检索结果-内蒙古大学图书馆

Failure Analysis of Glass Transition Temperature of LED Insulation Layer

Failure Analysis of Glass Transition Temperature of LED Insu...

16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (第十六届中国国际半导体照明论坛暨2019国际第三代半导体论坛)

作者： Yibin Wang Fang Fang Jing Wu Kaixuan Lin Tingting Xu Weiqing Liang Luqiao Yin School of Materials Science and Engineering Shanghai UniversityShanghai 200072China Key Laboratory Gold Medal Analytical & Testing Group Key Laboratory of Advanced Display and System Applications Shanghai UniversityMinistry of Education

ISBN: (数字)9781728157566

ISBN: (纸本)9781728157573

With the development of light-emitting diodes(LEDs)technology,the number of LEDs chips in high-power LEDs devices is increasing,and the use of LEDs continues to expand,the reliability has become the key to its widespread *** the LEDs device fails,the failure analysis of the device can effectively derive the mechanism and condition of the device failure,which has a significant effect on enhancing the reliability of the *** this paper,by analyzing the instantaneous voltage curve and thermal of the failed device,it can be concluded that when the operating current of the LEDs device is large,due to the poor thermal conductivity of the insulating layer,the insulating layer of the device is in the vitrification transition temperature for a long *** shape of the insulating layer is easily changed or even burned to cause delamination,resulting in LEDs failure.

关键词： Light emitting diodes Insulation Light sources Reliability Failure analysis Copper Aluminum

来源：评论

学校读者我要写书评

暂无评论

Analysis of diamond-like carbon film on enhancing thermal radiation of substrate of high-power LED

Analysis of diamond-like carbon film on enhancing thermal ra...

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Xingyang Wu Weilin Duan Siwei Wu Jianhua Zhang School of Mechatronics and Automation Shanghai University Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai University Shanghai China

ISBN: (数字)9781728150642

ISBN: (纸本)9781728150659

Miniaturization and high-power are the important development directions of electronic components today. The volume of Light emitting diode (LED) is getting smaller and smaller, but the power is increasing dramatically. If the heat accumulated in the device and let the junction temperature of the electronic components exceeds the critical value, the reliability and lifetime of the device will be reduced markedly. Diamond-Like Carbon (DLC) films have high hardness, high wear-resistance, high thermal conductivity, high insulation and so on, and have been widely used in mechanical, electronic, optical and medical fields. This study focused on the effect of radiation heat transfer in the heat dissipation of high-power LEDs, DLC films were deposited on the packaging substrates of LED lamps, and the thickness influence of DLC films on the heat radiation performance was investigated by Infrared thermal imager. The LED models were established by using Solid-Works drawing software, and the thermal simulation analysis of LED with different thickness of DLC films was carried out by ANSYS. The experimental results show that the surface temperature of the LEDs with 1.6, 2.4 and 3.2 thick DLC films on the aluminum substrate is 1.2, 1.5 and 2.3°C lower than that of the LED without DLC film, respectively. The simulation results are consistent with the experimental results, indicating that thicker DLC film has better effect on increasing the thermal radiation of the substrates.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Low Subthreshold Swing Enables High Synaptic Weight Gains based on Channel-Side Gate Dependent Electrolyte Transistors FET Design

Low Subthreshold Swing Enables High Synaptic Weight Gains ba...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Qiming Gong Fei Wang Hao Zheng Mengjiao Li School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai People's Republic of China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

With the development of IoT and AI technologies, brain-like synaptic devices with precise weight modulation of synaptic plasticity and controllable preparation are of great significance for developing neuromorphic computing and intelligent sensing technologies. In this paper, we design a series of side-gate electrolyte transistors with varying gate-channel distances and systematically examine the structural design effect on synaptic weight modulation. A synaptic transistor device with an ultra-low subthreshold swing of 89.8 mV/dec has been successfully achieved by optimizing the gate-channel design. Additionally, Further characterizations of the short-term synaptic plasticity and long-term synaptic plasticity of synaptic transistors uncover the flexible modulation of the gate-channel distance-dependent synaptic weight gain behaviors, which span from as low as 6.1 to as high as 87.5 under 50 successive stimuli. The results of this work provide a reliable solution for the design and preparation of high-performance synaptic devices and lay the foundation for high-precision neural networks and intelligent sensing technologies.

