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Characteristics of bottom gate a-Si TFT array for AM-OLEDs

Journal of Shanghai University(English Edition) 2011年第4期15卷 239-241页

作者：张浩陈龙龙石继锋李春亚路林李喜峰张建华 School of Mechatronics Engineering and Automation Shanghai University Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education

The authors have fabricated bottom gate amorphous silicon thin film transistor （a-Si TFT） array using five-step lithography process. The device shows a field effect mobility of 0.43 cm2/（V.s）, on/off ratio of 7.5×10^6 and threshold voltage of 0.87 V. The instability of a-Si TFT is ascribed to the defect state in the a-Si channel and SiNx/a-Si interface. The present a-Si TFT array with SiNs insulator could be a significant step towards the commercialization of active matrix organic lighting diode （AM-OLED） technology.

关键词： morphous silicon (aoSi) transistor array stability

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High-brightness organic light-emitting diodes

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Journal of Shanghai University(English Edition) 2011年第4期15卷 248-251页

作者：尚玉柱吕燕芳于建宁张民艳徐红魏斌 School of Materials Science and Engineering Shanghai University Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education

The research of high-brightness organic light-emitting diodes, as an important branch of organic light-emitting diodes （OLEDs）, makes it possible for achieving high-brightness lighting source and lasing. Heat dissipation and efficiency roll off, as two main factors, affect the brightness of the OLEDs heavily. In this paper, high-brightness OLEDs are obtained by utilizing pulse voltage, small areas and micro-cavity structure to minimize the effect of the two factors. The major advances, ongoing challenges and future perspectives of this research frontier are also critically discussed.

关键词： organic llght-emitting diodes (OLEDs) high brightness pulse voltage small areas micro-cavity structure

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Examining micro-cavity parameters of top emission organic light-emitting diode with low-order resonant modes

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Journal of Shanghai University(English Edition) 2011年第4期15卷 235-238页

作者：曹进王立张建华 Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education School of Materials Science and Engineering Shanghai University

Emission characteristics of top emitting organic light-emitting devices （TOLEDs） with Ag as reflective anode, Al/Ag as semitransparent cathode and 90 160 nm [N-（1-naphthyl）-N-phenyl-amino] biphenyl/tris-（8-hydroxy quinoline） aluminum （NPB/Alq3） sandwiched in the electrodes are examined. The electroluminescence （EL） spectra of the TOLEDs are simulated based on the Fabry-Perot cavity theory. And the resonant modes in cavity structure of TOLEDs is discussed and clarified which can accurately describe the work principle of the devices. A fairly good match between calculated values and experimental data is achieved at different emission colors from bluish green to orange.

关键词： top-emitting organic light-emitting devices (TOLEDs) micro-cavity resonant modes

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Effects of ultrasonic bonding parameters on reliability of flip chip GaN-based light emitting diode

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Journal of Shanghai University(English Edition) 2011年第4期15卷 262-266页

作者：杨连乔袁方张建华 Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education School of Mechatronics Engineering and Automation Shanghai University

This work applied the ultrasonic bonding to package flip chip GaN-based light emitting diodes （flip chip LEDs） on Si substrates. The effects of ultrasonic bonding parameters on the reliability of flip chip GaN-based LED were investigated. In the sequent aging tests, samples were driven with a constant current of 80 mA for hundreds hours at the room temperature. It was found that the electroluminescence （EL） intensity variation had a large correlation to the ultrasonic power, and then to the bonding temperature and force. A high bonding temperature and ultrasonic power and a proper bonding force improved the EL intensity significantly. It was contributed to a strong atom inter-diffusion forming a stable joint at the bonding interface, The temperature fluctuation in the aging test was the main factor to generate a high inner stress forming delamination at the interface between the chip and Au bump. As a result, delamination had retarded the photons to emit out of the LED packaging and decay its EL intensity.

关键词： light emitting diode (LED) flip chip LED electroluminescence (EL) intensity ultrasonic bonding delamination

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High efficient and high color rendering index white organic light-emitting diodes

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Journal of Shanghai University(English Edition) 2011年第4期15卷 252-255页

作者：张民艳尚玉柱徐红吕燕芳于建宁魏斌 School of Materials Science and Engineering Shanghai University Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education

We have fabricated high-efficient white organic light-emitting diodes （WOLEDs） using two types of electron transport materials with different electron mobility. The effect of the electron mobility on the device performance is discussed. In addition, to generate the desired white emission and high color rendering index, we perform the structure design of OLED, in which the functions of co-host of blue and green dopants on chromatic-stability are investigated. Experimental results find that the maximum color rendering index reaches as high as 91 at the voltage of 8 V.

