检索结果-内蒙古大学图书馆

Simulation Study on Electrothermal and Mechanical Coupling of Bumps in 5×5 Micro-LED Array

Simulation Study on Electrothermal and Mechanical Coupling o...

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Zhu Yang Hao Fu Kefeng Wang Xiaoxiao Ji Liang Chen Luqiao Yin Xiuzhen Lu Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

As a frontier research field of next-generation display technology, Micro-LED technology has the advantages of high brightness, high contrast and high energy efficiency. With the development trend of high-power, multi-array LEDs, the research on thermal stability of LEDs is gradually deepened. In order to explore the thermal stability of bumps during the working of Micro-LED, COMSOL Multiphysics simulation software and finite element method were used to analyze the electrothermal and mechanical coupling of bumps in 5×5 Micro-LED array in this paper. Flip-chip bonding was employed for interconnection of Micro-LED array and Si driver chip with the gap except Micro-LED devices between sapphire and silicon substrate filled with underfill to alleviate the stress concentration. The effects of different filling materials, applied current densities, and dimensions of In bumps (cylindrical) on thermal stress and displacement of the Micro-LED array were analyzed in detail. The results show the stress and displacement of the bumps with polyimide (PI) underfill were the smallest than that of bumps with benzocyclobutene (BCB) and epoxy resin (EP) underfill. Additionally, the temperature, thermal stress, and displacement of the bumps were also affected by the applied current density and the size of the bumps.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Mechanical Properties of Flip-Chip Bonding Structures for Micro-Led Devices: Cu-Cu Bonding with Passivation Layer and Indium Bumps Bonding

Mechanical Properties of Flip-Chip Bonding Structures for Mi...

引用

China Semiconductor Technology International Conference (CSTIC)

作者： Kefeng Wang Zehua Chen Xiaoxiao Ji Luqiao Yin Xiuzhen Lu Zhang Jianhua Zhang School of microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

A traditional bonding structure with indium bumps and a new bonding structure with passivation layer using Cu bumps were simulated to bond Micro-LED and substrate. Anand model and bilinear isotropic hardening model were used to characterize the viscoplastic behavior of In and the plastic behavior of composite structure simplified from the combination of Cu and Au, respectively. Mechanical properties of two kinds of micro-display devices with different bonding structures were analyzed by the ANSYS finite element method and the thermo-mechanical coupling field. The deformation and stress of the micro-display device using Cu-Cu bonding structure with passivation layer are reduced by 19.5% and 59.1% compared with the device bonded by In bumps.

关键词：

来源：评论

学校读者我要写书评

暂无评论

High-performance,large-area perovskite light-emitting diodes

High-performance,large-area perovskite light-emitting diodes

引用

第10届亚洲和澳大利亚真空与表面科学会议、中国真空学会2021学术年会、第十五届国际真空科学与工程应用学术会议

作者： Lin Wang Xuyong Yang Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University

Metal halide perovskites based light-emitting diodes (PeLEDs) have attracted extensive attention for lighting and display applications because of their excellent advantages,such as narrow emission bandwidth,color tuna... 详细信息

关键词： metal halide perovskite light-emitting diodes large-area

来源：评论

学校读者我要写书评

暂无评论

Thick films of polymer Direct-conversion X-ray detectors

Thick films of polymer Direct-conversion X-ray detectors

引用

Electronics Packaging Technology Conference (EPTC)

作者： Hu Chen Yi Li Zhao Hao Xingyang Wu Jianhua Zhang The Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai China Shanghai University Shanghai China

ISBN: (纸本)9781665416207

Organic conjugated polymers have been widely used in the field of X-ray detectors because of their simple processing, mechanical flexibility and low cost. In this paper, we report a vertical structure X-ray detector using PDMS material which is fabricated by simple process steps. The response of pure PDMS material to X-ray is verified, and the effects of different process conditions on the device performance were tested. The detector with film forming speed 2000 rpm and curing temperature 60°C still has high sensitivity $\left (434.5 \mu \mathrm{CGy}_{\text {air }}^{-1} \mathrm{~cm}^{-2}\right)$ to low dose rate $\left(23.9 \mu \mathrm{Gy}_{\text {air }}\text{S}^{-1}\right)$ when the applied bias voltage is 150 V. Finally, the device provides an idea for the development of low cost and high performance flexible direct X-ray detectors.