关键词： Photonic band gap Neuromorphic engineering Modulation Logic gates Electrolytes Reliability engineering Sensors Transistors Voltage control Integrated circuit reliability

来源：评论

学校读者我要写书评

暂无评论

Global motion estimation for moving object extraction in MPEG video streams

引用

Journal of Information and Computational Science 2009年第1期6卷 341-350页

作者： Yang, Gaobo Zhou, Qiya Zhang, Zhaoyang College of Computer and Communication Hunan University Changsha 410082 China Key Lab. of Advanced Display and System Applications Shanghai University Shanghai 200072 China

In this paper, a novel moving object extraction scheme for MPEG video stream is proposed. Firstly, the DC and AC [1], AC [8] coefficients are extracted directly from MPEG video stream to re-construct the DC + 2AC image, which is used to obtain the contour feature of I frame. Secondly, the sparse motion vector field of P frame is interpolated to make it dense and then projected to I frame iteratively. Moving object is extracted by the fusion of spatio-temporal segmentation. The innovation lies in the global motion estimation (GME) algorithm in compressed domain to compensate the global motion caused by camera. Thus, the proposed approach is feasible for almost any sequence including the static scene and the dynamic scene. Since only the background blocks are used to estimate the motion parameters, the computational complexity is greatly reduced. Experimental results demonstrate that the proposed approach can obtain satisfactory segmentation results and can be used in real-time system because it is mainly implemented in the compressed domain. © 2009 Binary Information Press.

关键词： Real time systems

来源：评论

学校读者我要写书评

暂无评论

Short Communication: Pt Thin Film Catalyst Preparation for Methanol Combustion at Room Temperature

引用

Combustion Science and Technology 2012年第12期184卷 2163页

作者： Wang, Xiaohong Zhang, Chun Hu, Zhiyu [a] Institute of Nano Micro Energy Shanghai University Shanghai China [b] Department of Chemistry Shanghai University Shanghai China [c] Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

A Pt thin film catalyst was prepared by a novel green method of micro drop dispersion-oxygen plasma etching (MD-OPE) method with Pt(acac)... as starting material and silicon wafer as substrate. The catalytic activity of the film catalyst was evaluated by methanol combustion at room temperature, and its surface properties were characterized by SEM and XPS techniques. The results indicated that Pt(acac)... can be decomposed and reduced to PtO and ... with small size by oxygen plasma, which is the reason for the improved catalytic activity of as-prepared Pt film compared with the Pt film catalysts prepared by the micro drop dispersion (MD) method. (ProQuest: ... denotes formulae/symbols omitted.)

关键词： Methanol combustion Oxygen plasma etching Pt film catalyst

来源：评论

学校读者我要写书评

暂无评论

Polymer nanofiber based continuous metal phase composite for thermal management applications

Polymer nanofiber based continuous metal phase composite for...

引用

3rd Electronics system Integration Technology Conference, ESTC 2010

作者： Carlberg, Björn Liu, Johan Ye, Li-Lei Chalmers University of Technology SE-412 96 Gothenburg Sweden Key Laboratory of Advanced Display and System Applications SMIT Center Shanghai University Box 282 No. 149 Van Chang Road 200072 Shanghai China SHT Smart High.-Tech. AB Fysikgränd 3 SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424485536

A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.

关键词： Temperature control

来源：评论

学校读者我要写书评

暂无评论

Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes

Finite Element Simulation of Electrothermal and Mechanical C...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Zhu Yang Jianxin Li Hao Fu Haojie Zhou Xiaoxiao Ji Luqiao Yin Xiuzhen Lu Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobutene-BCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes.

