检索结果-内蒙古大学图书馆

Conductive Porous MXene for Bionic,Wearable,and Precise Gesture Motion Sensors

Research 2021年第1期2021卷 1391-1401页

作者： Shengshun Duan Yucheng Lin Zhehan Wang Junyi Tang Yinhui Li Di Zhu Jun Wu Li Tao Chang-Hwan Choi Litao Sun Jun Xia Lei Wei Baoping Wang Joint International Research Laboratory of Information Display and Visualization School of Electronic Science and EngineeringSoutheast UniversityNanjing 210096China School of Materials Science and Engineering Southeast UniversityNanjing 211189China Center for 2D Materials Southeast UniversityNanjing 211189China Center for Advanced Materials and Manufacture Joint Research Institute of Southeast University and Monash UniversitySuzhou 215123China Department of Mechanical Engineering Stevens Institute of TechnologyHobokenNew Jersey 07030USA SEU-FEI Nano-Pico Center Key Laboratory of MEMS of Ministry of Education Collaborative Innovation Center for Micro/Nano Fabrication Device and SystemSoutheast UniversityNanjing 210096China Center for Advanced Carbon Materials Southeast University and Jiangnan Graphene Research InstituteChangzhou 213100China

Reliable,wide range,and highly sensitive joint movement monitoring is essential for training activities,human behavior analysis,and human-machine ***,most current motion sensors work on the nano/microcracks induced by the tensile deformation on the convex surface of joints during joint movements,which cannot satisfy requirements of ultrawide detectable angle range,high angle sensitivity,conformability,and consistence under cyclic *** nature,scorpions sense small vibrations by allowing for compression strain conversion from external mechanical vibrations through crack-shaped slit ***,we demonstrated that ultraconformal sensors based on controlled slit structures,inspired by the geometry of a scorpion’s slit sensilla,exhibit high sensitivity(0.45%deg^(-1)),ultralow angle detection threshold(~15°),fast response/relaxation times(115/72 ms),wide range(15°~120°),and durability(over 1000 cycles).Also,a user-friendly,hybrid sign language system has been developed to realize Chinese and American sign language recognition and feedback through video and speech broadcasts,making these conformal motion sensors promising candidates for joint movement monitoring in wearable electronics and robotics technology.

关键词： durability conformal satisfy

来源：评论

学校读者我要写书评

暂无评论

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin array simulation results. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array, that is, 2D fin array can reduce the thermal resistance of the cooler although 2D fin array causes more pressure drop in the architecture than 1D fin array.

关键词： Computational fluid dynamics Cooling Microchannel Carbon nanotubes Thermal conductivity Heat transfer Solid modeling Two dimensional displays Chemical technology Educational technology

来源：评论

学校读者我要写书评

暂无评论

Temperature Endurable Face-Sealing Polyisobutylene Film with Contactable Liquid Desiccant for the Encapsulation of OLEDs

SSRN

引用

SSRN 2024年

作者： Zheng, Haixai Zhu, Yangyang Zhao, Bingjia Lin, Yang Lan, Weixia Shi, Wei Wei, Bin School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China Shanghai Engineering Research Center for Integrated Circuits and Advanced Display Materials Shanghai University Shanghai200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai200072 China School of Microelectronics Shanghai University Shanghai200072 China Shanxi Datong University China

We propose a face-sealed encapsulation solution with simple process and low cost. The polyisobutylene encapsulation patch mixed with calcium oxide particles is attached to the surface of the OLEDs that is exposed to the hygroscopic agent in a face-sealing manner. We find that this encapsulation scheme exhibited excellent waterproof performance. The encapsulated OLED has a long shelf lifetime in water under high temperature conditions, which is manifested in a long underwater shelf lifetime of T95 (luminance drops to 95% of the initial luminance) of over 336 hours at 60°C. This strategy can be extended to roll-to-roll processes to expand the application of flexible photoelectronic devices. © 2024, The Authors. All rights reserved.

关键词： Luminance

来源：评论

学校读者我要写书评

暂无评论

RF performance of flip chip ACA joints for CPW transmission lines

RF performance of flip chip ACA joints for CPW transmission ...

