Color holographic display is one of the most promising future display technologies. Introducing metasurfaces to holographic display brings more possibilities. Spatially multiplexing multicolor holography is a common w...
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High perfomance a-IGZO TFTs device is fabricated with inorganic / organic stacked layers as passivation layer (PL). The designed bilayer passivation layer structure exhibits extraordinary barrier characteristics to en...
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In order to provide silicon microdisplay drivers a wide tuning range clock and solve the problem that the tuning range of VCO is not wide enough, a wide tuning range multi-band feedforward differential delay cell base...
In order to provide silicon microdisplay drivers a wide tuning range clock and solve the problem that the tuning range of VCO is not wide enough, a wide tuning range multi-band feedforward differential delay cell based on CMOS inverter is proposed in this paper. The cell achieves the wide-tuned multi-band effect by adjusting the control voltage (VCTRL) and the control voltage sequence bits. In the HLMC 55LP process, the differential VCO can be adjusted from 3.92GHz to 8.63GHz to achieve a wide tuning range of multi-band output with a FOM of −157.02dBc/Hz.
Organic conjugated polymers have been widely used in the field of X-ray detectors because of their simple processing, mechanical flexibility and low cost. In this paper, we report a vertical structure X-ray detector u...
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A traditional bonding structure with indium bumps and a new bonding structure with passivation layer using Cu bumps were simulated to bond Micro-LED and substrate. Anand model and bilinear isotropic hardening model we...
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As a frontier research field of next-generation display technology, Micro-LED technology has the advantages of high brightness, high contrast and high energy efficiency. With the development trend of high-power, multi...
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In this study, red and green quantum dot color conversion layer was successfully fabricated using inkjet printing (IJP) technology on a blue micro-light-emitting diode (Micro-LED) backlight. To reduce the optical cros...
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With the rapid development of automotive electronics and near-eye displays, more stringent requirements have appeared for the heterogeneous integration technology of Micro-LED. Copper pillar bumps, which offer enhance...
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ISBN:
(数字)9798331541149
ISBN:
(纸本)9798331541156
With the rapid development of automotive electronics and near-eye displays, more stringent requirements have appeared for the heterogeneous integration technology of Micro-LED. Copper pillar bumps, which offer enhanced electrical conductivity, thermal conductivity, and mechanical properties, can meet the demands for higher density and smaller size packaging in Micro-LED array applications. In Micro-LED system integration, bonding plays a critical role as the bonding conditions significantly influence the performance and reliability of Micro-LED. Consequently, it is essential to investigate the effects of bonding conditions on Micro-LED devices to ensure optimal performance and reliability of copper pillar bumps. A model with copper pillar bumps and Micro-LED chips was presented with a bonding simulation and parameter analysis performed in this paper. The finite element method was utilized to examine the thermal-mechanical coupling of one quarter of a $5 \times 5$ Micro-LED array model in this paper. The stress and deformation of the bumps during the bonding process and the effects of bonding conditions on the stress and deformation of the bumps was investigates.
The problem of signal detection and classification of multiple UAVs can be solved using object detection techniques in computer vision. However, this requires collecting and labeling a large amount of reliable raw dat...
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This paper presents a oxide thin film transistors with high mobility by a new fabricate method. The high mobility TFT with ultra-high mobility of 55cm 2 /Vs has been obtained, and the PBTS and NBTS has also been optim...
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This paper presents a oxide thin film transistors with high mobility by a new fabricate method. The high mobility TFT with ultra-high mobility of 55cm 2 /Vs has been obtained, and the PBTS and NBTS has also been optimized.
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