, which is used to implement the driving controller for TFT-LCD with high gray scale. To solve the time redundancy issues in the traditional pulse width modulation (TPWM) drive method, the proposed method divides the display panel into several sub-partitions and scans the sub-partitions alternately, and the gray data and vanishing signals are transmitted with separate wires in driving controllers. It's theoretically proved that the drive efficiency can achieve 100% for any gray scale display systems with EPWM, and the implementation also shows that, comparing with the TPWM method, the minimum clock frequency in the TFT-LCD systems can greatly reduced with the proposed method. Copyright © 2008 ACM.

关键词： Efficiency

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A High Gray Scale TFT-LCD Drive system

A High Gray Scale TFT-LCD Drive System

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2008 International Conference on Audio，Language and Image Processing(2008国际声音、语言、图像过程大会)

作者： Zhijie Tang Ran Feng Meihua Xu Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai Universi Microelectronic Research and Development Center Shanghai University Shanghai 200072 China

This paper describes a new drive method of TFT-LCD for high gray scale display. The method is based on Rotating Ordered dithering algorithm and frame modulating technology. This method can use low-bit gray scale TFT-LCD panel to realize a high gray scale display. This method is applied to a 1280*1024 dots RGB 6-bit TFT-LCD panel which can display 256-level gray scale.

关键词： Thin film transistors Pixel Artificial neural networks SDRAM Image color analysis Drives Modulation

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Study on window-scaling algorithm and its FPGA implementation

Study on window-scaling algorithm and its FPGA implementatio...

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Congress on Image and Signal Processing, CISP

作者： Huijie Ji Meihua Xu Feng Ran School of Mechatronical Engineering and Automation Shanghai University Shanghai China Key Laboratory of Advanced Displays and system Application Ministry of Education Shanghai University China

Traditional bilinear scaling method requires pre-zoom operation while zooming-out an image. In that way, the image resizing system will demand two different scaling sets, one for zooming-out and another for zooming-in, and hence leads to higher cost of hardware implementation and system complication. This paper presents an improved scaling method called window-scaling algorithm. It is relatively low cost and easy to implement. And within the limitation of clock frequency, it could support any mode of display resolution. Basic principle of the proposed algorithm is introduced at first and then scaling effect of different algorithms are compared and analyzed by software. After that, hardware implementation of the algorithm, as well as the general structure is presented in detail. FPGA verification has proved the feasibility and efficiency of the proposed algorithm.

关键词： Pixel Interpolation Signal processing algorithms Clocks Image resolution Algorithm design and analysis Timing

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Robust moving object segmentation in the compressed domain for H.264/AVC video stream

Robust moving object segmentation in the compressed domain f...

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25th PCS: Picture Coding Symposium 2006, PCS2006

作者： Yang, Gaobo Yu, Shengfa Zhang, Zhaoyang Network and Information Security Lab School of Computer and Communication Hunan University Changsha Hunan 410082 China School of Electronic Science and Engineering National University of Defense Technology Changsha Hunan 410073 China Key Laboratory of Advanced Displays and System Application Shanghai University Ministry of Education Shanghai 200072 China

ISBN: (纸本)300018726X

Moving object segmentation in the compressed domain plays an important role in many real-time applications, e.g. video indexing, video surveillance, etc. H.264/AVC is the up-to-date video coding standard, which employs several new coding tools and provides a different video format. In this paper, a robust spatio-temporal segmentation approach to extract moving objects in the compressed domain for H.264 video stream is proposed. Coarse moving objects are firstly extracted from the motion vector field through the MRF classification process. Spatial segmentation is based on the HT coefficient, which is used to refine the object boundary of temporal segmentation results. Fusion of spatio-temporal segmentation is based on region projection based labeling technique. Further edge refinement is performed to smooth the object boundaries. The performance of the proposed approach is illustrated by simulation carried on several test sequences. Experimental results show that the proposed approach can provide the visually similar results as by using spatial domain process with much less computational complexity.