关键词： Performance evaluation Temperature sensors Micrometers X-ray detectors Sensitivity Costs Voltage

来源：评论

学校读者我要写书评

暂无评论

Long-Lived Thermally Activated Delayed Fluorescence and Room Temperature Phosphorescence for Optoelectronic Devices

SSRN

引用

SSRN 2025年

作者： Wang, Ping Wang, Hanyu Long, Chunye Guan, Yan Wang, Yang Wu, Chengheng Wang, Pu Wang, Fuzhi Xie, He-Lou Key Lab of Environment-friendly Chemistry and Application in Ministry of Education Key Laboratory of Polymeric Materials and Application Technology of Hunan Province Key Laboratory of Advanced Functional Polymer Materials of Colleges Universities of Hunan Province College of Chemistry Xiangtan University Hunan Province Xiangtan411105 China Beijing National Laboratory for Molecular Sciences Key Laboratory of Polymer Chemistry and Physics of Ministry of Education Center for Soft Matter Science and Engineering College of Chemistry and Molecular Engineering Peking University Beijing100871 China State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources School of New Energy North China Electric Power University Beijing102206 China

Organic thermally activated delayed fluorescence (TADF) and room temperature phosphorescence (RTP) materials have merited enormous application prospects in organic optoelectronics. In spite of this, long-lived TADF and RTP dual emissions based on single polymers still face great challenge. In this work, we develop a monomer (CzBT) with twisted electron donating carbazole and electron withdrawing benzothiadiazole (D-A) structure and then copolymerize it with N-isopropylacrylamide (NIPAM) to achieve TADF and RTP dual-emission polymers (NP1-50~NP1-1000). They not only exhibit high efficiency (20%) and long-lived (268 ms) TADF emission, but also present red RTP emission with lifetime reaching 240 ms. Theoretical calculations confirm that the introduction of twisted D-A structure and heteroatoms can not only provide appropriate ΔEST (0.21 eV) between the singlet and triplet states to promote long-lived TADF, but also enhance spin orbital coupling for RTP emission. High performance active optical waveguide with quite low optical loss coefficient of 0.097 dB/mm was obtained for NP1-50 fiber. When applied to solution-processable organic light emitting diodes (OLED) devices, it yields excellent current efficiency of 62.7 cd/A with small efficiency roll-off and maximum luminance of 90858 cd/m2. This class of polymers pave the road for high efficiency optoelectronic devices. © 2025, The Authors. All rights reserved.

关键词： Fluorescence

来源：评论

学校读者我要写书评

暂无评论

A Low Delay AES Round Transform Architecture Using Constant Matrix Multiplications Merging Technologies 17

A Low Delay AES Round Transform Architecture Using Constant ...

引用

17th IEEE Conference on Industrial Electronics and applications, ICIEA 2022

作者： Zheng, Xinxing Zhang, Xiaoqiang Yang, Fan Xu, Mingyu Yan, Han Wuhu Institute of Technology College of Information Engineering Wuhu China Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment Ministry of Education Wuhu China Engineering Research Center of Vehicle-Mounted Display Integration System Wuhu China Anhui Polytechnic University College of Electrical Engineering Wuhu China

ISBN: (纸本)9781665409841

This paper presents a low delay architecture design method for the hardware implementation of the advanced Encryption Standard (AES) algorithm. The proposed architecture is designed by using constant matrix multiplications (CMM) merging technologies. To reduce the area cost in hardware implementations, S-box/InvS-box is usually implemented with composite field arithmetic (CFA) technologies. In this paper, CMM in CFA-based S-box/InvS-box are further merged with constant coefficient multiplications in MixColumns/ InvMixColumns, which can also be expressed as CMM forms. By the merging, the delay of the hardware implementation of encryption round transform is reduced at the cost of slight area cost increasing, and both delay and area cost are reduced in hardware implementations of decryption round transform. Hardware complexities analysis indicates that our designs have less delay compared with previous works. © 2022 IEEE.

关键词： Cryptography

来源：评论

学校读者我要写书评

暂无评论

Synthesis and application of a novel 9,9-diethyl-1,2-diaryl-1,9-dihydrofluoreno[2,3-d]imidazole for blue organic light emitting diode

引用

Chinese Chemical Letters 2020年第1期31卷 64-66页

作者： Xueying Wang Zhangcheng Liao Tianqi Wang Haixia Lin Zixing Wang Yongmei Cui Department of Chemistry College of Sciences.Shanghai UniversityShanghai 200444China Key Laboratory of Advanced Display and System Applications Ministry of EducationShanghai UniversityShanghai 200072China

Two novel 2-(4-(9,9-disubstitued-9 H-fluoren-2-yl)phenyl)-9,9-diethyl-l-phenyl-1,9-dihydrofluoreno-[2,3-d]imidazole derivatives 2 a and 2 b were synthesized and *** photophysical and electrochemical properties,thermal stability property,and electroluminescence(EL)performance of 2 b were *** fabricated device based on 2 b doping into 4,4’-N,N’-dicarbazole-biphenyl(5%)as an emitter present a maximum brightness of 1272 cd/m^2 at 4 V with the CIE coordinate of(0.1590,0.0465).