关键词： white organic light emitting diodes (WOLEDs) charge balance energy transfer color rendering index

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A jetting system for chip on glass package

A jetting system for chip on glass package

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Haili, Jia Zikai, Hua Maoyu, Li Jinsong, Zhang Jianhua, Zhang School Engineering and Engineering and Automation Shanghai University Shanghai City 200072 China Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University Shanghai City 200072 China

ISBN: (纸本)9781424446599

Jetting is regarded as the next generation dispensing technology due to its features of non-contact and high precision dispensing. In this paper, we developed a jetting system for chip-on-glass package consisting of a jetting dispenser and a 3-axis movement system. The jetting dispenser applied a concept of modular design to construct four modules, which were nozzle, actuator, feeder and temperature controller. To analyze the factors influencing the fluid jetting, the proper fluid and structure models were set up. In the jetting dispenser, we used a solenoid valve (f >100Hz) to provide a high-speed movement for a needle. In a dispensing process, a piston drove a needle to move reciprocate, and its stroke was measured and controlled by a micrometer. A 3-axis system was a platform for the installation of jetting dispenser, and supported a reciprocating motion to follow the programmed route. ©2009 IEEE.

关键词： Needles

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Analysis of optical characteristics of transparent electrode ITO material in FPD routing process

Analysis of optical characteristics of transparent electrode...

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2012 International Applied Mechanics, MechatronicsAutomation and system Simulation Meeting, AMMASS 2012

作者： Chen, Longlong Li, Xifeng Shi, Jifeng Zhou, Chang Zhang, Jianhua Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University Shanghai 200072 China Shanghai Micro Electronics Equipment Co. LTD. Shanghai 201203 China

ITO transparent film was deposited on glass substrates by RF-magnetron sputtering equipment as electrode, routing material and the photolithography process was studied. The results shown that the ITO based transparent electrode routing needs larger dose energy than that Mo based substrate when the PR processes were all identical. The photo resist cannot be exposed thoroughly where the length/width ratio of gap between routing serried lines lager than 80 as the typical Mo based exposure process. The width of gap reached to 8.7um which was the limit of exposure machine of transparent film after the 2000um-length, 4um-width gap was exposed thoroughly. It should be attention of the routing gap design for electrical characters in transparent flat panel display. © (2012) Trans Tech Publications, Switzerland.

关键词： Flat panel displays

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Synthesis of ZnO nanorods based on electrospinning technology

Synthesis of ZnO nanorods based on electrospinning technolog...

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2020 International Conference on Environment Science and advanced Energy Technologies, ESAET 2020

作者： Lu, Xiuzhen Sun, Yongqian Jiang, Ziwei Zhang, Maomao Lin, Yang SMIT Center School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China

A new method for fabrication of ZnO nanorods was reported. ZnO nanorods were synthesized by electrospinning technology and heat treatment with polyvinyl alcohol (PVA) and Zinc acetate as precursor. After heat treatment of ZnO electrospun nanofibers, ZnO nanorods were obtained. Morphology of ZnO nanorods was characterized by Scanning electron microscopy (SEM). Various morphologies, such as sphere, flower and plane composed of ZnO nanorods were observed. Transmission electron microscopy (TEM) images demonstrated ZnO nanorods are a single crystalline structure with a diameter of 100-180 nm. The hexagonal wurtzite structure of ZnO nanorods was determined by X-ray diffraction (XRD) pattern and Raman spectra. © Published under licence by IOP Publishing Ltd.

关键词： Electrospinning

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Remote sensing image interpolation via the nonsubsampled contourlet transform

Remote sensing image interpolation via the nonsubsampled con...

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2nd International Conference on Image Analysis and Signal Processing, IASP'2010

作者： Xu, Tongyang Fang, Yong School of Comm. and Info. Eng. Key Lab of Specialty Fiber Optics and Optical Access Networks Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai China

ISBN: (纸本)9781424455553

A novel nonsubsampled contourlet Bi-linear interpolation algorithm for remote sensing image is proposed, which is based on the estimation of detail nonsubsampled contourlet coefficients at high resolution scales. The method employs Bi-linear interpolation algorithm to anticipate the high frequency component on high resolution from the high frequency component on low resolution. The experiment results demonstrate that the algorithm can get a higher PSNR and keep more image detail information than traditional interpolation algorithms. ©2010 IEEE.

关键词： Interpolation

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Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes 21

Finite Element Simulation of Electrothermal and Mechanical C...

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21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024

作者： Yang, Zhu Li, Jianxin Fu, Hao Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai2000072 China

ISBN: (纸本)9798331541149

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobuteneBCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes. ©2024 IEEE.

关键词： Computer resource management

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