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Micropolar interface model of thin-layered interconnection components with heterogeneous internal microstructures

Journal of Shanghai University(English Edition) 2009年第5期13卷 345-348页

作者：张燕樊靖郁 Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University

Being a wide variety of thin-layered interconnection components in electronics packaging with relatively small scale and heterogeneous materials, conventional numerical methods may be time consuming and even inefficacious to obtain an accurate prediction for the interface behavior under mechanical and/or thermal loading. Rather than resort to a fully spatial discretization in the vicinity of this interface zone, an interface model was proposed within the framework of micropolar theory by introducing discontinuous approximation. A fracture description was used to represent the microscopic failure progress inside the interface. The micropolar interface model was then numerically implemented with the finite element method. As an application, the interface behavior of a packaging system with anisotropic conductive adhesive (ACA) joint was analyzed, demonstrating its applicability and great efficiency.

关键词： interface model micropolar theory discontinuous approximation

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Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

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ECS Transactions 2010年第1期27卷

作者： Xia Zhang Teng Wang Pär Berggren Si Chen Johan Liu Shanghai University Chalmers University of Technology SHT Smart High-Tech AB SMIT Ltd Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China

Carbon Nanotube (CNT) has been proposed as a promising candidate material to build next generation flip chip interconnects in electronics. In this paper, flip chip assembly using CNT bumps and ACF is performed. To realize CNT-based interconnects, post-growth processes including deposition of metallic layers on CNT bundles and low temperature transfer of CNT bundles have been developed to overcome the problems of the high growth temperature of CNT as well as the poor adhesion between CNT bumps and substrates. Moreover, ACF has been used to assemble the CNT bumps on another Si substrate. The electrical test is performed also to verify the good contact between CNT bumps and ACF.

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A jetting system for chip on glass package

A jetting system for chip on glass package

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Haili, Jia Zikai, Hua Maoyu, Li Jinsong, Zhang Jianhua, Zhang School Engineering and Engineering and Automation Shanghai University Shanghai City 200072 China Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai University Shanghai City 200072 China

ISBN: (纸本)9781424446599

Jetting is regarded as the next generation dispensing technology due to its features of non-contact and high precision dispensing. In this paper, we developed a jetting system for chip-on-glass package consisting of a jetting dispenser and a 3-axis movement system. The jetting dispenser applied a concept of modular design to construct four modules, which were nozzle, actuator, feeder and temperature controller. To analyze the factors influencing the fluid jetting, the proper fluid and structure models were set up. In the jetting dispenser, we used a solenoid valve (f >100Hz) to provide a high-speed movement for a needle. In a dispensing process, a piston drove a needle to move reciprocate, and its stroke was measured and controlled by a micrometer. A 3-axis system was a platform for the installation of jetting dispenser, and supported a reciprocating motion to follow the programmed route. ©2009 IEEE.

关键词： Needles

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An improved dual field modular inversion algorithm and VLSI implementation

An improved dual field modular inversion algorithm and VLSI ...

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1st International Conference on Information Science and Engineering, ICISE2009

作者： Chen, Guanghua Zhu, Jingming Liu, Ming Zheng, Weifeng School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education and Microelectronic Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769538877

An improved dual filed modular inversion algorithm which can support inversion operation in both GF(P) and GF(2∧m) is proposed in this paper. Compared with previous ones based on Extended Euclidean algorithm, it not only finishes modular inversion arithmetic in dual fields, but also operates much faster by more effective shift operations and avoiding time-consuming magnitude comparison. The simple addition/subtraction becomes the most complex operation in the new algorithm while the multiplication/division is replaced by cheap shifting, and thus only two adders and one subtraction device are required to complete its hardware implementation. The 256-bit modular inversion circuit based on the improved algorithm is implemented in SMIC 0.18 CMOS standard cell technology. The synthesis result indicates that the design is about 17% faster than that of previous algorithms while the area is only 5% larger. ©2009 IEEE.

关键词： VLSI circuits

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Improvement of interleaved multiplication algorithm

Improvement of interleaved multiplication algorithm

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1st International Conference on Information Science and Engineering, ICISE2009

作者： Chen, Guanghua Liu, Ming Zhu, Jingming Zheng, Weifeng School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Microelectronic Research and Development Center Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769538877

An improved modular multiplication algorithm based on the interleaved multiplication is presented in this paper. Carry save addition (CSA), redundant representation, a fast lookup table and a counter register are used to improve this algorithm. Carry save addition and redundant representation are used to replace other additions like carry select addition, carry lookahead addition and so on, because carry propagation brought by those additions can be prevented by carry save addition, and redundant representation can make the arithmetic operations fast without carry propagation. The fast lookup table with only 7 pre-calculated values can minimize the number of additions, and can only be addressed once in one iteration, which not only speed up, but also save area compared with other literatures used lookup tables. The iteration number can be reduced by a counter register being added in this improved method to compute the number of 0 from the most significant bit of one operand like X. Analysis and emulation result shows the area and time complexity (AT) of the improved method is equal or even less than 2n2. ©2009 IEEE.

