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Enhancing crystal integrity and structural rigidity of CsPbBr_(3) nanoplatelets to achieve a narrow colorsaturated blue emission

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Light(Science & applications) 2024年第5期13卷 985-997页

作者： Qianqian Huang Wenxu Yin Bo Gao Qingsen Zeng Dong Yao Hao Zhang Yinghe Zhao Weijia Zheng Jiaqi Zhang Xuyong Yang Xiaoyu Zhang Andrey L.Rogach Key Laboratory of Automobile Materials MOE School of Materials Science&Engineeringand Jilin Provincial International Cooperation Key Laboratory of High-Efficiency Clean Energy MaterialsJilin UniversityChangchunChina. State Key Laboratory of Supramolecular Structure and Materials College of ChemistryJilin UniversityChangchunChina. State Key Laboratory of Materials Processing and Die&Mould Technology School of Materials Science and EngineeringHuazhong University of Science and TechnologyWuhanHubeiChina. Department of Chemistry University of VictoriaVictoriaBCCanada. Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai UniversityShanghaiChina. Department of Materials Science and Engineering and Centre for Functional Photonics(CFP)City University of Hong KongHong Kong S.A.RChina

Quantum-confined CsPbBr_(3) perovskites are promising blue emitters for ultra-high-definition displays,but their soft lattice caused by highly ionic nature has a limited ***,we endow CsPbBr_(3) nanoplatelets(NPLs)with atomic crystal-like structural rigidity through proper surface engineering,by using strongly bound N-dodecylbenzene sulfonic acid(DBSA).A stable,rigid crystal structure,as well as uniform,orderly-arranged surface of these NPLs is achieved by optimizing intermediate reaction stage,by switching from molecular clusters to mono-octahedra,while interaction with DBSA resulted in formation of a Cs_(x)O monolayer shell capping the NPL *** a result,both structural and optical stability of the CsPbBr3 NPLs is enhanced by strong covalent bonding of DBSA,which inhibits undesired phase transitions and decomposition of the perovskite phase potentially caused by ligand ***,rather small amount of DBSA ligands at the NPL surface results in a short inter-NPL spacing in their closely-packed films,which facilitates efficient charge injection and *** photoluminescence of the produced CsPbBr_(3) NPLs is bright(nearly unity emission quantum yield)and peaks at 457 nm with an extremely narrow bandwidth of 3.7 nm at 80 K,while the bandwidth of the electroluminescence(peaked at 460 nm)also reaches a record-narrow value of 15 nm at room *** value corresponds to the CIE coordinates of(0.141,0.062),which meets Rec.2020 standards for ultra-high-definition displays.

关键词： temperature stability narrow

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Design and Fabrication of a Novel 3-Dimension Sensor and Its Application for Implant Mechanical Testing

Design and Fabrication of a Novel 3-Dimension Sensor and Its...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ke Xue Zikai Hua Jianhua Zhang Key Laboratory of Advanced Display and System Applications The School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai China

A new three dimensions force sensor for the multi-function artificial joints simulator is proposed and developed. In this study, the main design and fabrication process is introduced. The different design factors are compared and their influence is also discussed. Furthermore, the relative solutions to the problem are analyzed. By FEA analysis, the sensor is optimized, and the results show that the three dimensions force sensor performance is accurate and reliable. The 3-D sensor can meet the requirements of the friction measurement in the multi-function tribological simulator.

关键词： Fabrication Mechanical sensors Implants Testing Force sensors Capacitive sensors Hip Stress Friction Strain measurement

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Hardware /software co-design for Viterbi decoder

Hardware /software co-design for Viterbi decoder

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Ming Li Tao Wen Microelectronics Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China

Convolutional code and Viterbi decoding is one of the methods used for channel coding. Convolutional coding is widely used in many aspects because of its excellent performance. However, both the coding algorithm and hardware implementation are very complex. Along with the continuous deepening of SOC design, hardware-software co-design technology has become more and more important as one part of SOC design. A hardware-software platform used for the design of the Viterbi decoder is proposed in this paper. The platform includes embedded software, hardware acceleration, and peripheral interface. Good practicality and powerful verification functions are proved, and optimum design for the Viterbi decoder can be achieved by using the platform.

