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Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes 21

Finite Element Simulation of Electrothermal and Mechanical C...

21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Yang, Zhu Li, Jianxin Fu, Hao Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobuteneBCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes. ©2024 IEEE.

关键词： Computer resource management

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Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection 21

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interco...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Meng, Xinhui Wang, Kefeng Fan, Hong Yang, Zhu Fu, Hao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED displays have garnered widespread attention due to their high resolution, high brightness, and long lifespan. However, the heterogeneous integration and the reliability of Micro-LEDs pose significant challenges for their commercialization. As Micro-LED products develop towards larger sizes and narrower pitches, the Au/In bonding process has become a prevalent strategy for achieving high-resolution interconnections. To address the issue of the life span being affected by the plastic deformation of indium bumps, which ultimately fail in the form of yielding, an Au/In-resin hybrid bonding technique to improve the reliability of high-resolution Micro-LEDs was proposed in this paper. The reliability of the flip-chip bonding structure of a 4×4 Micro-LED array was analyzed using ANSYS simulation software and finite element methods. The Anand unified viscoplastic constitutive model was employed for both indium bumps and the encapsulating resin. The model was subjected to temperature cycling loads ranging from -55℃ to 125℃ in accordance with the JEDEC temperature cycling standard. The Coffin-Manson fatigue life prediction model, which accounts for plastic strain in materials, was introduced to estimate the thermal cycling fatigue life of the Micro-LED interconnection structures. The equivalent plastic strain range of hybrid bonding device was 6.708×10-3, surpassing the 7.59×10-3observed in device with conventional bump bonding. The hybrid bonding device exhibited a thermal cycling life of 12747 cycles, which was about 36% longer than that of the bump bonding device. It suggests that resin helps to extend the thermal cycling life of the device and enhance its reliability. ©2024 IEEE.

关键词： Flip chip devices

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Global optimization of process parameters for low-temperature SiN_(x) based on orthogonal experiments

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Advances in Manufacturing 2023年第2期11卷 181-190页

作者： Lian-Qiao Yang Chi Zhang Wen-Lei Li Guo-He Liu Jia-Qi Wu-Ma Jin-Qiang Liu Jian-Hua Zhang School of Materials Science and Engineering Shanghai UniversityShanghai200444People's Republic of China Key Laboratory of Advanced Display and System Applications Ministry of EducationShanghai UniversityShanghai200072People's Republic of China Huawei Technologies Co. LtdShanghai200120People's Republic of China

Low-temperature silicon nitride(SiNx)films deposited by plasma-enhanced chemical vapor deposition(PECVD)have huge application potential in the flexible ***,the applicability of SiNx largely depends on the film’s general properties,including flexibility,deposition rate,residual stress,elastic modulus,fracture strain,dielectric constant,refraction index,*** optimization towards specific application by conventional experiment design needs lots of work due to the interaction of muti quality and process ***,an efficient global optimization approach for the process technology was proposed based on the Taguchi orthogonal experiment method considering muti-factor *** of all,the Taguchi orthogonal experiment design and analysis was used to rank the influences of main process parameters on the quality characteristics,including radio frequency(RF)power,pressure,silane flow rate,ammonia flow rate and nitrogen flow ***,the global optimization approach was carried out utilizing the multi-response optimizer considering the combination target of film formation rate,residual stress,dielectric constant,elastic modulus,fracture strain,refractive ***,the optimal solution of the SiNx film was finally obtained and verified.

关键词： Plasma-enhanced chemical vapor deposition(PECVD) Low-temperature silicon nitride(SiNx) Flexible display Taguchi orthogonal experiment Process optimization

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Highly Efficient Light-emitting Devices Based on Quantum dots/Perovskites

Highly Efficient Light-emitting Devices Based on Quantum dot...

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International Conference on display Technology, ICDT 2022

作者： Wang, Lin Kong, Lingmei Yang, Xuyong Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University 149 Yanchang Road 200072 China

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Color liquid crystal grating based color holographic 3D display system with large viewing angle

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Light(Science & applications) 2024年第1期13卷 103-112页

作者： Di Wang Yi-Long Li Fan Chu Nan-Nan Li Zhao-Song Li Sin-Doo Lee Zhong-Quan Nie Chao Liu Qiong-Hua Wang School of Instrumentation and Optoelectronic Engineering Beihang UniversityBeijing 100191China State Key Laboratory of Virtual Reality Technology and Systems Beihang UniversityBeijing 100191China Display Technology Research Center Seoul National UniversityGwanak-ro 1Gwanak-guSeoul 08826Republic of Korea Key Lab of Advanced Transducers and Intelligent Control System Ministry of EducationTaiyuan University of TechnologyTaiyuan 030024China

Holographic 3D display is highly desirable for numerous applications ranging from medical treatments to military ***,it is challenging to simultaneously achieve large viewing angle and high-fidelity color reconstruction due to the intractable constraints of existing ***,we conceptually propose and experimentally demonstrate a simple and feasible pathway of using a well-designed color liquid crystal grating to overcome the inevitable chromatic aberration and enlarge the holographic viewing angle,thus enabling large-viewing-angle and color holographic 3D *** use of color liquid crystal grating allows performing secondary diffraction modulation on red,green and blue reproduced images simultaneously and extending the viewing angle in the holographic 3D display *** principle,a chromatic aberration-free hologram generation mechanism in combination with the color liquid crystal grating is proposed to pave the way for on such a superior holographic 3D *** proposed system shows a color viewing angle of~50.12°,which is about 7 times that of the traditional system with a single spatial light *** work presents a paradigm for achieving desirable holographic 3D display,and is expected to provide a new way for the wide application of holographic display.