关键词： Fluorene Imidazole Photoluminescence Electroluminescence

来源：评论

学校读者我要写书评

暂无评论

Double Hilbert transform based nonlinear harmonics correction for fringe projection profilometry

引用

Optik 2025年 327卷

作者： Wang, Beibei sun, Huanghe Huang, Chaoguang Huang, Wenbin Wang, Haijian Li, Wenjie Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology School of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin541004 China Engineering Research Center of Digital Imaging and Display Ministry of Education Soochow University Suzhou215006 China Guilin Kenvin Peter Technology Co. Ltd. Guilin541001 China

Fringe projection profilometry (FPP) has the advantages of large field of view, high precision and resolution, and is widely used in industrial inspection, medical treatment, aerospace and other fields. The nonlinear response between the camera and the projector in the system will affect the sinusoidal intensity of the captured fringe images, produce periodic phase errors, and affect the final reconstruction accuracy. Traditional double N-step phase shift (NPS) and Hilbert transform (HT) methods only correct the fundamental harmonic part of the phase nonlinear errors, and ignore the rest of the higher harmonic. Therefore, a double HTs based nonlinear phase error correction method is proposed, taking the higher order nonlinear harmonics into account. The artificial sinusoidal fringe images without background term are constructed using the wrapped phase calculated by captured fringe images. Then the HT is performed to convert the phase error to multiplication from addition, which can realize error balance in phase calculation. After obtaining the new phase, reoperation of artificial fringe generation and HT (AHT) is carried out to effectively remove the high order harmonic part of nonlinear harmonics. In proposed method, the wrapped phase calculated by captured fringe images is directly used to generate the artificial fringe images, which does not require additional projection patterns and realize real-time correction of phase nonlinear errors with high accuracy. Furthermore, direct artificial fringe generation also can efficiently avoids the effect of background intensity to the HT. Theoretical analysis, simulation analysis and experimental verification all prove the feasibility and superiority of the proposed method. © 2025 Elsevier GmbH

关键词： Harmonic analysis

来源：评论

学校读者我要写书评

暂无评论

Thermodynamic Analysis of Multi-Stage Thermal Compression Bonding for Fabricating Vertically Stacked Micro-Led Array

Thermodynamic Analysis of Multi-Stage Thermal Compression Bo...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Lianyu Wang Kailin Ren Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Vertical full-color Micro-LEDs based on flip-chip bonding technology are of great significance in high-resolution display applications, as they have many advantages such as high pixel density, high brightness, and wide color gamut. However, the construction of vertical full-color Micro-LEDs requires multiple thermal compression bonding (TCB). Therefore, thermal stress analysis during multiple TCB is necessary. In this work, the surface thermal stress of a 5×5 vertical Micro-LED array during multi-stage TCB is studied by finite element method (FEM) simulations. The stresses at LED-LED bonding interface and stacked LED-backplane bonding interface as well as the interactions between the two bondings are investigated. The results of different bonding temperatures, material combinations, and interconnected metal diameters and depths on the mean stresses at the bonding interface are analyzed, and then the adequacy of bonding and risk of debonding are assessed. The results show that among the hybrid bonding material combinations set in the simulation, the Cu/ Al 2 O 3 has the largest interfacial stress. In addition, decreasing the interconnected metal diameter and lowering the bonding temperature can relieve the interfacial stress, while the interconnected metal depth has no significant effect on the bonding stress. The key advantage of this work is that it can help establish design and process guidelines to shorten the development cycle of vertical full-color Micro-LEDs based on flip-chip bonding technology.

关键词： Thermodynamics Photonic band gap Metals Thermal analysis Finite element analysis Flip-chip devices Bonding Stress Thermal stresses Guidelines

来源：评论

学校读者我要写书评

暂无评论

Pluggable multitask diffractive neural networks based on cascaded metasurfaces

引用

Opto-Electronic Advances 2024年第2期7卷 23-31页

作者： Cong He Dan Zhao Fei Fan Hongqiang Zhou Xin Li Yao Li Junjie Li Fei Dong Yin-Xiao Miao Yongtian Wang Lingling Huang Beijing Engineering Research Center of Mixed Reality and Advanced Display Key Laboratory of Photoelectronic Imaging Technology and System of Ministry of Education of ChinaSchool of Optics and PhotonicsBeijing Institute of TechnologyBeijing 100081China Institute of Modern Optics Tianjin Key Laboratory of Optoelectronic Sensor and Sensing Network TechnologyNankai UniversityTianjin 300350China Department of Physics and Optoelectronics Faculty of ScienceBeijing University of TechnologyBeijing 100124China Beijing National Laboratory for Condensed Matter Physics Institute of PhysicsChinese Academy of SciencesBeijing 100191China Beijing Aerospace Institute for Metrology and Measurement Technology Beijing 100076China

Optical neural networks have significant advantages in terms of power consumption,parallelism,and high computing speed,which has intrigued extensive attention in both academic and engineering *** has been considered as one of the powerful tools in promoting the fields of imaging processing and object ***,the existing optical system architecture cannot be reconstructed to the realization of multi-functional artificial intelligence systems *** push the development of this issue,we propose the pluggable diffractive neural networks(P-DNN),a general paradigm resorting to the cascaded metasurfaces,which can be applied to recognize various tasks by switching internal *** the proof-of-principle,the recognition functions of six types of handwritten digits and six types of fashions are numerical simulated and experimental demonstrated at near-infrared ***,the proposed paradigm not only improves the flexibility of the optical neural networks but paves the new route for achieving high-speed,low-power and versatile artificial intelligence systems.

关键词： optical neural networks diffractive deep neural networks cascaded metasurfaces

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：