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Research on panoramic illumination imaging system based on SURF algorithm 18

Research on panoramic illumination imaging system based on S...

18th China International Forum on Solid State Lighting and 7th International Forum on Wide Bandgap Semiconductors, SSLChina: IFWS 2021

作者： Wang, Fei Ji, Xiaoxiao Yin, Luqiao Guo, Aiying Zhang, Jianhua Shanghai University School of Microelectronics Shanghai201800 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China

ISBN: (纸本)9781665495462

Underwater lighting systems and imaging systems are mainly used in underwater pipeline internal inspection, underwater environment information collection, resource detection, etc. This article explores a panoramic lighting imaging system based on an underwater environment. Mainly from the intelligent lighting system, panoramic imaging system, and system integration optimization. The intelligent lighting system mainly explores a high-brightness intelligent lighting device with a high-brightness lighting system. The imaging system mainly works in conjunction with the lighting system. The imaging system mainly collects 250° panoramic picture information and 250° video information for scientific research and other tasks. Provide appropriate information and data. Finally, system integration optimization and joint work are carried out. © 2021 IEEE.

关键词： Imaging systems

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Simulation Study on Electrothermal and Mechanical Coupling of Bumps in 5×5 Micro-LED Array 20

Simulation Study on Electrothermal and Mechanical Coupling o...

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20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

作者： Yang, Zhu Fu, Hao Wang, Kefeng Ji, Xiaoxiao Chen, Liang Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai2000072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai2000072 China

ISBN: (纸本)9798350385373

As a frontier research field of next-generation display technology, Micro-LED technology has the advantages of high brightness, high contrast and high energy efficiency. With the development trend of high-power, multi-array LEDs, the research on thermal stability of LEDs is gradually deepened. In order to explore the thermal stability of bumps during the working of Micro-LED, COMSOL Multiphysics simulation software and finite element method were used to analyze the electrothermal and mechanical coupling of bumps in 5×5 Micro-LED array in this paper. Flip-chip bonding was employed for interconnection of Micro-LED array and Si driver chip with the gap except Micro-LED devices between sapphire and silicon substrate filled with underfill to alleviate the stress concentration. The effects of different filling materials, applied current densities, and dimensions of In bumps (cylindrical) on thermal stress and displacement of the Micro-LED array were analyzed in detail. The results show the stress and displacement of the bumps with polyimide (PI) underfill were the smallest than that of bumps with benzocyclobutene (BCB) and epoxy resin (EP) underfill. Additionally, the temperature, thermal stress, and displacement of the bumps were also affected by the applied current density and the size of the bumps. © 2023 IEEE.

关键词： Light emitting diodes

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Simulation study on thermal mechanical properties of 4×4 Micro-LED array in flip-chip bonding process 18

Simulation study on thermal mechanical properties of 4×4 Mi...

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18th China International Forum on Solid State Lighting and 7th International Forum on Wide Bandgap Semiconductors, SSLChina: IFWS 2021

作者： Ji, Xiaoxiao Wang, Fei Yin, Luqiao Zhang, Jianhua Shanghai University Ministry of Education Key Laboratory of Advanced Display and System Applications Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China School of Microelectronics Shanghai University Shanghai201800 China

ISBN: (纸本)9781665495462

With the advent of the Micro-light-emitting diodes, it has become the focus of display and visible light communication research. However, as the LED chip size shrinks, the difficulty of integration increase gradually. Nowadays, the integration of Micro- LEDs in display is still a challenge for commercialization. In this work, we conducted a comparative study by finite element method simulation to reveal the influencing factors of bonding yield. The results show that stress concentrates at the junction of the bumps and electrodes of Micro-LED chips, and the stress concentration at the corner of Micro-LED array is more seriously. By altering the parameters of bumps, such as shapes and materials to reduce the stress and stress concentration. Numerical simulate results provide theoretical basis for reducing stress and stress concentration and optimizing the bump shape. © 2021 IEEE.

关键词： Light emitting diodes

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Fabrication and Study of Micro-LED Quantum Dot Color Conversion Layer Based on Inkjet Printing 20

Fabrication and Study of Micro-LED Quantum Dot Color Convers...

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20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

作者： Wang, Xinyi Zhou, Haojie Ji, Xiaoxiao Yin, Luqiao Zhang, Jianhua School of Microelectronics Shanghai University Shanghai200444 China Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai200072 China School of Materials Science and Engineering Shanghai University Shanghai200072 China

ISBN: (纸本)9798350385373

In this study, red and green quantum dot color conversion layer was successfully fabricated using inkjet printing (IJP) technology on a blue micro-light-emitting diode (Micro-LED) backlight. To reduce the optical crosstalk between different sub-pixels, a black matrix (BM) layer with a thickness of 15 μm was proposed. Furthermore, to protect quantum dots (QDs), a SiO2 passivation layer with a thickness of 3 nm was uniformly deposited on the entire pattern by Atomic Layer Deposition (ALD). Subsequently, a pixel array featuring a sub-pixel size of 37.5 μm and a line width of 2 μm was fabricated on the BM layer treated with Reactive Ion Etching (RIE), and the thickness of the QDCC layer was controlled by RIE. The external quantum efficiencies of the red and green QDCC layer were 12.9% and 18.2%, respectively, and the emission spectra had blue light being transmitted, accompanied by a slight redshift. This research addresses the gaps in display applications and holds promise for the future advancement of Micro-LED display technology. © 2023 IEEE.

