检索结果-内蒙古大学图书馆

2008 International Conference on Microwave and Millimeter Wave Technology(2008国际微波毫米波技术会议)

作者： Xiao-Rong Yan Shun-Shi Zhong Xia Zhang School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 School of Communication and Information Engineering Shanghai Universityyanxr2003 *** Shanghai 2 Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterShang

A compact tapered CPW-fed hollowed printed monopole antenna on the liquid crystal polymer (LCP) substrate with an extremely wide bandwidth (EWB) is introduced. The simulated results demonstrate that this antenna achieves an impedance bandwidth from 0.435GHz to 14.52GHz (33:1) for VSWR≤,and exhibits a nearly omnidirectional radiation pattern,while its area is only about 0.18λ1×0.13λ1,where λ1 is the wavelength of the lowest operating frequency.

关键词： Liquid crystal polymers Bandwidth Impedance Frequency Antenna radiation patterns Coplanar waveguides Packaging Computational modeling Broadband antennas Costs

来源：评论

学校读者我要写书评

暂无评论

RF performance of flip chip ACA joints for CPW transmission lines

RF performance of flip chip ACA joints for CPW transmission ...

引用

Electronics system-Integration Technology Conference, ESTC

作者： Xu Wang Xia Zhang Johan Liu Yan Zhang Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai P.R.China Current address: SanDisk Semiconductor (Shanghai) Corporation Shanghai P.R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

In earlier work, radio frequency (RF) performance of flip-chip anisotropic conductive adhesive (ACA) joints has been studied both in experiments and simulations. Nowadays, coplanar waveguide (CPW) transmission lines are being used widely as its lower loss compared to conventional MS lines. In this paper, we studied RF performance of the ACA joints for CPW lines using the simulation software HFSS. Firstly, we investigated the high frequency performance by varying distance and number of ACA particles. It shows that the S11 parameter greatly deteriorated at the lower frequency band. To further study this phenomenon, we extracted the equivalent circuit. The extracted circuit value showed that when particle number increased, the electromagnetic interaction between each particles gradually dominant the overall performance. As a result, the mutual inductance increased the equivalent inductance, and the equivalent capacitances was also increased in the interconnect region. The particle distance was found to have little influence on the RF performance. Secondary, we studied the influences of resin compound (epoxy matrix) with different dielectric constant. Resin compound greatly influence the effective constant and impedance at the output port, thus induced impedance mismatch and slightly changed S11 response in the frequency range. Finally, we performed ANOVA analysis to evaluate the impact factors among ACA resin, joint height, signal to ground bump distance, conductor overlap and particle number. The dielectric constant of resin was found to be the most important factor in flip chip CPW-CPW ACA joints. Conductor overlap and ground to signal distance are still the two main factors. To optimize the performance, the dielectric constant of resin should be as lower as possible, and the conductor overlap length and ground to signal distance should be minimized. Moreover, particle number and bump height proved to have least effect. To achieve best performance, the particle numbe

关键词： Radio frequency Flip chip Coplanar waveguides Transmission lines Resins Dielectric constant Conductors Coplanar transmission lines Inductance Impedance

来源：评论

学校读者我要写书评

暂无评论

Effect of encapsulation on OLED characteristics with anisotropic conductive adhesive

Effect of encapsulation on OLED characteristics with anisotr...

引用

Electronics system-Integration Technology Conference, ESTC

作者： Yan Zhang Mans Andreasson Johan Liu Thorvald Andersson Hsuan-Yi Liao Itsuo Watanabe Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Advanced Interconnect Material Division Hitachi Chemical Company Limited Chikusei Ibaraki Japan

Organic light emitting devices (OLEDs) is one of the most potentially interesting display technologies in the flat panel display (FPD) field. This paper investigates the effects of OLED structures and a perimeter encapsulation to protect the OLED from atmospheric exposure. Firstly, the electric features of the OLED devices with and without a copper phtalocyanine layer were measured, and the one with the additional buffer layer showed a lower turn-on voltage. Then the OLED device sample was encapsulated with a glass cover bonded to the substrate with an adhesive matrix containing micro-particles. The samples were stored in ambient conditions, and the IV characteristics were studied with shelf-time as a parameter. The measurement results indicated that the encapsulation had a significant improvement on the device operation. After two weeks of storage the encapsulated samples showed less degradation and the current density at a given operating bias was about fifty percent higher than without encapsulation.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays Protection Copper Atmospheric measurements Electric variables measurement Buffer layers

来源：评论

学校读者我要写书评

暂无评论

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Recent Progress of Carbon Nanotubes as Cooling Fins in Elect...

