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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Mans Andreasson Johan Liu Thorvald Andersson Hsuan-Yi Liao Itsuo Watanabe Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Advanced Interconnect Material Division Hitachi Chemical Company Limited Chikusei Ibaraki Japan

Organic light emitting devices (OLEDs) is one of the most potentially interesting display technologies in the flat panel display (FPD) field. This paper investigates the effects of OLED structures and a perimeter encapsulation to protect the OLED from atmospheric exposure. Firstly, the electric features of the OLED devices with and without a copper phtalocyanine layer were measured, and the one with the additional buffer layer showed a lower turn-on voltage. Then the OLED device sample was encapsulated with a glass cover bonded to the substrate with an adhesive matrix containing micro-particles. The samples were stored in ambient conditions, and the IV characteristics were studied with shelf-time as a parameter. The measurement results indicated that the encapsulation had a significant improvement on the device operation. After two weeks of storage the encapsulated samples showed less degradation and the current density at a given operating bias was about fifty percent higher than without encapsulation.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays Protection Copper Atmospheric measurements Electric variables measurement Buffer layers

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A Low Delay AES Round Transform Architecture Using Constant Matrix Multiplications Merging Technologies

A Low Delay AES Round Transform Architecture Using Constant ...

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IEEE Conference on Industrial Electronics and applications (ICIEA)

作者： Xinxing Zheng Xiaoqiang Zhang Fan Yang Mingyu Xu Han Yan College of Information Engineering Wuhu Institute of Technology Wuhu China Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment Ministry of Education Wuhu China Engineering Research Center of Vehicle-Mounted Display Integration System Wuhu China College of Electrical Engineering Anhui Polytechnic University Wuhu China

ISBN: (纸本)9781665409858

This paper presents a low delay architecture design method for the hardware implementation of the advanced Encryption Standard (AES) algorithm. The proposed architecture is designed by using constant matrix multiplications (CMM) merging technologies. To reduce the area cost in hardware implementations, S-box/InvS-box is usually implemented with composite field arithmetic (CFA) technologies. In this paper, CMM in CFA-based S-box/InvS-box are further merged with constant coefficient multiplications in MixColumns/ InvMixColumns, which can also be expressed as CMM forms. By the merging, the delay of the hardware implementation of encryption round transform is reduced at the cost of slight area cost increasing, and both delay and area cost are reduced in hardware implementations of decryption round transform. Hardware complexities analysis indicates that our designs have less delay compared with previous works.

关键词： Industrial electronics Costs Design methodology Merging Transforms Hardware Delays

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New Permeation Rate Measurement for Thin Film Encapsulation of Organic Light Emitting Diodes

New Permeation Rate Measurement for Thin Film Encapsulation ...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Hao zhang Jianhua Zhang Bin Wei Minyan Zhang Li Long Renzheng Sang Tao Feng School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai Universi School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai 200072 The Linde Group Carl-von-Linde-Strasse 2585716 Unterchleissheim Germany

We have developed a new method to measure the water vapor transmission ratio (WVTR) for thin film encapsulation (TFE) of organic light emitting diodes (OLEDs). It is a nondestructive method to measure WVTR by investigating the change of photoluminescent spectra of organic material. This method can be realized easily by online test. By calibrating the evolution curve (the photoluminescent intensity versus time), we have figured out the relative water transmission which was responded by organic materials. The WVTR of TFE devices is estimated to be about 2.0×10-2gm-2day-1 in a controlled environment of 85% relative humidity (RH) at 38℃. Novel thin film encapsulation devices have also been presented.

关键词： Organic light emitting diodes Encapsulation Films Organic materials Chemical vapor deposition Substrates Equations

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Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Study on the Multi-Scale Properties of the Internal Structur...

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Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Ragnar Larsson Jing-yu Fan Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging as interconnection materials, and many studies have been done about their electrical features, but limited works have been done on the mechanical properties with respect to the overall reliability of the packaging, and even less attention is paid to the micro-scale constituents of the internal structures in the ACA interconnection. This paper establishes a second order homogenization approach for predicting the mechanical performance of the typical internal structure in the ACA interconnection layer. This interface model is developed in the micropolar theory frame, and the macro- and micro-responses of each constituent are included. The considered structure under shear loading is simulated as application example of this model. The computational results show that the microscopic fluctuation field has a counteraction effect on the overall deformation, and the constituents with various material parameters have different responses to the prescribed loading. And the joint locations are of high possibility for crack/delamination initiation

关键词： Packaging Anisotropic magnetoresistance Conductive adhesives Conducting materials Mechanical factors Materials reliability Computational modeling Microscopy Fluctuations Delamination