关键词： Hardware Software Viterbi algorithm Decoding Computer architecture Field programmable gate arrays system-on-a-chip

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Theoretical and experimental studies on microcavity organic light-emitting diodes with different emitters

Theoretical and experimental studies on microcavity organic ...

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16th Annual Conference and 5th International Conference on Chinese Society of Micro-Nano Technology, CSMNT 2014

作者： Peng, Cuiyun Wei, Mengjie Huang, Rongjuan Guo, Kunping Jing, Yuelin Xu, Tao Wei, Bin School of Mechanical Engineering and Automation Shanghai University 149 Yanchang Road Shanghai200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University 149 Yanchang Road Shanghai200072 China

ISBN: (纸本)9783038354628

We have theoretically and experimentally investigated the microcavity organic light-emitting diodes (MOLEDs) that enhanced the emission intensity and narrowed the spectra simultaneously. In this work, MOLEDs with the reflectivities of 70% and 90% have been successfully fabricated. Comparing to non-cavity OLEDs, the maximum forward electroluminescence intensity and the peak luminescence can be improved by 6.8 times and 2.2 times, respectively. The full width at half maximum could be sharply narrowed to 10 nm. The different configurations of MOLEDs with varied emitting layers have also been evaluated which fitted well with the experimental results. © (2015) Trans Tech Publications, Switzerland.

关键词： Reflection

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A Test Platform for Turbo Encoder & Decoder Based on S3C2410

A Test Platform for Turbo Encoder & Decoder Based on S3C2410

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ming Li Jing-sai Jiang Ming-ming Peng Fa-yu Wan Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China

Encoder & decoder are absolutely necessary and important in digital communications. This article introduces one kind of test system, which can estimate the performance of turbo encoder & decoder. It includes system composition principle, hardware and software architecture and test function. The practicability of the system is strong and its connection is convenient. After adjusting the test software, the system can also test other types of encoder & decoder.

关键词： Embedded system Operating systems Iterative decoding system testing Hardware Embedded software Microprocessors Energy consumption Application software Software testing

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Study on the Reliability of High-power LEDs under Temperature Cycle

Study on the Reliability of High-power LEDs under Temperatur...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Fan Huang Luqiao Yin Shuzhi Li Guangming Xu Huafeng Yan Yu Chen Jianhua Zhang Lianqiao Yang Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron Key Laboratory of Advanced Display and System Applications (Shanghai University Shanghai Research Center of Eengineering and Technology for Semiconductor Lighting Shanghai Yaming Lighting co. Ltd.Ministry of Education.P.O.B 143 149 Yanchang Rd. Shanghai Univer Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron

High-power LEDs have been widely used and have a big potential market due to the many advantages compared to conventional light sources. Reliability is one of the most important issues for the application of LEDs. In order to study the degradation mechanism and the stability of LED withstanding cyclical exposures to temperature variations, life test was carried out under temperature cycle testing. The experiment was designed basing on the EIAJ ED-4701/100. Four groups of 1 W high power LEDs adopting different material and structures were utilized. The temperature cycle accelerated life test under the condition of -25℃/125℃. After the accelerated test, the optical performance of the four kinds of devices were compared and analyzed, and the thermal performance of the LEDs was also tested, analyzed and discussed. At last, the reliability differences of high-power LEDs were analyzed and degradation mechanism of high power LEDs under temperature cycling was discussed.

关键词： Light emitting diodes Life estimation Reliability Thermal analysis Degradation Junctions Electronic packaging thermal management

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Totally Self Checking FSM Based on Convolutional Codes

Totally Self Checking FSM Based on Convolutional Codes

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ming Li Fa-Yu Wan Jin-Sai Jiang Ming-Ming Peng Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China

In this paper a new technique for designing totally self- checking finite state machines is presented using convolutional codes. In order to correct the fault, we propose a novel scheme which can not only detect, but also correct errors occurred in FSM transition. More specifically, we demonstrate the FSMs hardware which can be reused based on convolutional code partitioning and we formulate the optimization problem of maximizing hardware reusability. Synthesis results produced by our proposed procedure for the MCNC'89 FSM benchmark circuits show an average 20% reduction in literal counts compared to previous techniques. Moreover, we realize the IP core of the self-checking module by SMIC 0.25μm technology and also simulate its function in FPGA.