关键词： Couplings Analytical models Filling Software Finite element analysis Thermal analysis Reliability Bonding Stress Thermal stresses

来源：评论

学校读者我要写书评

暂无评论

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interco...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Xinhui Meng Kefeng Wang Hong Fan Zhu Yang Hao Fu Luqiao Yin Xiuzhen Lu Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Micro-LED displays have garnered widespread attention due to their high resolution, high brightness, and long lifespan. However, the heterogeneous integration and the reliability of Micro-LEDs pose significant challenges for their commercialization. As Micro-LED products develop towards larger sizes and narrower pitches, the Au/In bonding process has become a prevalent strategy for achieving high-resolution interconnections. To address the issue of the life span being affected by the plastic deformation of indium bumps, which ultimately fail in the form of yielding, an Au/In-resin hybrid bonding technique to improve the reliability of high-resolution Micro-LEDs was proposed in this paper. The reliability of the flip-chip bonding structure of a $4\times 4$ Micro-LED array was analyzed using ANSYS simulation software and finite element methods. The Anand unified viscoplastic constitutive model was employed for both indium bumps and the encapsulating resin. The model was subjected to temperature cycling loads ranging from $-55^{\circ}\mathrm{C}$ to $125^{\circ}\mathrm{C}$ in accordance with the JEDEC temperature cycling standard. The Coffin-Manson fatigue life prediction model, which accounts for plastic strain in materials, was introduced to estimate the thermal cycling fatigue life of the Micro-LED interconnection structures. The equivalent plastic strain range of hybrid bonding device was $6.708\times 10^{-3}$ , surpassing the $7.59\times 10^{-3}$ observed in device with conventional bump bonding. The hybrid bonding device exhibited a thermal cycling life of 12747 cycles, which was about 36% longer than that of the bump bonding device. It suggests that resin helps to extend the thermal cycling life of the device and enhance its reliability.

关键词： Temperature distribution Deformation Fatigue Software reliability Finite element analysis Resins Plastics Bonding Strain Load modeling

来源：评论

学校读者我要写书评

暂无评论

Channel Properties of indoor part for high-speed train based on wideband channel measurement

Channel Properties of indoor part for high-speed train based...

引用

International Conference on Communications and Networking in China (CHINACOM)

作者： Weihui Dong Guangyi Liu Li Yu Haiyu Ding Jianhua Zhang China Mobile Research Institute China Mobile Research Institute China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China Key Laboratory of Universal Wireless Communication Ministry of Education

In this paper, the statistical channel properties and channel modeling of indoor part for high-speed train communication system is presented based on wideband channel measurement at 2.35 GHz. Two configurations of base station (BS) antennas, the omni-directional ceiling antenna and the planar antenna on the wall, are used in the measurement, in order to compare different channel characteristics and facilitate the future wideband system deployment. Channel properties, such as Path Loss (PL), Delay Spread (DS) and Ricean K-factor, are analyzed and modeled. The empirical log-distance PL models are derived. It is found that PL with planar antenna at BS is 10 dB bigger than that with omni-directional antenna. The latter is even smaller than the PL of the free space. The distributions of DS under these two configurations are both well fitted with the lognormal distribution, and the mean values of them are similar. However, K-factors in decibel are quite different, although both follow well with the normal distribution. The mean values of K-factor with the omni-directional antenna and the planar antenna at BS are 10.41 dB and 4.09 dB, respectively.

关键词： Antenna measurements Antennas

来源：评论

学校读者我要写书评

暂无评论

Improved Properties of A-Igzo Tft with Inorganic/Organic Stacked Passivation Layer

SSRN

引用

SSRN 2022年

作者： Chen, Longlong Peng, Cong Xu, Meng Yang, Shibo Li, Xifeng Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China

High perfomance a-IGZO TFTs device is fabricated with inorganic / organic stacked layers as passivation layer (PL). The designed bilayer passivation layer structure exhibits extraordinary barrier characteristics to environment humidity. The off-state current of oxide TFTs is reduced for one order (at 10-13), and the negative bias illumination stress (NBIS) of device exhibits an excellent stability after one year of ambient storage which the ΔVth is lower than 0.1 V. The manufacture process of stacked layers is simple and low cost than traditional vacuum process which is promising substitute for SiO2-PL by PECVD. © 2022, The Authors. All rights reserved.

关键词： Passivation

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：