关键词： holographic angle crystal

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Optimizing bendability of flexible electronic devices using a neutral layer strategy

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Moore and More 2025年第1期2卷 1-18页

作者： Wu, Majiaqi Jian, Maoliang Zhang, Jianhua Yang, Lianqiao School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

The neutral layer (NL) strategy is a key technique for improving the bendability of flexible electronic devices. In this study, by considering a three-layer structure as an example, the results obtained by finite element analysis (FEA) showed that the NL gradually moved to the top surface of the film as the film thickness and Young’s modulus increased, which are similar to the results produced by theoretical calculations. Subsequently, we optimized the thickness of a single NL structure and the failure bending radius of an indium tin oxide (ITO) electrode was reduced by 50% after optimization. In order to address the problems that affect the design of a single NL, we used optical clear adhesive (OCA) to generate multiple NLs. The FEA method was again applied to the structure and the results showed that decreasing the elastic modulus of the OCA and film thickness could reduce the maximum strain in the film. Finally, the effects of the OCA parameters on the protection of a multiple-layer ITO electrode structure were verified in bending experiments, which showed that the strain on ITO could be reduced from 5.6% to almost 0 in the two-electrode structure. The proposed strategies for designing single and multiple NLs can provide some guidance to facilitate optimizing the electronic infrastructure of flexible devices.

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Analysis and Research Based on Electrohydrodynamic Inkjet Printing 21

Analysis and Research Based on Electrohydrodynamic Inkjet Pr...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Chen, Zhaoyu Wang, Xinyi Yin, Luqiao Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai200072 China School of Microelectronics Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University 201800 China

ISBN: (纸本)9798331541149

Electrohydrodynamic (EHD) inkjet printing has the advantages of high precision and high automation, and its forming mechanism is complex. In this paper, the stress of Taylor cone and its influencing factors were analyzed systematically, and explored the influence of different process parameters on the printing process and effect. The results showed that the larger the voltage, the larger the droplet;the longer the cycle and voltage duration, the larger the droplet;the droplet size was linear with voltage and period. The influence of the printing height on the droplet size was very obvious. Excessive voltage made the printing process very unstable and inaccurate, and the droplet size gap was large and the droplet printing position deviated. Hope to provide some ideas for related research. ©2024 IEEE.

关键词： Ink jet printing

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Thermally Activated Delayed Fluorescent Host for Highly Efficient and Stable Deep-Red OLEDs

Thermally Activated Delayed Fluorescent Host for Highly Effi...

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International Conference on display Technology, ICDT 2022

作者： Wang, Ke Xia, Rongrong Guo, Jianfeng Zhang, Zhen Wang, Zixing Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai 200072 China

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Dual-Molecule Hosts for Highly Efficient Green Phosphorescent Organic Light-Emitting Diodes with Low Efficiency Roll-Off

Dual-Molecule Hosts for Highly Efficient Green Phosphorescen...

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International Conference on display Technology, ICDT 2022

作者： Xia, Rongrong Wang, Ke Guo, Jianfeng Wang, Hengdan Zhang, Zhen Wang, Zixing Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai200072 China

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Piezoresistive MXene/Silk fibroin nanocomposite hydrogel for accelerating bone regeneration by Re-establishing electrical microenvironment

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Bioactive Materials 2023年第4期22卷 1-17页

作者： Zhi-Chao Hu Jia-Qi Lu Tai-Wei Zhang Hai-Feng Liang Hao Yuan Di-Han Su Wang Ding Rui-Xian Lian Yu-Xiang Ge Bing Liang Jian Dong Xiao-Gang Zhou Li-Bo Jiang Department of Orthopaedic Surgery Zhongshan HospitalFudan UniversityShanghai200032China Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai UniversityShanghai200072China Department of Orthopedics Surgery Minhang HospitalFudan UniversityShanghai201100China Key Laboratory for Ultrafine Materials of Ministry of Education Frontiers Science Center for Materiobiology and Dynamic ChemistryResearch Center for Biomedical Materials of Ministry of EducationSchool of Materials Science and EngineeringEast China University of Science and TechnologyShanghai200237China Department of Orthopedic Surgery Zhongshan Hospital(Xiamen)Fudan UniversityXiamen361015China

The electrical microenvironment plays an important role in bone ***,the underlying mechanism by which electrical stimulation(ES)promotes bone regeneration remains unclear,limiting the design of bone microenvironment-specific electroactive ***,by simple co-incubation in aqueous suspensions at physiological temperatures,biocompatible regenerated silk fibroin(RSF)is found to assemble into nanofibrils with aβ-sheet structure on MXene nanosheets,which has been reported to inhibit the restacking and oxidation of *** electroactive hydrogel based on RSF and bioencapsulated MXene is thus prepared to promote efficient bone *** MXene/RSF hydrogel also acts as a piezoresistive pressure transducer,which can potentially be utilized to monitor the electrophysiological *** sequencing is performed to explore the underlying mechanisms,which can activate Ca^(2+)/CALM signaling in favor of the direct osteogenesis *** is found to facilitate indirect osteogenesis by promoting the polarization of M2 macrophages,as well as stimulating the neogenesis and migration of *** improvements in bone regeneration and angiogenesis are observed with MXene/RSF hydrogels under ES in ***,the MXene/RSF hydrogel provides a distinctive and promising strategy for promoting direct osteogenesis,regulating immune microenvironment and neovascularization under ES,leading to re-establish electrical microenvironment for bone regeneration.

关键词： Bone regeneration Electrical microenvironment Regenerated silk fibroin MXene Electrical stimulation

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