关键词： Convolutional codes Hardware Automata Circuit faults Electrical fault detection Fault detection Error correction Circuit synthesis Circuit simulation Field programmable gate arrays

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Low-voltage and high-stability p-type doped blue organic light-emitting diodes with bilayer hole injection layers

Low-voltage and high-stability p-type doped blue organic lig...

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2010 8th International Vacuum Electron Sources Conference and NANOcarbon(第八届真空电子源和纳米碳国际会议)

作者： F.F.Yu H.Zhang J.N.Yu L.Long L.Lu J.H.Zhang B.Wei Key Laboratory of Advanced Display and System Application Ministry of EducationShanghai University Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai Universit

@@In recent years, organic light-emitting diodes (OLEDs) for the application of flat panel displays (FPDs) have been attracting many researchers. Blue OLEDs are the potential light source to make full color FPDs by color conversion method. However, due to a large energy bandgap of blue emission materials, blue OLEDs were widely reported to have relatively low luminance efficiencies and high operation voltage, compared to the devices with low energy emission wavelength.

关键词： Indium tin oxide

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Effects of Die-attach Materials on the Optical Durability and Thermal Performances of HP-LED

Effects of Die-attach Materials on the Optical Durability an...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Luqiao Yin Lianqiao Yang Weiqiao Yang Guangming Xu Huafeng Yan Yu Chen Shuzhi Li Jianhua Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat Shanghai Yaming Lighting co. Ltd.P.O.B 143 149 Yanchang Rd. Shanghai University Shanghai 200072 Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Educat

Die interconnection layer is one of the main factors to improve the HP-LED thermal issue as it is the main thermal transfer media from the HP-LED chip to the substrate or heat sink. Silver epoxy is now widely used for LED interconnection, but it becomes more and more difficult for efficient heat dissipation as the HP-LED electric power density becomes higher and higher. Nowadays more and more attentions have been moved to metallic eutectic interconnection, especially for solder paste and AuSn20 eutectic interconnection which have big potential to be used for HP-LED. In order to further understand the thermal characteristics and reliability of HP-LED interconnected by different die-attach materials, the AuSn20 eutectic, solder paste and silver epoxy were applied to HP-LED respectively. The transient thermal resistance, steady state junction temperature and optical durability of the HP-LEDs are tested and studied. For HP-LED interconnected by AuSn20 eutectic, solder paste and silver epoxy, when applied 450 mA working current, the transient thermal resistance of die attach layer are 2.5 K/W, 3.2 K/W and 4 K/W respectively, and the junction temperature variation are 0.4%, 9.6% and 6.6% respectively after about 1180 hours 85 ℃/85 H aging. The results show the AuSn20 eutectic has better thermal performances and optical durability than the solder paste and silver epoxy.

关键词： Thermal resistance Microassembly Materials Silver Junctions Transient analysis

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Study on the application of thermal interface materials for integration of HP-LEDs

Study on the application of thermal interface materials for ...

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2010 IEEE CPMT Symposium Japan, ICSJ10

作者： Wu, Jun Zhuang, Meilin Li, Shuzhi Yang, Weiqiao Zhang, Jianhua School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China Shanghai Research Center of Solid-state Lighting Engineering and Technology Shanghai 201203 China

ISBN: (纸本)9781424475940

Contact thermal resistance existed in the contact face between light emitting diode(LED) substrate and heat sink, which could hinder thermal conducting from PN junction to heat sinks, when mounting high power LEDs(HP-LEDs) devices on the heat sinks. Thermal interface materials(TIMs) were filled in the contact face to reduce contact thermal resistance. This paper studied the application of TIMs used in cooling LEDs, and three types of TIMs were studied by thermal test and optical-electro test. The experiment results presented that when select TIMs for LED mounting, thermal conductivity, thickness, and the volume of fillers should be considered. ©2010 IEEE.

关键词： Junction temperature

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