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Simulations for A Novel Fluid Dispensing Technology Based on Gas-liquid Slug Flow

Simulations for A Novel Fluid Dispensing Technology Based on...

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Peng Peng Jianhua Zhang Jinsong Zhang Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University China School of Mechatronics Engineering and Automation Shanghai University China Yanchang Road 149 Shanghai City China

The fluid dispensing is one of the key technologies in electronic packing. A novel approach of non-contact fluid dispensing has been proposed based on the principle of gasliquid two-phase flow. In view of gas-liquid two-phase dynamics, the flow pattern of slug flow can be obtained stably in the microchannel as the flow rate ratio between the gas and liquid is in an appropriate range. The slug flow can generate fluid droplets and gas bubbles and spray them out of the nozzle with uniform interval, accurate volume, good consistency, high controllability and no back haul. This paper carried out the numerical simulation to investigate the gasliquid two-phase flow in the microchannel for the adhesive dispensing. A 2-D model of microchannel with a diameter for 0.04 mm was established and meshed. The gas-liquid slug flow emerges after iterating over 1 million steps with the gas flow rate for 0.1 m/s, the water flow rate for 0.05 m/s. The wetting property controlled by the contact angle had been discussed to present different liquid materials application. The poor wetting of liquid benefited for conforming droplets shape and avoiding droplets crashing and back haul. While the gas flow rate decreased, the length of liquid droplet and gas bubble increased and decreased, respectively and the total numbers of bubble and droplet decreased in one period. This indicated the fluid parameters have a high relationship with the quantity and volume of droplet.

关键词： Microchannel Fluids Numerical models Mathematical model Shape Equations

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A real-time pedestrian detection model adopted by high-performance ANS-DPM

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Journal of Computers (Taiwan) 2019年第2期30卷 240-251页

作者： Guo, Ai-Ying Ran, Feng Zhang, Jian-Hua Xu, Mei-Hua Gong, Lu-Ming Shen, Hua-Ming Key Laboratory of Advanced Display System Applications Ministry of Education Shanghai China Microelectronic Research and Development Center Shanghai China School of Mechatronics Engineering and Automation Shanghai University Shanghai China

In order to fulfill the real-time pedestrian detection system, it is difficult to balance the higher detection rate and greater detection speed at the same time. Therefore, this paper proposed an Adaptive Neighborhood Selection-Deformable Part Model (ANS-DPM) as a novel pedestrian feature operator to solve this problem. ANS-DPM adopts the adaptive feature zones to extract the pedestrian features based on the relationship between features ex-traction score with the experience threshold to decrease the whole calculation and upgrate. Meanwhile, the inner-layer and inter-layer constraint are introduced into the ANS-DPM to deal with the model of robustness. Finally, ANS-DPM with Latent-SVM constructs the pedestrian detection system and experiment result shows that the ANS-DPM can improve the feature rate, while the pedestrian detection system can detect 30 fps to satisfy the real-time detection system. © 2019 Computer Society of the Republic of China. All rights reserved.

关键词： Feature extraction

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MDS study on the adhesive heat transfer in micro-channel cooler

MDS study on the adhesive heat transfer in micro-channel coo...

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Shun Wang Yan Zhang Zhili Hu Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University P.O.B. 282 Shanghai 200072 China

Carbon nanotube (CNT) can be used in micro-channel cooler construction due to its excellent thermal conductivity. When fabricating CNTs directly onto the chip, the chip could be damaged because of the high temperature required for CNT growth (about 750℃). As a solution, a transfer technique is developed where the desired carbon nanotube pattern can be obtained by taking off a pre-fabricated CNT forest with a designed adhesive, and the transfer process could make the chip or other components immune from the high temperature required for the CNT growth process. This process can also improve the bonding/adhesive strength. Nevertheless, the use of adhesive in the CNT-based microchannel structure might affect the thermal conduction of the cooling system. In particular, the heat transfer between the heat generator and the CNT fin in the micro-channel cooler shall be evaluated. In this paper the thermal conductivity of the adhesive is studied by molecular dynamics simulation (MDS). The adhesive considered in the present MDS model consists of the epoxy and the curing agent. After the curing process, the epoxy molecules construct a network, which is established in the epoxy matrix generation before the simulation. Nonequilibrium Molecular Dynamics Method (NEMD) is adopted in the modeling and periodic boundary conditions are applied. Furthermore, the heat transfer through CNT and adhesive interface is simulated in this work based on the adhesive results, which can provide information for future macro-analysis of the thermal performance of the CNT microchannel cooler.

关键词： Carbon nanotubes Polymers Thermal resistance Heat transfer Curing

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New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging applications

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Na...