引用

Electronics system-Integration Technology Conference, ESTC

作者： Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines are being used widely as its lower loss compared to conventional MS lines. In this paper, we studied RF performance of the ACA joints for CPW lines using the simulation software HFSS. Firstly, we investigated the high frequency performance by varying distance and number of ACA particles. It shows that the S11 parameter greatly deteriorated at the lower frequency band. To further study this phenomenon, we extracted the equivalent circuit. The extracted circuit value showed that when particle number increased, the electromagnetic interaction between each particles gradually dominant the overall performance. As a result, the mutual inductance increased the equivalent inductance, and the equivalent capacitances was also increased in the interconnect region. The particle distance was found to have little influence on the RF performance. Secondary, we studied the influences of resin compound (epoxy matrix) with different dielectric constant. Resin compound greatly influence the effective constant and impedance at the output port, thus induced impedance mismatch and slightly changed S11 response in the frequency range. Finally, we performed ANOVA analysis to evaluate the impact factors among ACA resin, joint height, signal to ground bump distance, conductor overlap and particle number. The dielectric constant of resin was found to be the most important factor in flip chip CPW-CPW ACA joints. Conductor overlap and ground to signal distance are still the two main factors. To optimize the performance, the dielectric constant of resin should be as lower as possible, and the conductor overlap length and ground to signal distance should be minimized. Moreover, particle number and bump height proved to have least effect. To achieve best performance, the particle numbe

关键词： Radio frequency Flip chip Coplanar waveguides Transmission lines Resins Dielectric constant Conductors Coplanar transmission lines Inductance Impedance

来源：评论

学校读者我要写书评

暂无评论

Monolithically Integrated Temperature Sensor Based on p-GaN/AlGaN/GaN Heterostructure

Monolithically Integrated Temperature Sensor Based on p-GaN/...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Qingxin Liu Kailin Ren Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai China Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

A monolithically integrated temperature sensor circuit based on a p-GaN/AlGaN/GaN heterojunction is proposed. The sensor comprises two parts: the first part is a temperature-sensitive voltage source formed by a two-dimensional electron gas (2DEG) resistor and a schottky barrier diode (SBD) in series, and the second part is a resistor-transistor logic (RTL) inverter formed by a 2DEG resistor and a p-GaN high electron mobility transistor (HEMT) in series. The output voltage of the temperature-sensitive voltage source is connected to the gate of the p-GaN HEMT in the second part, providing the gate voltage. According to data obtained from TCAD simulation results, the output voltage of the temperature-sensitive voltage source exhibits positive temperature dependence. The output voltage of the RTL inverter exhibits a negative temperature dependence. When the temperature sensor is properly biased, the voltage division between the SBD and the 2DEG resistor in the temperature-sensitive voltage source reallocates as the temperature rises, causing the gate voltage of the connected RTL inverter to increase. This increasement enhances the temperature-induced variation in the RTL inverter's output voltage, increasing the sensitivity of the temperature sensing circuit from 4 mV/K with a fixed gate voltage to 14 mV/K. This simulation demonstrates a compact monolithic integration sensor for monitoring the on-chip temperature of GaN power integrated circuits for protection and control.

关键词： Temperature sensors Resistors Temperature dependence Sensitivity HEMTs Logic gates Thermal management Inverters system-on-chip MODFETs

来源：评论

学校读者我要写书评

暂无评论

FEM simulation of bimodal and trimodal thermally conductive adhesives

FEM simulation of bimodal and trimodal thermally conductive ...

引用

IEEE Conference on Nanotechnology

作者： Nabi Nabiollahi Johan Liu Zhu Hilli Yan Zhang Yue Cong Zhaonian Cheng Masahiro Inoue Bio Nano science laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Ministry of Education and SMIT Center Shanghai University Shanghai China The Institute of Scientific and Industrial Research Osaka University Osaka Japan

ISBN: (纸本)9781424448326

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

关键词： Thermal conductivity Conductive adhesives Thermal resistance Mathematical model Analytical models Finite element methods Contact resistance MATLAB Electric resistance Conducting materials

来源：评论

学校读者我要写书评

暂无评论

Comparison of smoothing methods for the analysis of transient thermal resistance

Comparison of smoothing methods for the analysis of transien...

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Yanan Liu Zhangfu Chen Jianhua Zhang Lianqiao Yang The School of Materials Science and Engineering Shanghai University Shanghai China Ministry of Education Key Laboratory of Advanced Display and System Applications (Shanghai University) The School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai China Shanghai University Shanghai P.R.China

ISBN: (纸本)9781509013975

In this paper, the analysis of transient thermal resistance is carried out on the basis of the regularization smoothing method and the Fourier series expansion method. These two methods are used to smooth cooling curve under the hypothetical model, and their result of smoothing and derivation are contrasted to the move average smoothing method under the actual model measured by T3ster. From theoretical model analysis and actual measured data analysis and application, it can be seen that the methods proposed have good effect on the analysis of transient thermal resistance.