关键词： Image segmentation

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Piezoresistive MXene/Silk fibroin nanocomposite hydrogel for accelerating bone regeneration by Re-establishing electrical microenvironment

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Bioactive Materials 2023年第4期22卷 1-17页

作者： Zhi-Chao Hu Jia-Qi Lu Tai-Wei Zhang Hai-Feng Liang Hao Yuan Di-Han Su Wang Ding Rui-Xian Lian Yu-Xiang Ge Bing Liang Jian Dong Xiao-Gang Zhou Li-Bo Jiang Department of Orthopaedic Surgery Zhongshan HospitalFudan UniversityShanghai200032China Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai UniversityShanghai200072China Department of Orthopedics Surgery Minhang HospitalFudan UniversityShanghai201100China Key Laboratory for Ultrafine Materials of Ministry of Education Frontiers Science Center for Materiobiology and Dynamic ChemistryResearch Center for Biomedical Materials of Ministry of EducationSchool of Materials Science and EngineeringEast China University of Science and TechnologyShanghai200237China Department of Orthopedic Surgery Zhongshan Hospital(Xiamen)Fudan UniversityXiamen361015China

The electrical microenvironment plays an important role in bone ***,the underlying mechanism by which electrical stimulation(ES)promotes bone regeneration remains unclear,limiting the design of bone microenvironment-specific electroactive ***,by simple co-incubation in aqueous suspensions at physiological temperatures,biocompatible regenerated silk fibroin(RSF)is found to assemble into nanofibrils with aβ-sheet structure on MXene nanosheets,which has been reported to inhibit the restacking and oxidation of *** electroactive hydrogel based on RSF and bioencapsulated MXene is thus prepared to promote efficient bone *** MXene/RSF hydrogel also acts as a piezoresistive pressure transducer,which can potentially be utilized to monitor the electrophysiological *** sequencing is performed to explore the underlying mechanisms,which can activate Ca^(2+)/CALM signaling in favor of the direct osteogenesis *** is found to facilitate indirect osteogenesis by promoting the polarization of M2 macrophages,as well as stimulating the neogenesis and migration of *** improvements in bone regeneration and angiogenesis are observed with MXene/RSF hydrogels under ES in ***,the MXene/RSF hydrogel provides a distinctive and promising strategy for promoting direct osteogenesis,regulating immune microenvironment and neovascularization under ES,leading to re-establish electrical microenvironment for bone regeneration.

关键词： Bone regeneration Electrical microenvironment Regenerated silk fibroin MXene Electrical stimulation

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New interconnection technology for flat panel display applications

New interconnection technology for flat panel display applic...

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作者： Yuan, Fang Zhang, Jianhua Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education No. 149 Yanchang Rd. Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai University No. 149 Yanchang Rd. Shanghai 200072 China

ISBN: (纸本)9787561752289

As electronic packaging technology trends in the small flat panel display move toward faster, more cost-effective, higher electrical performance and better reliability, flip chip technology gains popularity as one of the best chip packaging candidates. This technology has offered numerous advantages over conventional solder joining and the assembly uses polymer adhesives such as isotropic conductive adhesives (ICAs), anisotropic conductive films (ACFs) and nonconductive adhesives(NCAs). ICAs and AC As contain conductive particles and adhesive polymer resins and have been widely used for the flat panel display module. However, as the consumer electronics tends to become ligher, thinner, and also featured in high resolution and low power consumption to satisfy the increasing market requirements, it is propelling to improve the approaches to a flip chip adhesive process. The paper mainly presents the study of Non-conductive adhesives in flip chip for plat panel display. The NCAs technology is emerging as an attractive lead-free solder interconnects due to its environmental friendliness, lower processing temperatures, lower cost and extendability to fine pitch application. In fine pitch application below 30 μm, decreasing the pad pitch could increase the risk of short circuit to the ICA joints and lead to a reduction in current-carrying capacity of the AC A interconnetions. But the technology using NCAs in flip chip can solve the problems very well. This paper will review the latest research in NCA interconnection technology for flat panel display applications. Meanwhile, the new methods of NCA interconnection for very fine pitch LCD driver is also proposed and verified.

关键词： Cost effectiveness

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FEM Analysis of Moisture Distribution in Stacked Die Package

FEM Analysis of Moisture Distribution in Stacked Die Package

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第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

作者： Z K Hua J H Zhang C Y Li L Q Cao Y X Luo Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Intel Technology Development (Shanghai) Co. Ltd.

Stacked Die Packaging technology is the key technique to meet the requirements of higher density, smaller size of electronic products. Moisture has big influence on the reliability of packaging, in which the major failures are corrosion, delamination and crack. In stacked die packages,the main risks of the moisture also exist. The focus of this paper is to investigate the hygroscopic characteristc of stacked die using commercial FEA software. In this study,according to the JEDEC standard, the moisture diffusion characteristic under different conditions is *** show that the substrate and bottom adhesive absorb rapidly in moisture diffusion simulation. This reduces the mechanical properties of the stacked die and the result may give a proper answer to those failure observed in *** tests are needed in order to get a more precise investigation.