关键词： Atomic layer deposition

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Mechanical Properties of Flip-Chip Bonding Structures for Micro-Led Devices: Cu-Cu Bonding with Passivation Layer and Indium Bumps Bonding

Mechanical Properties of Flip-Chip Bonding Structures for Mi...

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2023 China Semiconductor Technology International Conference, CSTIC 2023

作者： Wang, Kefeng Chen, Zehua Ji, Xiaoxiao Yin, Luqiao Lu, Xiuzhen Zhang, Jianhua School of Microelectronics Shanghai University Shanghai201800 China Shanghai University Ministry of Education Key Laboratory of Advanced Display and System Applications Shanghai200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China

ISBN: (纸本)9798350311006

A traditional bonding structure with indium bumps and a new bonding structure with passivation layer using Cu bumps were simulated to bond Micro-LED and substrate. Anand model and bilinear isotropic hardening model were used to characterize the viscoplastic behavior of In and the plastic behavior of composite structure simplified from the combination of Cu and Au, respectively. Mechanical properties of two kinds of micro-display devices with different bonding structures were analyzed by the ANSYS finite element method and the thermo-mechanical coupling field. The deformation and stress of the micro-display device using Cu-Cu bonding structure with passivation layer are reduced by 19.5% and 59.1% compared with the device bonded by In bumps. © 2023 IEEE.

关键词： display devices

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Multi-Dimensional Linear Scanning Algorithm for Silicon-based Micro-OLED 17

Multi-Dimensional Linear Scanning Algorithm for Silicon-base...

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17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020

作者： Zhou, Houda Guo, Aiying Wang, Fei Zhang, Jianhua Shanghai University Ministry of Education Key Laboratory of Advanced Display and System Applications Shanghai200072 China School of Mechanical Engineering and Automation Shanghai University Shanghai200072 China School of Microelectronics Shanghai University Shanghai200072 China

ISBN: (数字)9780738111889

ISBN: (纸本)9780738111889

With the continuous development of display devices and technologies, as a new type of display device, silicon-based Micro-OLED has become a new type of display device in the fields of augmented reality, virtual reality, etc. due to its high brightness, self-luminous, low power consumption, and rich color display. In this paper, the research on the driving scanning algorithm of silicon-based Micro-OLED is carried out. Based on the linearity of the traditional PWM scanning algorithm, the sensitivity parameters of the human eye at different gray levels are added to the randomized gray mapping function. The optimization search is carried out by the combination of degree mapping, and finally a multiple linear scanning algorithm suitable for high refresh rate and high gray level is proposed. Through experiments, the multivariate linear scanning algorithm proposed in this paper has higher linearity than the optimal scanning algorithm, and the scanning efficiency reaches 100%. It has the advantages of reducing the driving frequency and increasing the display frame rate. © 2020 IEEE.

关键词： Augmented reality

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Unequal decoding power allocation for efficient video transmission

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Journal of Shanghai University(English Edition) 2010年第1期14卷 60-65页

作者：王永芳余松煜杨小康张兆杨 Key Laboratory of Advanced Display and System Application School of Communication and Information Engineering Shanghai University Institute of Image Communication and Information Processing Research Shanghai Jiao Tong University

We present an unequal decoding power allocation （UDPA） approach for minimization of the receiver power consumption subject to a given quality of service （QoS）, by exploiting data partitioning and turbo decoding. We assign unequal decoding power of forward error correction （FEC） to data partitions with different priority by jointly considering the source coding, channel coding and receiver power consumption. The proposed scheme is applied to H.264 video over additive white Gaussion noise （AWGN） channel, and achieves excellent tradeoff between video delivery quality and power consumption, and yields significant power saving compared with the conventional equal decoding power allocation （EDPA） approach in wireless video transmission.

关键词： power allocation turbo code data partition joint source and channel code

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High color rendering index white LEDs fabricated using InP/ZnS green-emitting quantum dots and InP/ZnSe/ZnS red-emitting quantum dots

High color rendering index white LEDs fabricated using InP/Z...