关键词： Table lookup

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Compressed sensing based channel estimation for fast fading OFDM systems

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Chinese Journal of systems Engineering and Electronics 2010年第4期000卷

作者： Xiaoping Zhou Yong Fang Min Wang Key Laboratory of Specialty Fiber Optics and Optical Access Networks School of Communication and Information EngineeringShanghai University Shanghai 200072 P. R. China Key Laboratory of Specialty Fiber Optics and Optical Access Networks School of Communication and Information EngineeringShanghai University Shanghai 200072 P. R. China Key Laboratory of Advanced Display and System Applications Shanghai 200072 P. R. China

A compressed sensing (CS) based channel estima-tion algorithm is proposed by using the delay-Doppler sparsity of the fast fading channel. A compressive basis expansion chan-nel model with sparsity in both time and frequency domains is given. The pilots in accordance with a novel random pilot ma-trix in both time and frequency domains are sent to measure the delay-Doppler sparsity channel. The relatively nonzero channel coefficients are tracked by random pilots at a sampling rate signifi-cantly below the Nyquist rate. The sparsity channels are estimated from a very limited number of channel measurements by the basis pursuit algorithm. The proposed algorithm can effectively improve the channel estimation performance when the number of pilot sym-bols is reduced with improvement of throughput efficiency.

关键词： compressed sensing sparse channel channel esti-mation fast fading

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Color correction method based on histogram segmentation for multiview video

Color correction method based on histogram segmentation for ...

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Institution of Engineering and Technology International Communication Conference on Wireless Mobile and Computing

作者： Liu, Yi Wang, Yongfang Zhang, Zhaoyang School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 200072 China

ISBN: (纸本)9781849191388

Color differences between different views can cause performance degradation in multiview video coding. In order to overcome this problem, in this paper a local color correction method based on histogram segmentation is proposed. In the proposed method, we correct the color changes in the different segmentation regions between the current picture and the reference picture. Extensive experimental results demonstrate that the proposed method outperforms the traditional global linear color correction methods with objective mean of disparity values and subjective visual quality, and achieves better correction results.

关键词： Color

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Design of RKE system Based on KEELOQ Encryption Technology

Design of RKE System Based on KEELOQ Encryption Technology

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International Conference on Artificial Intelligence and Computational Intelligence (AICI)

作者： Yue-li Hu Yan Zhang Bin Sun Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China Shanghai University Shanghai Shanghai CN

KEELOQ code hopping technology is a nonlinear anti-encryption algorithm designed for secure Remote keyless Entry (RKE) systems. It combines a 66-bits transmission length, so as to prevent the system from code predicting, code grabbing and code scanning. Because of its feature of high-security, it effectively overcomes the disadvantages of the traditional fixed code technology. This paper researched on KEELOQ encryption algorithm and presented a designed RKE system based on KEELOQ technology. When the software and hardware were designed, the whole RKE system was afterwards made as a prototype for the functionality tests. The experimental results showed that the design achieved the anticipative effects.

关键词： Cryptography Decoding Information security Counting circuits Automation Laboratories Algorithm design and analysis NIST Data security Manufacturing

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Studies on microstructure of Epoxy Molding Compound (EMC)-leadframe interface after environmental aging

Studies on microstructure of Epoxy Molding Compound (EMC)-le...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Xiuzhen, Lu Li, Xu Huaxiang, Lai Xinyu, Du Johan, Liu Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes with different metal coatings was studied using Scanning Electron Microscopy (SEM). The leadframes used in this study were copper, copper with Ag coating, Ni coating and Ni/Pd/Au coating. The results of tab pull testing showed the adhesion strength of the EMC/copper leadframe interface was strongest while that of the EMC/leadframe with Ni/Pd/Au coating interface was weakest. Little delamination appeared on the EMC/Cu sample, including the samples after the moisture and reflow treatment. Delamination appeared on the interface of EMC/leadframe with Ag coating after treatment, and serious delamination was found on the interface of EMC/leadframe with Ni coating. The SEM micrographs showed that there were some microcracks between the filler of EMC and the leadframe. ©2009 IEEE.

关键词： Adhesion

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Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Adhesion behavior between epoxy molding compound and differe...

引用

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Li, Xu Xiuzhen, Lu Johan, Liu Xinyu, Du Yan, Zhang Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane. ©2009 IEEE.

关键词： Adhesion

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