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International Symposium on Electronic Materials and Packaging

作者： Wen Xuan Wang Xiuzhen Lu Johan Liu Michael Olugbenga Olorunyomi Tomas Aronsson Dongkai Shangguan Key Laboratory of Advanced Display and System Applications (Chinese Ministry of Education) and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience University of Technology Gothenburg Sweden

Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal conductivity of the film. The produced Nano-TIM has a nano scale structure with embedded nano-SiC distributed randomly. Scanning Electrical Microscope (SEM) was used to determine the morphology of the film. Thermal properties were measured. The results show that the Nano-TIM has good thermal properties and it can be further improved by changing the mass concentration of the SiC nano particles.

关键词： Nanostructured materials Silicon carbide Electronics packaging Thermal conductivity Electronic packaging thermal management Conducting materials Semiconductor materials Scanning electron microscopy Semiconductor device packaging Mechanical factors

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Subthreshold Swing Model of GaN-Based Fin-Gate High Electron Mobility Transistors

Subthreshold Swing Model of GaN-Based Fin-Gate High Electron...

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China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Hanlin Yang Jiayi Yang Tiantian Guan Kailin Ren School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai China

Compared to the traditional HEMTs, better gate control ability especially smaller subthreshold swing, can be achieved with a fin-gate structure, which can be widely used in power, RF circuits. However, there has been few works related to subthreshold swing reported previously. In this study, a Fin- HEMT device is investigated by TCAD simulation, and a subthreshold swing model was constructed. The simulation results verify the performance of the model. According to the simulation results, with an error of less than 6%, this work provide design guidlines for the research of Fin-HEMT devices.

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Efficient and chromatic-controllable white organic light-emitting diodes on plastic substrates using color conversion methods

Efficient and chromatic-controllable white organic light-emi...

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16th International display Workshops, IDW '09

作者： Li, Bo Sun, Sanchun Lu, Lin Liao, Yingjie Li, Chunya Zhang, Jianhua Xu, Hongguang Wei, Bin Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai 200072 China SVA Electron Co. Ltd. FPD Building 149 Yanchang Rd. Shanghai 200072 China

The chromatic-stability white organic light emitting diodes have been investigated basing on color conversion method, and result found little CIE coordinate migration under driving voltage from 5V to 12V.

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Imaging quality analysis in 3D holographic display with kinoforms generated by slice-based fresnel diffraction and point-based method with fresnel zone plate

Imaging quality analysis in 3D holographic display with kino...

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Digital Holography and Three-Dimensional Imaging, DH 2017

作者： Zhang, Zhen Chen, Siqing Zheng, Huadong Yu, Yingjie Asundi, Anand K. Gao, Hongyue Dept. of Precision Mechaanical Engineering Shanghai University Shanghai200072 China Key Laboratory of Advanced Display and System Application Chinese Ministry of Education Shanghai200072 China School of Mechanical and Aerospace Engineering Nanyang Technological University Singapore639798 Singapore

ISBN: (纸本)9781943580286

Hologram calculating of 3D object has different computation methods. This paper mainly introduces the principle of slice-based Fresnel diffraction and point-based with Fresnel zone plate (FZP), and analyzes the imaging quality of the numerical reconstruction results by using our proposed methods. The reconstruction results show that Fresnel diffraction method is better in imaging quality. © OSA 2017.

关键词： Holograms

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Power Transformer Health State Prediction Based on Multi-attention Coupling Learning 6

Power Transformer Health State Prediction Based on Multi-att...

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6th IEEE International Electrical and Energy Conference, CIEEC 2023

作者： Zhang, Peng Gan, Jinrui Wu, Chunpeng Wu, Peng Qi, Bo Zhou, Fei State Grid Smart Grid Research Institute Co. Ltd. State Grid Laboratory of Grid Advanced Computing and Applications Beijing102209 China North China Electric Power University State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources Beijing102206 China

ISBN: (纸本)9798350346671

Transformer is the key apparatus of the power system, and its operational reliability is directly related to the stability of the power grid. Accurately predicting the future health state of transformers can reserve enough time for formulating outage maintenance and power dispatching plans. The existing transformer health state prediction methods are based on the structure of 'predict-diagnose', which is the superposition of two local optimal methods, with error superposition. To fill this gap, a transformer health state prediction method based on multi-attention coupling learning is proposed in this paper. The 'situational quantity' integrating the transformer operation state change relationship, the correlation relationship between state quantities, the mapping relationship between the state quantity and the state, the fuzzy relationship between the evaluation result and the actual state, and the traditional expert experience is proposed. Then, the structural optimization attention (SOA) model applicable to 'situational quantity' is proposed, and various relationships are treated as individual attention. All kinds of attention are coupled and constrained in the SOA to realize the unification of the prediction process and diagnosis process, obtain the global optimization of prediction and diagnosis, and the problem of error superposition is solved. The actual fault case verification results show that the accuracy of the proposed SOA prediction model can reach 96.33%, which is significantly better than the traditional methods. © 2023 IEEE.