关键词： Resistance Performance evaluation Heating

来源：评论

学校读者我要写书评

暂无评论

Thermodynamic Analysis of Multi-Stage Thermal Compression Bonding for Fabricating Vertically Stacked Micro-Led Array

Thermodynamic Analysis of Multi-Stage Thermal Compression Bo...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Lianyu Wang Kailin Ren Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai University Shanghai China Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications (Ministry of Education) Shanghai University Shanghai China

ISBN: (数字)9798331541149

ISBN: (纸本)9798331541156

Vertical full-color Micro-LEDs based on flip-chip bonding technology are of great significance in high-resolution display applications, as they have many advantages such as high pixel density, high brightness, and wide color gamut. However, the construction of vertical full-color Micro-LEDs requires multiple thermal compression bonding (TCB). Therefore, thermal stress analysis during multiple TCB is necessary. In this work, the surface thermal stress of a 5×5 vertical Micro-LED array during multi-stage TCB is studied by finite element method (FEM) simulations. The stresses at LED-LED bonding interface and stacked LED-backplane bonding interface as well as the interactions between the two bondings are investigated. The results of different bonding temperatures, material combinations, and interconnected metal diameters and depths on the mean stresses at the bonding interface are analyzed, and then the adequacy of bonding and risk of debonding are assessed. The results show that among the hybrid bonding material combinations set in the simulation, the Cu/ Al 2 O 3 has the largest interfacial stress. In addition, decreasing the interconnected metal diameter and lowering the bonding temperature can relieve the interfacial stress, while the interconnected metal depth has no significant effect on the bonding stress. The key advantage of this work is that it can help establish design and process guidelines to shorten the development cycle of vertical full-color Micro-LEDs based on flip-chip bonding technology.

关键词： Thermodynamics Photonic band gap Metals Thermal analysis Finite element analysis Flip-chip devices Bonding Stress Thermal stresses Guidelines

来源：评论

学校读者我要写书评

暂无评论

Hybrid bonding thermodynamic simulation of 3×3 array of Micro-LED fabricated based on flip-chip bonding

Hybrid bonding thermodynamic simulation of 3×3 array of Mic...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jianxin Li Haojie Zhou Xiaoxiao Ji Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

In this paper, ANSYS was used to perform a hybrid bonding thermodynamic simulation of Micro-LED fabricated based on flip-chip *** simulated the effects of different ILDs (interlayer dielectrics) and different diameters of In bumps on the mean stress of the bonding surface. The results show that filling BCB (Benzo cyclobutene)/PI (Polyimide)/SiO 2 can significantly reduce the mean stress on the In bumps bonding area, among which, filling BCB/PI is better than filling SiO 2 . And when the diameter of the In bumps is 5 μm, the mean stress on the In bumps bonding area is lowest. For the mean stress on the bonding area of the ILDs, filling BCB/PI is also much better than filling SiO 2 . Changing the diameter of the In bumps has little effect on the mean stress of the ILDs bonding area filled with BCB/PI. As for the bonding area of the ILDs filled with SiO 2 , the mean stress increases as the diameter of the In bumps increases. This paper uses simulation experiments to study the mean stress on different bonding areas during the hybrid bonding process of preparing Micro-LED, which provides a theoretical basis for improving the bonding strength and yield of Micro-LED, and provides ideas for realizing the industrialization of Micro- LED.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Transient Thermodynamic Simulation of Micro LED Array Bonding

Transient Thermodynamic Simulation of Micro LED Array Bondin...

引用

China International Forum o Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

作者： Jinwen Pan Haojie Zhou Xiaoxiao Ji Liang Chen Luqiao Yin Jianhua Zhang School of Microelectronics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Shanghai University Ministry of Education Shanghai China School of Materials Science and Engineering Shanghai University Shanghai China School of Mechatronic Engineering and Automation Shanghai University Shanghai China

Micro LED display technology is considered to be the next generation of display technology and finds widespread applications in displays and visible light communication. key cooperation plays a crucial role in achieving electrical interconnections for Micro LED, which significantly impact their luminous quality and reliability. This study aims to analyze the stress-strain evolution during the bonding process of Micro LED arrays with cylindrical and spherical In bumps using COMSOL. The results demonstrate that the displacement of the bumps after bonding decreases by up to 97% compared to the displacement observed during the temperature-holding phase. Furthermore, the stresses during the temperature rise and fall stages approximately exhibit a linear relationship with temperature, and residual stresses exist after bonding. Additionally, residual stresses remain present after bonding. This study provides theoretical guidance for optimizing the bonding process of Micro LED and further exploration for the commercialization of Micro LED.

关键词：

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：