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检索条件"机构=Key Laboratory of Advanced Display and System Applications and SMIT Center"
137 条 记 录,以下是121-130 订阅
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Design of SSCMP with Arbiter and Shared Data Memory Interrupt
Design of SSCMP with Arbiter and Shared Data Memory Interrup...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Yueli Hu Ying Liu Wenyi Jing Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China
In the machine vision system, a common and effective way to solve high complexity and huge throughput of image processing arithmetic computation is to adopt instruction-level-parallel scheme through multiple MCUs with... 详细信息
来源: 评论
A Pipeline Sliding Window Max-Log-Map Turbo Decoder
A Pipeline Sliding Window Max-Log-Map Turbo Decoder
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Ming Li Ming-ming Peng Jing-sai Jiang Fa-yu Wan Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China
Turbo codes have become an attractive forward error correction scheme for wireless communication systems. MAP algorithm is the optimization algorithm for turbo-codes. But its implementation is complex. Max-Log-MAP alg... 详细信息
来源: 评论
Design of On-Chip Debug Module Based on MCU
Design of On-Chip Debug Module Based on MCU
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Yue-li Hu Ke-xin Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research and Development Center Shanghai China
A design method of embedded OCD (On-Chip Debugging) based on Intel 8051 MCU architecture is proposed. The OCD module named E-OCD-SFRB (Enhanced OCD module with SFR (Special Function Register) Breakpoint Function) is i... 详细信息
来源: 评论
Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Preparation Techniques and Characterization for Sn-3.0Ag-0.5...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Xinzhi Xia Changdong Zou Yulai Gao Johan Liu Qijie Zhai School of Materials Science and Engineering Shanghai University Shanghai China Key State Laboratory for New Display and System Applications and SMIT Center Shanghai University Shanghai China
Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxida... 详细信息
来源: 评论
A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating po... 详细信息
来源: 评论
A Study of Effects of Coolants on Heat Transfer Capability of On-chip Cooling with CNT Micro-fin Architectures by Using CFD Simulation
A Study of Effects of Coolants on Heat Transfer Capability o...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Yi Fan Xiaolong Zhong Johan Liu Teng Wang Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden
The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and visco... 详细信息
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Research on the Models of OLED-On-Silicon Pixel Circuits
Research on the Models of OLED-On-Silicon Pixel Circuits
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Li-min Yan Hao Wang Key Laboratory of Advanced Display & System Applications Ministry of Education Shanghai University Microelectronic Research and Development Center Shanghai University Shanghai China
In modern information society, the display devices play an important role. Presently, Organic Light-Emitting Diode (OLED) has been emphasized and regarded as one of the best technology for its many advantages, such as... 详细信息
来源: 评论
Realization of Ultra Wideband Bandpass Filter based on LCP Substrate for Wireless Application
Realization of Ultra Wideband Bandpass Filter based on LCP S...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Xia Zhang Camilla Karnfelt Johan Liu Shiwei Ma Xu Wang Linqin Meng Herbert Zirath SMIT Center & Department of Microtechnology Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Department of Microtechnology and Nanoscience Chalmers University of Technology MC2 Microwave Electronics Laboratory Gothenburg Sweden School of Communication and Information Engineering Shanghai University China
Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF applications because of the unique combination of features and performance. Although LCP films offer many excellent properties, t... 详细信息
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Reducing the Power Consumption of the AES S-Box by SSC
Reducing the Power Consumption of the AES S-Box by SSC
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第三届IEEE无线通讯、网络技术暨移动计算国际会议
作者: Jinyi Zhang Qinghua Zuo Tianbao Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research & Development Center Shanghai University No.149 Yanchang Road Shanghai 200072 P.R.China
The advanced Encryption Standard (AES) algorithm has been accepted as the default choice in present security services. The S-Box as the key part in AES plays an important role for low-power design in the hardware impl... 详细信息
来源: 评论
Encapsulation of OLED device by Using Anisotropic Conductive Adhesive
Encapsulation of OLED device by Using Anisotropic Conductive...
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International Symposium on High Density Packaging and Microsystem Integration (HDP)
作者: Yan Zhang Mans Andreasson Hua Zhou Johan Liu Thorvald Andersson Jing-yu Fan Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China
Organic light emitting diodes (OLEDs) is one of the most potential display technologies in the flat panel display (FPD) field, and its applications include simple monochrome large-area lighting to full color, video-ca... 详细信息
来源: 评论