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The 2014 International Conference on Materials Science and Engineering Technology(MSET 2014)

作者： Xiuzhen Lu Yanyan Chang Mingtao Xu Bo Peng Key Laboratory of Advanced Display and System Applications Ministry of Education andSMIT CenterSchool of Mechatronic Engineering and AutomationShanghai University

ISBN: (纸本)9783038351023

ZnO electrospun nanofibers were considered to be potential novel materials in applications of photovoltaic devices and sensorsAZO glass was usually used in those devices as transparent electrodesZnO nanofibers on AZO glass were synthesized by electrospinning and calcination processScanning electron microscopy(SEM), transmission electron microscopy(TEM), Raman spectroscopy and photoluminescence(PL) spectrum was employed to investigate the morphology, structure and optical performance of ZnO nanofibersNetwork structure composed of sheet ZnO was observedRaman spectra and PL spectrum indicated the existence of defect states in the ZnO nanofibers.

关键词： ZnO nanofibers electrospinning AZO glass

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Enhanced performance of ultraviolet organic light-emitting diode by using graphene oxide and MoO3 dual hole injection layer

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Physica Status Solidi (C) Current Topics in Solid State Physics 2017年第1-2期14卷 n/a-n/a页

作者： Liu, Liming You, Fengjiao Zheng, Qinghong Mo, Bingjie Zeng, Baoqing Wang, Honghang Zhang, Xiaowen Wei, Bin School of Physical Electronics University of Electronic Science and Technology of China Chengdu610054 China Guangxi Key Laboratory of Information Materials and School of Materials Science and Engineering Guilin University of Electronic Technology Guilin541004 China Zhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Zhongshan Institute Zhongshan528402 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China

A dual hole injection layer (d-HIL) composed of graphene oxide (GO) and transition metal oxide MoO3 is constructed and proven to be effectively promotes the radiance and external quantum efficiency (EQE) of ultraviolet organic light-emitting diode (UV OLED). The device with d-HIL behaves a maximum radiance of 4.7 mW/cm2 at 237.5 mA/cm2 and EQE of 1.36% at 3.75 mA/cm2, which have been enhanced by 27% and 19%, respectively, in comparison with the coun- terpart using conventional MoO3single HIL. The ultraviolet photoelectron spectroscopy elucidates that GO/MoO3 modification to the greatest extent enhances work function. The current-voltage characteristics and impedance spectroscopy of Hole-only devices clarify that GO/MoO3 d-HIL considerably promotes hole injection capacity. Our results indicate that the d-HIL of GO/MoO3 paves a way for constructing efficient UV OLED. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

关键词： Transition metals

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An analysis on damage of light-emitting diodes reliability induced by electronic static discharge

An analysis on damage of light-emitting diodes reliability i...

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International Conference on Electronic Packaging Technology

作者： Tingting Nan Piaopiao He Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai University Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education

ISBN: (纸本)9781509013975

The influence of different degrees of high reverse-bias stress on high power light-emitting diodes (LEDs) was investigated based on the aging of LED devices under the stress of 85℃/85% RH. GaN-based blue LEDs were respectively tested by negative Human-Body-Mode (HBM) electronic static discharge (ESD) at -1000 V, -2000 V, -3000 V, -4000 V and -5000 V. The electrical performances and optical performances of samples were measured before and after ESD test. The LEDs stressed at -1000 V, -2000 V and -3000 V showed a soft breakdown due to the generation of defect inside the chip and LEDs stressed at -4000V and -5000V showed a thermal breakdown. The thermal breakdown made temperature rise rapidly and formed a melting channel, which caused the damage of the LED. Though the electrical performances and optical performances of LEDs stressed at -1000 V, -2000 V and -3000 V did not show conspicuous degradation, the damage induced by ESD affect the reliability of LEDs.

关键词： LED ESD Aging Reliability

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High-order Finite-Volume Central Targeted ENO Family Scheme for Compressible Flows in Unstructured Meshes

arXiv

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arXiv 2023年

作者： Ma, Qihang Chong, Kai Leong Feng, Feng Zhang, Jianhua Wang, Bofu Zhou, Quan Shanghai Key Laboratory of Mechanics in Energy Engineering Shanghai Institute of Applied Mathematics and Mechanics School of Mechanics and Engineering Science Shanghai University Shanghai200072 China China Academy of Aerospace Science and Innovation Beijing100176 China Shanghai Institute of Aircraft Mechanics and Control Zhangwu Road Shanghai200092 China School of Microelectronics Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China Shanghai Frontier Science Center of Mechanoinformatics Shanghai University Shanghai200072 China

The high-order Target ENO (TENO) scheme, known for its innovative weighting strategy, has demonstrated strong potential for complex flow predictions. This study extends the TENO weighting approach to develop non-oscillatory central TENO (CTENO and CTENOZ) family schemes for unstructured meshes. The CTENO schemes employ compact directional stencils, which increase the likelihood of finding stencils within smooth regions. The design is intentionally compact to simplify the implementation of directional stencils. An effective scale separation strategy is adopted using an ENO-like stencil selection method, which employs large central stencils in smooth regions to achieve high-order accuracy, and smaller directional stencils near discontinuities to improve shock-capturing capabilities. Extensive tests involving CWENO, TENO, CTENO, and CTENOZ schemes were conducted to assess their performance in terms of accuracy, robustness, parallel scalability, and computational efficiency. The findings indicate that the proposed CTENO and CTENOZ schemes deliver high-order precision, lower numerical dissipation, and excellent shock-capturing performance. © 2023, CC BY.

关键词： Mesh generation

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RF performance of flip chip ACA joints for CPW transmission lines

RF performance of flip chip ACA joints for CPW transmission ...

