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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Ragnar Larsson Jing-yu Fan Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging as interconnection materials, and many studies have been done about their electrical features, but limited works have been done on the mechanical properties with respect to the overall reliability of the packaging, and even less attention is paid to the micro-scale constituents of the internal structures in the ACA interconnection. This paper establishes a second order homogenization approach for predicting the mechanical performance of the typical internal structure in the ACA interconnection layer. This interface model is developed in the micropolar theory frame, and the macro- and micro-responses of each constituent are included. The considered structure under shear loading is simulated as application example of this model. The computational results show that the microscopic fluctuation field has a counteraction effect on the overall deformation, and the constituents with various material parameters have different responses to the prescribed loading. And the joint locations are of high possibility for crack/delamination initiation

关键词： Packaging Anisotropic magnetoresistance Conductive adhesives Conducting materials Mechanical factors Materials reliability Computational modeling Microscopy Fluctuations Delamination

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Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging

Homogenization model based on micropolar theory for the inte...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yan Zhang R. Larsson Jing-yu Fan Zhaonian Cheng Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

The increase in microsystem packaging density sets the requirement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaging system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the conventional method show its validity and efficiency

关键词： Microstructure Educational technology Integrated circuit interconnections Residual stresses Electronic packaging thermal management Thermal stresses Delamination Optical interferometry Capacitive sensors Kinematics

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Realization of Ultra Wideband Bandpass Filter based on LCP Substrate for Wireless application

Realization of Ultra Wideband Bandpass Filter based on LCP S...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xia Zhang Camilla Karnfelt Johan Liu Shiwei Ma Xu Wang Linqin Meng Herbert Zirath SMIT Center & Department of Microtechnology Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Department of Microtechnology and Nanoscience Chalmers University of Technology MC2 Microwave Electronics Laboratory Gothenburg Sweden School of Communication and Information Engineering Shanghai University China

Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF applications because of the unique combination of features and performance. Although LCP films offer many excellent properties, the poor adhesion between copper and LCP has prevented the use of these materials in flexible microwave circuits. In order to obtain better adhesion between LCP and copper, oxygen plasma pretreatment of the LCP substrate and a thin Ti adhesion layer are introduced before a Cu layer was sputtered on to the substrate. Finally, a novel and compact microstrip ultra wide band (UWB) band pass filter (BPF) is fabricated on LCP substrates using standard processing technology i.e. physical vapor deposition (PVD), lithography and wet etching, which provides LCP substrate the feasibility of the application in RF wireless systems.

关键词： Ultra wideband technology Band pass filters Adhesives Copper Crystalline materials Radio frequency Liquid crystal polymers Microwave circuits Flexible printed circuits Plasma applications

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Randomized consensus based distributed kalman filtering over wireless sensor networks

arXiv

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arXiv 2018年

作者： Qin, Jiahu Wang, Jie Shi, Ling Kang, Yu Department of Automation University of Science and Technology of China Hefei230027 China Department of Electronic and Computer Engineering Hong Kong University of Science and Technology Clear Water Bay Kowloon Hong Kong Department of Automation State Key Laboratory of Fire Science Institute of Advanced Technology University of Science and Technology of China Hefei230027 China Key Laboratory of Technology in Geo-Spatial Information Processing and Application System Chinese Academy of Sciences Beijing100190 China

This paper is concerned with developing a novel distributed Kalman filtering algorithm over wireless sensor networks based on randomized consensus strategy. Compared with centralized algorithm, distributed filtering techniques require less computation per sensor and lead to more robust estimation since they simply use the information from the neighboring nodes in the network. However, poor local sensor estimation caused by limited observability and network topology changes which interfere the global consensus are challenging issues. Motivated by this observation, we propose a novel randomized gossip based distributed Kalman filtering algorithm. Information exchange and computation in the proposed algorithm can be carried out in an arbitrarily connected network of nodes. In addition, the computational burden can be distributed for a sensor which communicates with a stochastically selected neighbor at each clock step under schemes of gossip algorithm. In this case, the error covariance matrix changes stochastically at every clock step, thus the convergence is considered in a probabilistic sense. We provide the mean square convergence analysis of the proposed algorithm. Under a sufficient condition, we show that the proposed algorithm is quite appealing as it achieves better mean square error performance theoretically than the noncooperative decentralized Kalman filtering algorithm. Besides, considering the limited computation, communication and energy resources in the wireless sensor networks, we propose an optimization problem which minimizes the average expected state estimation error based on the proposed algorithm. To solve the proposed problem efficiently, we transform it into a convex optimization problem. And a sub-optimal solution is attained. Examples and simulations are provided to illustrate the theoretical results. Copyright © 2018, The Authors. All rights reserved.

关键词： Kalman filters

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37-2:Invited Paper:Intermolecular Charge Transfer for High-Performance Organic Light-Emitting Diodes

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 312-312页

作者： Zhen Zhang Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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P-15.30: Thermally Activated Delayed Fluorescent Host for Highly Efficient Deep-Red OLEDs

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 1524-1524页

作者： Panpan Zang Youjun Wu Zhen Zhang Peng Wu Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders

Recent Progress in The Studies of Low Melting Sn-Based Pb-Fr...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Yang Lin Luqiao Yin Xicheng Wei Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Educati School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20 School of Mechatronics and Automation Shanghai University P.O.B.143 149 Yanchang Rd. Shanghai 20

Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

关键词： Nanoparticles Compounds Lead Packaging Gallium

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Enhanced Intra/Intermolecular Charge Transfer for Efficient Multilevel Resistive Memory