关键词： Moisture Electronics packaging Water pollution Water resources Finite element methods Lead Reliability engineering Corrosion Environmentally friendly manufacturing techniques Temperature

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A fluid dynamic analysis in the chamber and nozzle for a jetting dispenser design

A fluid dynamic analysis in the chamber and nozzle for a jet...

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Haili Jia Jinsong Zhang Jianhua Zhang School of Mechatronics Engineering and Automation Shanghai University Shanghai City Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai Univer

Electronic packaging industry widely uses a dispensing technology to deliver adhesive materials on substrates through a dispensing system. The cured adhesives can encapsulate and connect chips and substrates to provide mechanical, physical and chemical protections. For the high density packaging, a jet dispensing is regarded as the next generation adhesive delivery technology due to its features of non-contact, high precision and high efficiency. We developed a jet dispensing system including a jetting dispenser, a 3-axis movement platform, a substrate carrier, a power module, motion control hardware and software, supplementary modules, etc. The jetting dispenser is the most part since it affects the accuracy and quality during the dispensing process. Before its structure design and prototype manufacturing some important physical parameters can be determined by the fluid dynamics analysis. In the jetting dispenser, a piston drives a needle to move downwards and push the fluid flowing in the chamber and dispensing out of the nozzle. A simplified physical model has been set up to promote discussing the dynamic properties of the fluid. The results of dynamics analysis reveals that there are a back flow and a jetting flow existing in the chamber and an unsteady flow existing in the nozzle. The flow rate and volume are the most key parameters for the dispenser design. They are dependent on the nozzle length and diameter, the chamber length and diameter, the dynamic viscosity, the coefficient of the on-way resistance, the needle speed and the initial pressure on adhesive.

关键词： Needles Fluid dynamics Equations Mathematical model Substrates Force

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Simulation Study on the Size Effect and Transient Characteristics of Micro-LEDs

Simulation Study on the Size Effect and Transient Characteri...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Zhuang Wu Kailin Ren Yuan An Luqiao Yin Xiuzhen Lu Aiying Guo Jianhua Zhang School of Microelectronics Shanghai University Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai University Shanghai China

Micro-LED is a promising candidate of the next generation display technology. The size effect caused by sidewall surface traps is a serious issue that restricts its industrialization progress. However, the current research on the size effect of micro-LED is limited to the reduce of quantum efficiency and luminous intensity with decreased pixel size, but there is few research on the mechanism of the transient switching characteristics of Micro-LED affected by sidewall surface traps. In this paper, the size effect of GaN based micro-LEDs is studied by TCAD simulation. The decrease of quantum efficiency is attributed to the depletion effect of the sidewall traps induced by dry etching, the enhancement of SRH non-radiative recombination, and the lateral current component caused by sidewall traps capturing carriers. In addition, the sidewall trap density and trap energy level of micro-LEDs with 10 μm pixel size were varied to study their influence on the transient switching characteristics of micro-LEDs. This work provides a design guideline for the process control of micro-LEDs.

关键词： Photonic band gap Dry etching Process control Switches Radiative recombination Light emitting diodes Energy states

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Simulation of Bonding and Reliability for Micro-Led Array Based on Copper Pillar Bump

Simulation of Bonding and Reliability for Micro-Led Array Ba...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Hao Fu Zhu Yang Xinhui Meng Hong Fan Xiuzhen Lu Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

With the rapid development of automotive electronics and near-eye displays, more stringent requirements have appeared for the heterogeneous integration technology of Micro-LED. Copper pillar bumps, which offer enhanced electrical conductivity, thermal conductivity, and mechanical properties, can meet the demands for higher density and smaller size packaging in Micro-LED array applications. In Micro-LED system integration, bonding plays a critical role as the bonding conditions significantly influence the performance and reliability of Micro-LED. Consequently, it is essential to investigate the effects of bonding conditions on Micro-LED devices to ensure optimal performance and reliability of copper pillar bumps. A model with copper pillar bumps and Micro-LED chips was presented with a bonding simulation and parameter analysis performed in this paper. The finite element method was utilized to examine the thermal-mechanical coupling of one quarter of a $5 \times 5$ Micro-LED array model in this paper. The stress and deformation of the bumps during the bonding process and the effects of bonding conditions on the stress and deformation of the bumps was investigates.

关键词： Performance evaluation Deformation Conductivity Fatigue Bonding forces Thermal conductivity Copper Reliability Bonding Stress

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