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Global motion estimation for moving object extraction in MPEG video streams

Journal of Information and Computational Science 2009年第1期6卷 341-350页

作者： Yang, Gaobo Zhou, Qiya Zhang, Zhaoyang College of Computer and Communication Hunan University Changsha 410082 China Key Lab. of Advanced Display and System Applications Shanghai University Shanghai 200072 China

In this paper, a novel moving object extraction scheme for MPEG video stream is proposed. Firstly, the DC and AC [1], AC [8] coefficients are extracted directly from MPEG video stream to re-construct the DC + 2AC image, which is used to obtain the contour feature of I frame. Secondly, the sparse motion vector field of P frame is interpolated to make it dense and then projected to I frame iteratively. Moving object is extracted by the fusion of spatio-temporal segmentation. The innovation lies in the global motion estimation (GME) algorithm in compressed domain to compensate the global motion caused by camera. Thus, the proposed approach is feasible for almost any sequence including the static scene and the dynamic scene. Since only the background blocks are used to estimate the motion parameters, the computational complexity is greatly reduced. Experimental results demonstrate that the proposed approach can obtain satisfactory segmentation results and can be used in real-time system because it is mainly implemented in the compressed domain. © 2009 Binary Information Press.

关键词： Real time systems

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Polymer nanofiber based continuous metal phase composite for thermal management applications

Polymer nanofiber based continuous metal phase composite for...

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3rd Electronics system Integration Technology Conference, ESTC 2010

作者： Carlberg, Björn Liu, Johan Ye, Li-Lei Chalmers University of Technology SE-412 96 Gothenburg Sweden Key Laboratory of Advanced Display and System Applications SMIT Center Shanghai University Box 282 No. 149 Van Chang Road 200072 Shanghai China SHT Smart High.-Tech. AB Fysikgränd 3 SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424485536

A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.

关键词： Temperature control

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Short Communication: Pt Thin Film Catalyst Preparation for Methanol Combustion at Room Temperature

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Combustion Science and Technology 2012年第12期184卷 2163页

作者： Wang, Xiaohong Zhang, Chun Hu, Zhiyu [a] Institute of Nano Micro Energy Shanghai University Shanghai China [b] Department of Chemistry Shanghai University Shanghai China [c] Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

A Pt thin film catalyst was prepared by a novel green method of micro drop dispersion-oxygen plasma etching (MD-OPE) method with Pt(acac)... as starting material and silicon wafer as substrate. The catalytic activity of the film catalyst was evaluated by methanol combustion at room temperature, and its surface properties were characterized by SEM and XPS techniques. The results indicated that Pt(acac)... can be decomposed and reduced to PtO and ... with small size by oxygen plasma, which is the reason for the improved catalytic activity of as-prepared Pt film compared with the Pt film catalysts prepared by the micro drop dispersion (MD) method. (ProQuest: ... denotes formulae/symbols omitted.)

关键词： Methanol combustion Oxygen plasma etching Pt film catalyst

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The Effect of Functionalized Silver on Properties of Conductive Adhesives

The Effect of Functionalized Silver on Properties of Conduct...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Dongsheng Li Qiong Fan Huiwang Cui Johan Liu Zhili Hu Zhichao Yuan Lilei Ye Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building S SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

关键词： Silver Conductivity Viscosity Conductive adhesives Curing Resins Dispersion

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Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection

Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interco...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Xinhui Meng Kefeng Wang Hong Fan Zhu Yang Hao Fu Luqiao Yin Xiuzhen Lu Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Micro-LED displays have garnered widespread attention due to their high resolution, high brightness, and long lifespan. However, the heterogeneous integration and the reliability of Micro-LEDs pose significant challenges for their commercialization. As Micro-LED products develop towards larger sizes and narrower pitches, the Au/In bonding process has become a prevalent strategy for achieving high-resolution interconnections. To address the issue of the life span being affected by the plastic deformation of indium bumps, which ultimately fail in the form of yielding, an Au/In-resin hybrid bonding technique to improve the reliability of high-resolution Micro-LEDs was proposed in this paper. The reliability of the flip-chip bonding structure of a $4\times 4$ Micro-LED array was analyzed using ANSYS simulation software and finite element methods. The Anand unified viscoplastic constitutive model was employed for both indium bumps and the encapsulating resin. The model was subjected to temperature cycling loads ranging from $-55^{\circ}\mathrm{C}$ to $125^{\circ}\mathrm{C}$ in accordance with the JEDEC temperature cycling standard. The Coffin-Manson fatigue life prediction model, which accounts for plastic strain in materials, was introduced to estimate the thermal cycling fatigue life of the Micro-LED interconnection structures. The equivalent plastic strain range of hybrid bonding device was $6.708\times 10^{-3}$ , surpassing the $7.59\times 10^{-3}$ observed in device with conventional bump bonding. The hybrid bonding device exhibited a thermal cycling life of 12747 cycles, which was about 36% longer than that of the bump bonding device. It suggests that resin helps to extend the thermal cycling life of the device and enhance its reliability.