引用

2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Johan Liu Yifeng Fu Teng Wang SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China

As power density in electronic system is approaching a level that conventional cooling methods can't handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using Carbon Nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is considered as an ideal material for thermal management in high heat flux microsystems. Fabricated onto a silicon substrate to form microchannels, the CNT based cooling fins show high heat dissipation efficiency. This paper reviews the ongoing research on CNT based microchannel cooler development carried out so far. Both experimental and simulation results are included and presented.

关键词： Microchannel Cooling Arrays Thermal conductivity Carbon nanotubes Heating Heat transfer

来源：评论

学校读者我要写书评

暂无评论

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Manufacture, Microstructure and Microhardness Analysis of Sn...

引用

2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Lili Zhang Wenkai Tao Johan Liu Yan Zhang Zhaonian Cheng Cristina Andersson Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed Consumable-electrode Direct Current Arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.

关键词： Soldering Microstructure Lead Materials Grain boundaries Nanoparticles Packaging

来源：评论

学校读者我要写书评

暂无评论

Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

Multi-chip integrated high-power white LED device on the mul...

引用

Electronic Components and Technology Conference (ECTC)

作者： Luqiao Yin Weiqiao Yang Yansheng Guo Kejun Ma Shuzhi Li Mingfa Chen Jia Li Jianhua Zhang School of Mechatronics and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai China Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Shanghai China Rainbow Optoelectronics Material Shanghai Company Limited Shanghai China Microelectronics Technology Institute of East China Shanghai University Shanghai China

In order to solve the thermal issue and improve the thermal resistance of LED, a device with multi-chip packaged on multi-layer composite ceramic substrate is successfully packaged. The top layer of the substrate is low temperature co-fire ceramic (LTCC), while the base layer is aluminum nitride (AINx) ceramic. 18 chips(one watt) are used in the device, and all of them are simultaneously packaged on a composite ceramic substrate which is 55 mm in length and 20 mm in width. The 18 chips are designed into two rows, and three chips in series for six parallels. At the same time the same chips are packaged on aluminum (Al) substrate and alumina (AlOx) substrate. After wire bonding photoelectric parameters of the three package modules are tested, the results show that the properties of the AINx-based package has the best performances, the thermal resistance of the device is far smaller than the other devices packed on the Al substrate and the AlOx substrate. After phosphor coatings the AINx-based multi-layer ceramic substrate package has 896.1 lm (43.4 lm/W) loading 350 milliampere (mA) to each chip, and has 1081.3 lm (35.4 lm/W) loading 500 mA. The multi-chip module has little light degradation adding 500 mA to each chip after working in the room temperature for one afternoon. At last the module is simulated by ANSYS software, the highest junction temperature of the chips in the module is about 70.8degC when 1.8 watts electric power is loaded to each chip, this temperature is far lower than 125degC which will damage the chip, and he highest simulation temperature of the aluminum heat slug is about 39.3degC. The temperature of the aluminum heat slug is about 41.0degC which is tested by thermocouple in the experiments, and it is closely to the simulation temperature 39.3degC. At last the relationship between pn-junction temperature and thermal conductivity coefficient of the silver (Ag) paste , the relationship between pn-junction temperatures and convection coefficient ha

关键词： Light emitting diodes Ceramics Temperature Packaging Thermal resistance Thermal conductivity Testing Aluminum nitride Wire Bonding

来源：评论

学校读者我要写书评

暂无评论

Wigner-Ville distribution and cross Wigner-Ville distribution of noisy signals

引用

Journal of systems Engineering and Electronics 2008年第5期000卷

作者： Chen Guanghua Ma Shiwei Liu Ming Zhu Jingming Zeng Weimin Key Laboratory of Advanced Display and System Applications Ministry of Education & Microelectronic Research and Development CenterShanghai Univ.Shanghai 200072P.R.China