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Electronics system-Integration Technology Conference, ESTC

作者： Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines are being used widely as its lower loss compared to conventional MS lines. In this paper, we studied RF performance of the ACA joints for CPW lines using the simulation software HFSS. Firstly, we investigated the high frequency performance by varying distance and number of ACA particles. It shows that the S11 parameter greatly deteriorated at the lower frequency band. To further study this phenomenon, we extracted the equivalent circuit. The extracted circuit value showed that when particle number increased, the electromagnetic interaction between each particles gradually dominant the overall performance. As a result, the mutual inductance increased the equivalent inductance, and the equivalent capacitances was also increased in the interconnect region. The particle distance was found to have little influence on the RF performance. Secondary, we studied the influences of resin compound (epoxy matrix) with different dielectric constant. Resin compound greatly influence the effective constant and impedance at the output port, thus induced impedance mismatch and slightly changed S11 response in the frequency range. Finally, we performed ANOVA analysis to evaluate the impact factors among ACA resin, joint height, signal to ground bump distance, conductor overlap and particle number. The dielectric constant of resin was found to be the most important factor in flip chip CPW-CPW ACA joints. Conductor overlap and ground to signal distance are still the two main factors. To optimize the performance, the dielectric constant of resin should be as lower as possible, and the conductor overlap length and ground to signal distance should be minimized. Moreover, particle number and bump height proved to have least effect. To achieve best performance, the particle numbe

关键词： Radio frequency Flip chip Coplanar waveguides Transmission lines Resins Dielectric constant Conductors Coplanar transmission lines Inductance Impedance

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A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin array simulation results. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array, that is, 2D fin array can reduce the thermal resistance of the cooler although 2D fin array causes more pressure drop in the architecture than 1D fin array.

关键词： Computational fluid dynamics Cooling Microchannel Carbon nanotubes Thermal conductivity Heat transfer Solid modeling Two dimensional displays Chemical technology Educational technology

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Comparison of smoothing methods for the analysis of transient thermal resistance

Comparison of smoothing methods for the analysis of transien...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yanan Liu Zhangfu Chen Jianhua Zhang Lianqiao Yang The School of Materials Science and Engineering Shanghai University Shanghai China Ministry of Education Key Laboratory of Advanced Display and System Applications (Shanghai University) The School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai China Shanghai University Shanghai P.R.China

ISBN: (纸本)9781509013975

In this paper, the analysis of transient thermal resistance is carried out on the basis of the regularization smoothing method and the Fourier series expansion method. These two methods are used to smooth cooling curve under the hypothetical model, and their result of smoothing and derivation are contrasted to the move average smoothing method under the actual model measured by T3ster. From theoretical model analysis and actual measured data analysis and application, it can be seen that the methods proposed have good effect on the analysis of transient thermal resistance.

关键词： Resistance Performance evaluation Heating

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A Study of Effects of Coolants on Heat Transfer Capability of On-chip Cooling with CNT Micro-fin Architectures by Using CFD Simulation

A Study of Effects of Coolants on Heat Transfer Capability o...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yi Fan Xiaolong Zhong Johan Liu Teng Wang Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.

关键词： Coolants Heat transfer Cooling Computational fluid dynamics Computational modeling Thermal conductivity Viscosity Computer architecture Conducting materials Heat sinks

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Transient Thermodynamic Simulation of Micro LED Array Bonding

Transient Thermodynamic Simulation of Micro LED Array Bondin...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jinwen Pan Haojie Zhou Xiaoxiao Ji Liang Chen Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

Micro LED display technology is considered to be the next generation of display technology and finds widespread applications in displays and visible light communication. key cooperation plays a crucial role in achieving electrical interconnections for Micro LED, which significantly impact their luminous quality and reliability. This study aims to analyze the stress-strain evolution during the bonding process of Micro LED arrays with cylindrical and spherical In bumps using COMSOL. The results demonstrate that the displacement of the bumps after bonding decreases by up to 97% compared to the displacement observed during the temperature-holding phase. Furthermore, the stresses during the temperature rise and fall stages approximately exhibit a linear relationship with temperature, and residual stresses exist after bonding. Additionally, residual stresses remain present after bonding. This study provides theoretical guidance for optimizing the bonding process of Micro LED and further exploration for the commercialization of Micro LED.

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Hybrid bonding thermodynamic simulation of 3×3 array of Micro-LED fabricated based on flip-chip bonding

Hybrid bonding thermodynamic simulation of 3×3 array of Mic...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jianxin Li Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

In this paper, ANSYS was used to perform a hybrid bonding thermodynamic simulation of Micro-LED fabricated based on flip-chip *** simulated the effects of different ILDs (interlayer dielectrics) and different diameters of In bumps on the mean stress of the bonding surface. The results show that filling BCB (Benzo cyclobutene)/PI (Polyimide)/SiO 2 can significantly reduce the mean stress on the In bumps bonding area, among which, filling BCB/PI is better than filling SiO 2 . And when the diameter of the In bumps is 5 μm, the mean stress on the In bumps bonding area is lowest. For the mean stress on the bonding area of the ILDs, filling BCB/PI is also much better than filling SiO 2 . Changing the diameter of the In bumps has little effect on the mean stress of the ILDs bonding area filled with BCB/PI. As for the bonding area of the ILDs filled with SiO 2 , the mean stress increases as the diameter of the In bumps increases. This paper uses simulation experiments to study the mean stress on different bonding areas during the hybrid bonding process of preparing Micro-LED, which provides a theoretical basis for improving the bonding strength and yield of Micro-LED, and provides ideas for realizing the industrialization of Micro- LED.

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