关键词： Temperature distribution Deformation Fatigue Software reliability Finite element analysis Resins Plastics Bonding Strain Load modeling

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Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes

Finite Element Simulation of Electrothermal and Mechanical C...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Zhu Yang Jianxin Li Hao Fu Haojie Zhou Xiaoxiao Ji Luqiao Yin Xiuzhen Lu Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Micro-LED has attracted more attention due to its unique photoelectric properties, such as high brightness, high energy efficiency, high stability and other characteristics, which facilitate its widespread application. Bumps can be used for electrical connections and heat transfer paths as well as structural supports that affect the reliability of Micro-LED devices. Hybrid bonding enhances the reliability and longevity of electronic devices while also ensuring the compatibility of bonding process. Currently, there is limited finite element simulation research on Micro-LEDs, particularly regarding electrothermal and mechanical multi-physical field simulations. Herein, the electrothermal and mechanical coupling of a quarter of a 6×6 Micro-LED array model was analyzed using COMSOL Multiphysics simulation software and the finite element method. The analysis primarily focused on the stress and displacement of bumps in the hybrid bonding model. The optimal combinations of different bump materials (indium-In, tin-Sn) and filling materials (epoxy resin-EP and benzocyclobutene-BCB) were obtained. The results indicate that BCB is a more suitable filling material, while In is preferable as a bump material. Furthermore, variations in thermal stress and displacement of cylindrical and circular-truncated cone bumps of different aspect ratios were analyzed. This paper provides an idea for optimizing the fabrication of Micro-LED bumps and bonding processes.

关键词： Couplings Analytical models Filling Software Finite element analysis Thermal analysis Reliability Bonding Stress Thermal stresses

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Second order multi-scale micropolar model for microsystem interconnections

Second order multi-scale micropolar model for microsystem in...

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第五届国际非线性力学会议

作者： Johan Liu Ragnar Larsson Key Laboratory of Advanced Display and System Applications Shanghai University SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Department of Applied Mechanics Chalmers University of Technology

Anisotropic conductive adhesives(ACAs)are widely used in microsystem packaging due to their superior *** ACA joints are usually much smaller in scale than the neighboring adherends,and there are even finer internal structures included in the thin interconnection *** great difference in scale among these constituents is a high challenge to both experimental technology and conventional numerical methods.A second order model based on micropolar theory is developed to take the mechanical responses of a typical internal structure in the ACA flip chip interconnection into *** addition,by considering the typical structure under unit deformation,this model could also provide the supplementary information with regard to the stiffness coefficients for a previously developed homogenization interface *** the simulation result obtained from the combination of two interface models agrees well with experimental observation.

关键词： ACA Second order multi-scale micropolar model for microsystem interconnections

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Channel Properties of indoor part for high-speed train based on wideband channel measurement

Channel Properties of indoor part for high-speed train based...

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International Conference on Communications and Networking in China (CHINACOM)

作者： Weihui Dong Guangyi Liu Li Yu Haiyu Ding Jianhua Zhang China Mobile Research Institute China Mobile Research Institute China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China Key Laboratory of Universal Wireless Communication Ministry of Education

In this paper, the statistical channel properties and channel modeling of indoor part for high-speed train communication system is presented based on wideband channel measurement at 2.35 GHz. Two configurations of base station (BS) antennas, the omni-directional ceiling antenna and the planar antenna on the wall, are used in the measurement, in order to compare different channel characteristics and facilitate the future wideband system deployment. Channel properties, such as Path Loss (PL), Delay Spread (DS) and Ricean K-factor, are analyzed and modeled. The empirical log-distance PL models are derived. It is found that PL with planar antenna at BS is 10 dB bigger than that with omni-directional antenna. The latter is even smaller than the PL of the free space. The distributions of DS under these two configurations are both well fitted with the lognormal distribution, and the mean values of them are similar. However, K-factors in decibel are quite different, although both follow well with the normal distribution. The mean values of K-factor with the omni-directional antenna and the planar antenna at BS are 10.41 dB and 4.09 dB, respectively.

关键词： Antenna measurements Antennas

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Improved Properties of A-Igzo Tft with Inorganic/Organic Stacked Passivation Layer

SSRN

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SSRN 2022年

作者： Chen, Longlong Peng, Cong Xu, Meng Yang, Shibo Li, Xifeng Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai200072 China

High perfomance a-IGZO TFTs device is fabricated with inorganic / organic stacked layers as passivation layer (PL). The designed bilayer passivation layer structure exhibits extraordinary barrier characteristics to environment humidity. The off-state current of oxide TFTs is reduced for one order (at 10-13), and the negative bias illumination stress (NBIS) of device exhibits an excellent stability after one year of ambient storage which the ΔVth is lower than 0.1 V. The manufacture process of stacked layers is simple and low cost than traditional vacuum process which is promising substitute for SiO2-PL by PECVD. © 2022, The Authors. All rights reserved.

关键词： Passivation

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Overview of Carbon Nanotubes as off-chip interconnects

Overview of Carbon Nanotubes as off-chip interconnects

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Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Teng Wang Johan Liu Cristina Andersson Department of Microtechnology and Nanoscience Chalmers University of Technology Göteborg Sweden Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai P.R.China

Carbon nanotubes (CNTs) have drawn a lot of attention due to a combination of extraordinary properties and a wide range of potential applications. Due to the large potentials in satisfying future large scale integrated circuit requirements, much effort has been focused on the study of CNTs as on-chip interconnects. Combined with other conventional materials, CNTs are also promising alternatives for off-chip interconnect applications. The area of CNTs as off-chip interconnects has, currently, attracted a large research interest from both academia and industry. This paper presents an overview of the research work performed on CNTs based electronics. This review also covers the recent work performed on the development of CNTs as off-chip interconnects including both the advances in aligned CNTs bundles synthesis as well CNTs transfer technology. In addition, some challenges facing CNTs implementation in electronic industry are also addressed. The present overview is limited to the fundamental characteristics of CNTs as off-chip interconnects.

关键词： Carbon nanotubes Integrated circuit interconnections Thermal conductivity Conducting materials Thermal management Thermal factors Large scale integration Bonding Electrons Mechanical factors

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