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Thermodynamic simulation of 6×6 Micro-LED array in flip-chip bonding

Thermodynamic simulation of 6×6 Micro-LED array in flip-chi...

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Mechatronics and Automation Shanghai University Shanghai China School of Microelectronics Shanghai University Shanghai China

In this paper, we first simulated the influence of different diameters, heights and shapes on the In bumps by ANSYS simulation software. The results show that the changes of these conditions affect the deformation and stress of the In bumps to varying degrees. The height of the bumps has the least effect on the stress, while the diameter and shape of the bumps have a great effect on the deformation as well as stress. Finally, a sapphire based Mirco-LED array with a pixel pitch size of 7.5 μm was used to bond with silicon substrates with In bumps of different heights, and turn it on with electricity. We found that the In bumps height does affect the yield of Micro-LED, and the best yield in the experiment is > 90%. This study provides a theoretical basis for reducing the deformation and stress of In bumps during flip-chip bonding, and an experimental basis for improving bond yield and device performance.

关键词： Thermodynamics Deformation Shape Simulation Software Silicon Flip-chip devices

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Compact Printed Monopole Antenna on Liquid Crystal Polymer (LCP) for EWB applications

Compact Printed Monopole Antenna on Liquid Crystal Polymer (...

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2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)

作者： Xiao-Rong Yan Shun-Shi Zhong Xia Zhang School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterShang

A compact tapered CPW-fed hollowed printed monopole antenna on the liquid crystal polymer (LCP) substrate with an extremely wide bandwidth (EWB) is introduced. The simulated results demonstrate that this antenna achieves an impedance bandwidth from 0.435GHz to 14.52GHz (33:1) for VSWR≤,and exhibits a nearly omnidirectional radiation pattern,while its area is only about 0.18λ1×0.13λ1,where λ1 is the wavelength of the lowest operating frequency.

关键词： Liquid crystal polymers Bandwidth Impedance Frequency Antenna radiation patterns Coplanar waveguides Packaging Computational modeling Broadband antennas Costs

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FEM simulation of bimodal and trimodal thermally conductive adhesives

FEM simulation of bimodal and trimodal thermally conductive ...

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IEEE Conference on Nanotechnology

作者： Nabi Nabiollahi Johan Liu Zhu Hilli Yan Zhang Yue Cong Zhaonian Cheng Masahiro Inoue Bio Nano science laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Ministry of Education and SMIT Center Shanghai University Shanghai China The Institute of Scientific and Industrial Research Osaka University Osaka Japan

ISBN: (纸本)9781424448326

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

关键词： Thermal conductivity Conductive adhesives Thermal resistance Mathematical model Analytical models Finite element methods Contact resistance MATLAB Electric resistance Conducting materials

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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Study on the adhesion strength of new nano-structured polyme...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Lei Zhang Xiuzhen Lu Xin Luo Björn Carlberg Masoud Zandira Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden

With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.

关键词： Materials Electronic packaging thermal management Thermal resistance Metals Heating Reliability Thermal conductivity

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Microstructures of ZnO electrospun nanofibers on AZO glass

Microstructures of ZnO electrospun nanofibers on AZO glass

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The 2014 International Conference on Materials Science and Engineering Technology(MSET 2014)

作者： Xiuzhen Lu Yanyan Chang Mingtao Xu Bo Peng Key Laboratory of Advanced Display and System Applications Ministry of Education andSMIT CenterSchool of Mechatronic Engineering and AutomationShanghai University

ISBN: (纸本)9783038351023

ZnO electrospun nanofibers were considered to be potential novel materials in applications of photovoltaic devices and sensorsAZO glass was usually used in those devices as transparent electrodesZnO nanofibers on AZO glass were synthesized by electrospinning and calcination processScanning electron microscopy(SEM), transmission electron microscopy(TEM), Raman spectroscopy and photoluminescence(PL) spectrum was employed to investigate the morphology, structure and optical performance of ZnO nanofibersNetwork structure composed of sheet ZnO was observedRaman spectra and PL spectrum indicated the existence of defect states in the ZnO nanofibers.

关键词： ZnO nanofibers electrospinning AZO glass

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Enhanced performance of ultraviolet organic light-emitting diode by using graphene oxide and MoO3 dual hole injection layer

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Physica Status Solidi (C) Current Topics in Solid State Physics 2017年第1-2期14卷 n/a-n/a页

作者： Liu, Liming You, Fengjiao Zheng, Qinghong Mo, Bingjie Zeng, Baoqing Wang, Honghang Zhang, Xiaowen Wei, Bin School of Physical Electronics University of Electronic Science and Technology of China Chengdu610054 China Guangxi Key Laboratory of Information Materials and School of Materials Science and Engineering Guilin University of Electronic Technology Guilin541004 China Zhongshan Branch of State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Zhongshan Institute Zhongshan528402 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China

A dual hole injection layer (d-HIL) composed of graphene oxide (GO) and transition metal oxide MoO3 is constructed and proven to be effectively promotes the radiance and external quantum efficiency (EQE) of ultraviolet organic light-emitting diode (UV OLED). The device with d-HIL behaves a maximum radiance of 4.7 mW/cm2 at 237.5 mA/cm2 and EQE of 1.36% at 3.75 mA/cm2, which have been enhanced by 27% and 19%, respectively, in comparison with the coun- terpart using conventional MoO3single HIL. The ultraviolet photoelectron spectroscopy elucidates that GO/MoO3 modification to the greatest extent enhances work function. The current-voltage characteristics and impedance spectroscopy of Hole-only devices clarify that GO/MoO3 d-HIL considerably promotes hole injection capacity. Our results indicate that the d-HIL of GO/MoO3 paves a way for constructing efficient UV OLED. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

关键词： Transition metals

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An analysis on damage of light-emitting diodes reliability induced by electronic static discharge

An analysis on damage of light-emitting diodes reliability i...