关键词： Global optimization

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Comparisons of Nano-Additives Influence on Properties of the Bi-Modal Solder Pastes for Special applications

Comparisons of Nano-Additives Influence on Properties of the...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Janusz Sitek Krystyna Bukat Marek Koscielski Aneta Arazna A.Mlozniak Malgorzata Jakubowska Shiwei Ma Yan Zhang Johan Liu Qijie Zha Yulai Ga Tele and Radio Research Institute 03-450 Warsaw 11 Ratuszowa St. Poland Institute of Electronic Materials 133 Wolczynska Str. 01-919 Warsaw Poland Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Sch School of Materials Science and Engineering Shanghai University Shanghai 200072 China

The paper presented the results of investigation of two solder pastes SnBi and SAC with different nano-particles, which could be applied for special application. It was presented that materials and samples preparation for investigation. The results of SEM analyzer of solder joints executed using these pastes and their shear strength measurements enable to make the comparison of nano-additives influence on properties of the bi-modal solders pastes. It was observed that addition of nano-particles into both solder pastes changed the microstructure of solder joints, and formed a large number of nano-sized grains with uniform distribution. For the SAC solder joints with nano-Ag particles it was also observed that specific Ag3Sn crystallites. We supposed that the Ag3Sn crystals, which created “internal net” and nano-sized grains with uniform distribution must influence the mechanical properties of the solder joints. The results of shear strength measurements of solder joints confirmed the significantly higher shear strength of bimodal solder joints in comparison to reference solder joints without nano-additives.

关键词： Soldering Lead Microstructure Materials Packaging Nanoparticles

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On the accurate characterization of quantum-dot light-emitting diodes for display applications

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npj Flexible Electronics 2022年第1期6卷 351-362页

作者： Wangxiao Jin Yunzhou Deng Bingbing Guo Yaxiao Lian Baodan Zhao Dawei Di Xiaowei Sun Kai Wang Shuming Chen Yixing Yang Weiran Cao Song Chen Wenyu Ji Xuyong Yang Yuan Gao Shuangpeng Wang Huaibin Shen Jialong Zhao Lei Qian Fushan Li Yizheng Jin Key Laboratory of Excited-State Materials of Zhejiang Province State Key Laboratory of Silicon MaterialsDepartment of ChemistryZhejiang University310027 HangzhouChina State Key Laboratory of Modern Optical Instrumentation College of Optical Science and EngineeringInternational Research Center for Advanced PhotonicsZhejiang University310027 HangzhouChina Department of Electronic and Electrical Engineering Southern University of Science and Technology518055 ShenzhenChina TCL Research ShenzhenGuangdongChina Shenzhen China Star Optoelectronics Semiconductor Display Technology Co. LtdShenzhenGuangdongChina College of Chemistry Chemical Engineering and Materials ScienceSoochow University199 Ren’ai Rd215123 SuzhouJiangsuChina Key Lab of Physics and Technology for Advanced Batteries(Ministry of Education) College of PhysicsJilin University130023 ChangchunChina Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University149 Yanchang RoadShanghai 200072China Najing Technology Corporation Ltd Hangzhou 310052China Institute of Applied Physics and Materials Engineering University of MacaoTaipaMacaoSAR 999078China Key Laboratory for Special Functional Materials of Ministry of Education National&Local Joint Engineering Research Center for High-Efficiency Display and Lighting Technologyand Collaborative Innovation Center of Nano Functional Materials and ApplicationsHenan UniversityKaifeng 475004China School of Physical Science and Technology MOE Key Laboratory of New Processing Technology for Non-ferrous Metals and MaterialsGuangxi Key Laboratory of Processing for Non-ferrous Metals and Featured MaterialsGuangxi UniversityNanning 530004China Division of Functional Materials and Nanodevices Ningbo Institute of Materials Technology and EngineeringChinese Academy of SciencesNingbo 315201China College of Physics and Information Engineering Fuzhou UniversityFuzhou 350108China

Quantum dot light-emitting diodes(QLEDs)are a class of high-performance solution-processed electroluminescent(EL)devices highly attractive for next-generation display *** the encouraging advances in the mechanism investigation,material chemistry,and device engineering of QLEDs,the lack of standard protocols for the characterization of QLEDs may cause inaccurate measurements of device parameters and invalid comparison of different ***,we report a comprehensive study on the characterizations of QLEDs using various *** show that the emission non-uniformity across the active area,nonLambertian angular distributions of EL intensity,and discrepancies in the adopted spectral luminous efficiency functions could introduce significant errors in the device *** errors in the operational-lifetime measurements may arise from the inaccurate determination of the initial luminance and inconsistent methods for analyzing the luminance-decay ***,we suggest a set of recommended practices and a checklist for device characterizations,aiming to help the researchers in the QLED field to achieve accurate and reliable measurements.

关键词： diodes characterization luminous

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