SSRN

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SSRN 2022年

作者： Dong, Qingchen Cheng, Xiaozhe Lian, Hong Yao, Lingling Xia, Weizhen Han, Jinba Wong, Wai-Yeung MOE Key Laboratory of Interface Science and Engineering in Advanced Materials Taiyuan University of Technology 79 Yingze West Street Taiyuan030024 China MOE Key Laboratory of Advanced Display and System Applications Shanghai University 149 Yanchang Road Jingan District Shanghai200072 China School of Mechanical & Electronic Engineering and Automation Shanghai University 99 Shangda Road Baoshan District Shanghai200444 China Hung Hom Hong Kong The Hong Kong Polytechnic University Shenzhen Research Institute Shenzhen518057 China

Adjustment of molecular structure can effectively improve the organic memory device behaviors due to the optimization of intra/intermolecular interaction and molecular packing motif. However, the intrinsic mechanism of how intermolecular interaction and molecular packing motif affect the device performance needs to be further explored. Herein, we synthesized four new small molecules (X-TEBT) by introducing the alkynyl π bridges and different substituents (X = H, CN, tBu, OMe) into the backbone of conjugated donor–acceptor molecules, namely, TEBT , CN-TEBT, tBu-TEBT and OMe-TEBT, for solution-processed organic resistive memory. All memory devices displayed nonvolatile write-once-read-many-times (WORM) behaviors with low threshold voltage ( V th ), high production yield, and good thermal stability. The champion device ( tBu-TEBT ) exhibits ternary WORM property with the highest ON2/ON1/OFF ratio and the lowest V th1 (1.6 V) and V th2 (2.4 V). More importantly, the single crystal structure of t Bu-TEBT was successfully obtained which helps us analyze the origin of the physical mechanism of resistive switching behavior and establish a common structure-property relationship for high performance organic memory. Its excellent properties enable us to perform logic gates and information display functions which offer possibilities as smart sensor in Internet of Things (IoT) application. © 2022, The Authors. All rights reserved.

关键词： Logic gates

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Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

Multi-chip integrated high-power white LED device on the mul...

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Electronic Components and Technology Conference (ECTC)

作者： Luqiao Yin Weiqiao Yang Yansheng Guo Kejun Ma Shuzhi Li Mingfa Chen Jia Li Jianhua Zhang School of Mechatronics and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai China Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Shanghai China Rainbow Optoelectronics Material Shanghai Company Limited Shanghai China Microelectronics Technology Institute of East China Shanghai University Shanghai China

In order to solve the thermal issue and improve the thermal resistance of LED, a device with multi-chip packaged on multi-layer composite ceramic substrate is successfully packaged. The top layer of the substrate is low temperature co-fire ceramic (LTCC), while the base layer is aluminum nitride (AINx) ceramic. 18 chips(one watt) are used in the device, and all of them are simultaneously packaged on a composite ceramic substrate which is 55 mm in length and 20 mm in width. The 18 chips are designed into two rows, and three chips in series for six parallels. At the same time the same chips are packaged on aluminum (Al) substrate and alumina (AlOx) substrate. After wire bonding photoelectric parameters of the three package modules are tested, the results show that the properties of the AINx-based package has the best performances, the thermal resistance of the device is far smaller than the other devices packed on the Al substrate and the AlOx substrate. After phosphor coatings the AINx-based multi-layer ceramic substrate package has 896.1 lm (43.4 lm/W) loading 350 milliampere (mA) to each chip, and has 1081.3 lm (35.4 lm/W) loading 500 mA. The multi-chip module has little light degradation adding 500 mA to each chip after working in the room temperature for one afternoon. At last the module is simulated by ANSYS software, the highest junction temperature of the chips in the module is about 70.8degC when 1.8 watts electric power is loaded to each chip, this temperature is far lower than 125degC which will damage the chip, and he highest simulation temperature of the aluminum heat slug is about 39.3degC. The temperature of the aluminum heat slug is about 41.0degC which is tested by thermocouple in the experiments, and it is closely to the simulation temperature 39.3degC. At last the relationship between pn-junction temperature and thermal conductivity coefficient of the silver (Ag) paste , the relationship between pn-junction temperatures and convection coefficient ha

关键词： Light emitting diodes Ceramics Temperature Packaging Thermal resistance Thermal conductivity Testing Aluminum nitride Wire Bonding

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Corrigendum to "Controlled-temperature photothermal and oxidative bacteria killing and acceleration of wound healing by polydopamine-assisted Au-hydroxyapatite nanorods"[Acta Biomaterialia 77 (2018) 352-364]

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Acta biomaterialia 2023年 168卷 674-675页

作者： Xiaomo Xu Xiangmei Liu Lei Tan Zhenduo Cui Xianjin Yang Shengli Zhu Zhaoyang Li Xubo Yuan Yufeng Zheng Kelvin Wai Kwok Yeung Paul K Chu Shuilin Wu Hubei Collaborative Innovation Center for Advanced Organic Chemical Materials Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials Hubei Key Laboratory of Polymer Materials School of Materials Science & Engineering Hubei University Wuhan 430062 China. School of Materials Science & Engineering Tianjin University Tianjin 300072 China. State Key Laboratory for Turbulence and Complex System and Department of Materials Science and Engineering College of Engineering Peking University Beijing 100871 China. Department of Orthopaedics & Traumatology Li Ka Shing Faculty of Medicine The University of Hong Kong Pokfulam Hong Kong China. Department of Physics & Department of Materials Science and Engineering City University of Hong Kong Tat Chee Avenue Kowloon Hong Kong China. Hubei Collaborative Innovation Center for Advanced Organic Chemical Materials Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials Hubei Key Laboratory of Polymer Materials School of Materials Science & Engineering Hubei University Wuhan 430062 China School of Materials Science & Engineering Tianjin University Tianjin 300072 China. Electronic address: shuilin.wu@***.

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