The Wigner-Ville distribution (WVD) and the cross Wigner-Ville distribution (XWVD) have been shown to be efficient in the estimation of instantaneous frequency (IF).But the statistical result of the IF estimation from XWVD peak is much better than using WVD *** reason is given from a statistical point of *** studies show that XWVD of the analyzed signal can be estimated from XWVD of the noise-contaminated *** estimation is unbiased,and the variance is equal to that of *** this case,WVD cannot be estimated from WVD of the noise-contaminated ***,higher SNR is required when WVD is used to analyze signals.

关键词： Wigner-Ville distribution cross Wigner-Ville distribution instantaneous frequency expectation vari-ance

来源：评论

学校读者我要写书评

暂无评论

LARGE-EDDY SIMULATION OF THREE-DIMENSIONAL VORTICAL STRUCTURES FOR AN IMPINGING TRANSVERSE JET IN THE NEAR REGION

引用

Journal of Hydrodynamics 2007年第3期19卷 314-321页

作者： FAN Jing-yu ZHANG Yan WANG Dao-zeng Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications （Shanghai University） Ministry of Education and SMIT Center Shanghai University Shanghai 200072 China Department of Applied Mechanics Chalmers University of Technology SE-412 96 Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China

The three-dimensional vortical structures for an impinging transverse jet in the near region were numerically investigated by means of Large-Eddy Simulation （LES）. The LES results reproduced the skewed jet shear layer vortices close to the jet nozzle and the scarf vortex in the near-wall zone in good agreement with the experimental observations. Different vortical modes in the skewed jet shear layer close to the jet nozzle were identified depending upon the velocity ratio between jet and crossflow, namely changing from an approximately axisymmetric mode to a helical one with the velocity ratios varying from 20 to 8. Moreover, the scarf vortex wrapped around the impinging jet in the near-wall zone showed distinct asymmetry with regard to its bilateral spiral legs within the near region. And the entrainment of the ambient crossflow fluids by the scarf vortex in the near-wall zone was appreciably influenced by its asymmetry and in a large part occurred on the surface of the spiral roller structures in the course of spreading downstream.

关键词： Large-Eddy Simulation （LES） impinging jet crossflow vortical structure entrainment

来源：评论

学校读者我要写书评

暂无评论

Nanotechnologies and nanomaterials for thermal management of microsystems

Nanotechnologies and nanomaterials for thermal management of...

引用

International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

作者： Johan, Liu Key Laboratory of Advanced Display and System Applications Yan Chang Campus Shanghai University No 149 Yan Chang Road 200072 China SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology Se 412 96 Gothenburg Sweden

ISBN: (纸本)1424412536

One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize newdeveloped nanotechnologies and nanomaterials to enhance the heat removal from microsystems. This paper generally reviews the related research work performed at smit center. Three approaches are presented: thermal interface materials (TIMs) made of electrospun nanofibers and nano thermally conductive particles, microchannel coolers based on carbon nanotubes (CNTs), and CNT-based high thermally conductive interconnects. These three techniques provide a systematic solution to the efficient thermal management of microsystems. © 2007 IEEE.

关键词： Nanostructured materials

来源：评论

学校读者我要写书评

暂无评论

A high-speed GRAM built in TFT-LCD driver IC

A high-speed GRAM built in TFT-LCD driver IC

引用

作者： Yan, Limin Liu, Shujun Key Laboratory of Advanced Display and System Applications Shanghai University Microelectronics R and D Center Shanghai University Campus 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9787561752289

LCD display solution always contains three main parts: controller, source driver and gate driver, which is commonly designed separately in large-sized panel, but integrated on single chip for medium-sized or small, such as digital cellular phones and small PDAs. This paper describes a high-speed GRAM (Graphics RAM) supporting 1-chip solution for TFT-LCD panel, which capacity is 132(width) × l76(length) × 16(RGB) bits, storing 65k-color image, which read access time is 546 ps.

关键词： Thin film transistors

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：