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On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling

On the heat transfer enhancement based on micro-scale air im...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Jing-yu Fan Yan Zhang J. Liu Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface

关键词： Heat sinks Heat transfer Microstructure Electronics cooling Thermal management of electronics Educational technology Thermal management Microchannel Mathematics Laboratories

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Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging

Homogenization model based on micropolar theory for the inte...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yan Zhang R. Larsson Jing-yu Fan Zhaonian Cheng Johan Liu Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

The increase in microsystem packaging density sets the requirement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaging system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the conventional method show its validity and efficiency

关键词： Microstructure Educational technology Integrated circuit interconnections Residual stresses Electronic packaging thermal management Thermal stresses Delamination Optical interferometry Capacitive sensors Kinematics

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Realization of Ultra Wideband Bandpass Filter based on LCP Substrate for Wireless application

Realization of Ultra Wideband Bandpass Filter based on LCP S...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xia Zhang Camilla Karnfelt Johan Liu Shiwei Ma Xu Wang Linqin Meng Herbert Zirath SMIT Center & Department of Microtechnology Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Department of Microtechnology and Nanoscience Chalmers University of Technology MC2 Microwave Electronics Laboratory Gothenburg Sweden School of Communication and Information Engineering Shanghai University China

Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF applications because of the unique combination of features and performance. Although LCP films offer many excellent properties, the poor adhesion between copper and LCP has prevented the use of these materials in flexible microwave circuits. In order to obtain better adhesion between LCP and copper, oxygen plasma pretreatment of the LCP substrate and a thin Ti adhesion layer are introduced before a Cu layer was sputtered on to the substrate. Finally, a novel and compact microstrip ultra wide band (UWB) band pass filter (BPF) is fabricated on LCP substrates using standard processing technology i.e. physical vapor deposition (PVD), lithography and wet etching, which provides LCP substrate the feasibility of the application in RF wireless systems.

关键词： Ultra wideband technology Band pass filters Adhesives Copper Crystalline materials Radio frequency Liquid crystal polymers Microwave circuits Flexible printed circuits Plasma applications

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Randomized consensus based distributed kalman filtering over wireless sensor networks

arXiv

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arXiv 2018年

作者： Qin, Jiahu Wang, Jie Shi, Ling Kang, Yu Department of Automation University of Science and Technology of China Hefei230027 China Department of Electronic and Computer Engineering Hong Kong University of Science and Technology Clear Water Bay Kowloon Hong Kong Department of Automation State Key Laboratory of Fire Science Institute of Advanced Technology University of Science and Technology of China Hefei230027 China Key Laboratory of Technology in Geo-Spatial Information Processing and Application System Chinese Academy of Sciences Beijing100190 China

This paper is concerned with developing a novel distributed Kalman filtering algorithm over wireless sensor networks based on randomized consensus strategy. Compared with centralized algorithm, distributed filtering techniques require less computation per sensor and lead to more robust estimation since they simply use the information from the neighboring nodes in the network. However, poor local sensor estimation caused by limited observability and network topology changes which interfere the global consensus are challenging issues. Motivated by this observation, we propose a novel randomized gossip based distributed Kalman filtering algorithm. Information exchange and computation in the proposed algorithm can be carried out in an arbitrarily connected network of nodes. In addition, the computational burden can be distributed for a sensor which communicates with a stochastically selected neighbor at each clock step under schemes of gossip algorithm. In this case, the error covariance matrix changes stochastically at every clock step, thus the convergence is considered in a probabilistic sense. We provide the mean square convergence analysis of the proposed algorithm. Under a sufficient condition, we show that the proposed algorithm is quite appealing as it achieves better mean square error performance theoretically than the noncooperative decentralized Kalman filtering algorithm. Besides, considering the limited computation, communication and energy resources in the wireless sensor networks, we propose an optimization problem which minimizes the average expected state estimation error based on the proposed algorithm. To solve the proposed problem efficiently, we transform it into a convex optimization problem. And a sub-optimal solution is attained. Examples and simulations are provided to illustrate the theoretical results. Copyright © 2018, The Authors. All rights reserved.

关键词： Kalman filters

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37-2:Invited Paper:Intermolecular Charge Transfer for High-Performance Organic Light-Emitting Diodes

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 312-312页

作者： Zhen Zhang Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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P-15.30: Thermally Activated Delayed Fluorescent Host for Highly Efficient Deep-Red OLEDs

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SID Symposium Digest of Technical Papers 2024年第S1期55卷 1524-1524页

作者： Panpan Zang Youjun Wu Zhen Zhang Peng Wu Zixing Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Yanchang 149 Shanghai China 200072

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