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16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (第十六届中国国际半导体照明论坛暨2019国际第三代半导体论坛)

作者： Doudou Zhang Yuxian Yan Fan Cao Gongli Lin Xuyong Yang Wanwan Li Luqiao Yin Jianhua Zhang School of Materials Science and Engineering Shanghai UniversityShanghai 200072China Key Laboratory Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education State Key Lab of Metal Matrix Composites School of Materials Science and EngineeringShanghai Jiao T Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education

ISBN: (数字)9781728157566

ISBN: (纸本)9781728157573

Quantum dots(QDs)have the advantages of spectrally adjustable,high quantum yield and narrow half-peak width,and are the most potential light-converting materials for white light that achieve high color rendering index and high *** InGaN blue light chip currently used excites Ce-doped yttrium aluminum garnet(YAG: Ce3+)yellow phosphor,and the white light-emitting diode(WLED)realized exhibits color rendering index(CRI)<80 and an unsatisfactory color coordinate because of lack of red spectral *** order to improve the CRI of white LEDs,in this paper,we fabricated InP/ZnS green-emitting QDs and InP/ZnSe/ZnS red-emitting QDs,and excited YAG: Ce3+yellow phosphor,InP/ZnS green-emitting QDs and InP/ZnSe/ZnS red-emitting QDs with blue chip,made WLED(Ⅰ),and compared with WLED(Ⅱ)generated by using blue LED chip to excite YAG: Ce3+yellow *** result shows that the WLED(Ⅰ)achieves a CRI of 90.3 at a driving current of 5 *** Commission International de L'Eclairage(CIE)chromaticity coordinates are(0.3393,0.3342),and the correlated color temperature(CCT)is 5186K,which is high quality white light close to sunlight.

关键词： Light emitting diodes II-VI semiconductor materials Zinc compounds Phosphors Color Indium phosphide III-V semiconductor materials

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The design of synchronous module in AM-OLED display controller

The design of synchronous module in AM-OLED display controll...

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2011 International Conference on Electric and Electronics, EEIC 2011

作者： Junwei-Ma Ran, Feng School of Mechatronical Engineering and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University China

ISBN: (纸本)9783642216961

On the basis of the analysis to the framework of AM-OLED display controllers, a key module - synchronous module is studied. In this paper, a FIFO circuit (first in first out) is designed using Gray convert technology and dual-port ram, which realizing scatheless transmit between different clock domain. The working principle of FIFO is analyzed, and the optimized FIFO circuit structure was put forward to improve the working stability of the FIFO. The synchronous module circuit was implemented by VerilogHDL language simulated through VCS (Verilog compiled simulator). The design had been applied successfully to a type of full colour TFT-OLED panel driver controller with gray levels 256, frame scanning frequency 60Hz ~ 100Hz. The testing results showed that this controller worked well with a stable and vivid display. © 2011 Springer-Verlag Berlin Heidelberg.

关键词： Controllers

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Flexible Active-matrix Micro-LED display Utilizing InSnO TFTs with High Mobility of 39.1 cm2V-1s-1 and Mass-production Compatible Process

Flexible Active-matrix Micro-LED Display Utilizing InSnO TFT...

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2024 IEEE International Electron Devices Meeting, IEDM 2024

作者： Yu, Zuoxu Sang, Yimeng Zhang, Yuzhen Zhang, Yiyang Shi, Runxiao Liu, Siyang Tao, Tao Li, Xifeng Peng, Cong Zhang, Rong Wu, Wangran Zhuang, Zhe Liu, Bin Sun, Weifeng School of Integrated Circuits National ASIC System Engineering Research Center Southeast University Nanjing China Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials School of Electronic Science and Engineering Nanjing University Nanjing China School of Integrated Circuits Nanjing University Suzhou China Key Laboratory of Advanced Display and System Applications of the Ministry of Education Shanghai University Shanghai China

ISBN: (纸本)9798350365429

The increasing pursuit of ultrahigh resolution displays has driven the demand for thin film transistors (TFTs) with higher mobility, especially on flexible substrates. In this work, we developed InSnO (ITO) TFTs on flexible substrates and achieved a remarkable average mobility of 39.1 cm2V-1s-1, via mass-production compatible processes utilizing SiO2 gate dielectric. Benefiting from the ultra-flat surface and extremely low coefficient of thermal expansion (CTE) of our PI substrate, the ITO TFTs exhibit excellent wafer-scale uniformity, reliable mechanical flexibility, and robust bending durability. Based on the ITO TFTs, we fabricated flexible 2T1C pixel circuits that can operate in both PAM and PWM schemes. The flip-chip micro-LEDs (μ-LEDs) were transferred to a flexible PI holder nondestructively with the assistance of UV tape and present superior robustness and endurance under cyclic bending. Moreover, we bonded μ-LEDs to the 2T1C pixel circuits and demonstrated a flexible active-matrix μ-LED display. The feasibility of flexible illumination and image control has been verified, providing great potential for high-resolution flexible displays in the future. © 2024 IEEE.

关键词： Thin film transistors

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