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International Conference on Electronic Packaging Technology

作者： Tingting Nan Piaopiao He Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai University Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education

ISBN: (纸本)9781509013975

The influence of different degrees of high reverse-bias stress on high power light-emitting diodes (LEDs) was investigated based on the aging of LED devices under the stress of 85℃/85% RH. GaN-based blue LEDs were respectively tested by negative Human-Body-Mode (HBM) electronic static discharge (ESD) at -1000 V, -2000 V, -3000 V, -4000 V and -5000 V. The electrical performances and optical performances of samples were measured before and after ESD test. The LEDs stressed at -1000 V, -2000 V and -3000 V showed a soft breakdown due to the generation of defect inside the chip and LEDs stressed at -4000V and -5000V showed a thermal breakdown. The thermal breakdown made temperature rise rapidly and formed a melting channel, which caused the damage of the LED. Though the electrical performances and optical performances of LEDs stressed at -1000 V, -2000 V and -3000 V did not show conspicuous degradation, the damage induced by ESD affect the reliability of LEDs.

关键词： LED ESD Aging Reliability

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High-order Finite-Volume Central Targeted ENO Family Scheme for Compressible Flows in Unstructured Meshes

arXiv

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arXiv 2023年

作者： Ma, Qihang Chong, Kai Leong Feng, Feng Zhang, Jianhua Wang, Bofu Zhou, Quan Shanghai Key Laboratory of Mechanics in Energy Engineering Shanghai Institute of Applied Mathematics and Mechanics School of Mechanics and Engineering Science Shanghai University Shanghai200072 China China Academy of Aerospace Science and Innovation Beijing100176 China Shanghai Institute of Aircraft Mechanics and Control Zhangwu Road Shanghai200092 China School of Microelectronics Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China Shanghai Frontier Science Center of Mechanoinformatics Shanghai University Shanghai200072 China

The high-order Target ENO (TENO) scheme, known for its innovative weighting strategy, has demonstrated strong potential for complex flow predictions. This study extends the TENO weighting approach to develop non-oscillatory central TENO (CTENO and CTENOZ) family schemes for unstructured meshes. The CTENO schemes employ compact directional stencils, which increase the likelihood of finding stencils within smooth regions. The design is intentionally compact to simplify the implementation of directional stencils. An effective scale separation strategy is adopted using an ENO-like stencil selection method, which employs large central stencils in smooth regions to achieve high-order accuracy, and smaller directional stencils near discontinuities to improve shock-capturing capabilities. Extensive tests involving CWENO, TENO, CTENO, and CTENOZ schemes were conducted to assess their performance in terms of accuracy, robustness, parallel scalability, and computational efficiency. The findings indicate that the proposed CTENO and CTENOZ schemes deliver high-order precision, lower numerical dissipation, and excellent shock-capturing performance. © 2023, CC BY.

关键词： Mesh generation

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RF performance of flip chip ACA joints for CPW transmission lines

RF performance of flip chip ACA joints for CPW transmission ...

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Electronics system-Integration Technology Conference, ESTC

作者： Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines are being used widely as its lower loss compared to conventional MS lines. In this paper, we studied RF performance of the ACA joints for CPW lines using the simulation software HFSS. Firstly, we investigated the high frequency performance by varying distance and number of ACA particles. It shows that the S11 parameter greatly deteriorated at the lower frequency band. To further study this phenomenon, we extracted the equivalent circuit. The extracted circuit value showed that when particle number increased, the electromagnetic interaction between each particles gradually dominant the overall performance. As a result, the mutual inductance increased the equivalent inductance, and the equivalent capacitances was also increased in the interconnect region. The particle distance was found to have little influence on the RF performance. Secondary, we studied the influences of resin compound (epoxy matrix) with different dielectric constant. Resin compound greatly influence the effective constant and impedance at the output port, thus induced impedance mismatch and slightly changed S11 response in the frequency range. Finally, we performed ANOVA analysis to evaluate the impact factors among ACA resin, joint height, signal to ground bump distance, conductor overlap and particle number. The dielectric constant of resin was found to be the most important factor in flip chip CPW-CPW ACA joints. Conductor overlap and ground to signal distance are still the two main factors. To optimize the performance, the dielectric constant of resin should be as lower as possible, and the conductor overlap length and ground to signal distance should be minimized. Moreover, particle number and bump height proved to have least effect. To achieve best performance, the particle numbe

关键词： Radio frequency Flip chip Coplanar waveguides Transmission lines Resins Dielectric constant Conductors Coplanar transmission lines Inductance Impedance

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A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin array simulation results. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array, that is, 2D fin array can reduce the thermal resistance of the cooler although 2D fin array causes more pressure drop in the architecture than 1D fin array.

关键词： Computational fluid dynamics Cooling Microchannel Carbon nanotubes Thermal conductivity Heat transfer Solid modeling Two dimensional displays Chemical technology Educational technology

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