检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

103 篇 会议
34 篇 期刊文献

馆藏范围

137 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

61 篇 工学
- 30 篇 电子科学与技术（可...
- 23 篇 材料科学与工程（可...
- 13 篇 化学工程与技术
- 9 篇 光学工程
- 9 篇 动力工程及工程热...
- 6 篇 计算机科学与技术...
- 5 篇 电气工程
- 4 篇 控制科学与工程
- 4 篇 纺织科学与工程
- 4 篇 轻工技术与工程
- 3 篇 机械工程
- 3 篇 冶金工程
- 2 篇 力学（可授工学、理...
- 2 篇 仪器科学与技术
- 2 篇 建筑学
- 2 篇 软件工程
- 1 篇 信息与通信工程
- 1 篇 土木工程
- 1 篇 生物医学工程（可授...
- 1 篇 生物工程
33 篇 理学
- 24 篇 物理学
- 12 篇 化学
- 5 篇 数学
- 1 篇 大气科学
- 1 篇 统计学（可授理学、...
4 篇 管理学
- 4 篇 管理科学与工程(可...
1 篇 文学
- 1 篇 新闻传播学

主题

19 篇 thermal conducti...
15 篇 carbon nanotubes
14 篇 heat transfer
11 篇 conductive adhes...
11 篇 conducting mater...
9 篇 thermal resistan...
8 篇 packaging
8 篇 lead
8 篇 heat sinks
8 篇 materials
8 篇 electronic packa...
7 篇 conductivity
7 篇 thermal manageme...
7 篇 scanning electro...
7 篇 nanoparticles
6 篇 temperature
6 篇 environmentally ...
6 篇 microchannel
6 篇 laboratories
6 篇 bonding

机构

17 篇 shanghai institu...
12 篇 smit center & bi...
10 篇 key laboratory o...
8 篇 key laboratory o...
7 篇 key laboratory o...
6 篇 key laboratory o...
6 篇 key laboratory o...
6 篇 school of materi...
5 篇 microelectronic ...
5 篇 key laboratory o...
5 篇 key laboratory o...
5 篇 department of ap...
4 篇 microelectronic ...
4 篇 school of microe...
4 篇 smit center and ...
4 篇 shanghai enginee...
4 篇 key laboratory o...
4 篇 school of mechat...
3 篇 ministry of educ...
3 篇 shanghai collabo...

作者

61 篇 johan liu
31 篇 yan zhang
20 篇 zhaonian cheng
11 篇 jianhua zhang
10 篇 teng wang
10 篇 jing-yu fan
9 篇 lilei ye
8 篇 yifeng fu
8 篇 xiuzhen lu
7 篇 si chen
6 篇 huiwang cui
6 篇 zhili hu
6 篇 luqiao yin
6 篇 zhichao yuan
5 篇 ran feng
5 篇 cristina anderss...
5 篇 yulai gao
5 篇 xuyong yang
5 篇 xia zhang
5 篇 zhang jianhua

语言

132 篇 英文
5 篇 中文

检索条件"机构=Key Laboratory of Advanced Display and System Applications and SMIT Center"

共 137 条记录，以下是121-130 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Design of SSCMP with Arbiter and Shared Data Memory Interrupt

Design of SSCMP with Arbiter and Shared Data Memory Interrup...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yueli Hu Ying Liu Wenyi Jing Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

In the machine vision system, a common and effective way to solve high complexity and huge throughput of image processing arithmetic computation is to adopt instruction-level-parallel scheme through multiple MCUs with the single-threading architecture. Based on it, this paper proposed a kind of symmetric single-chip multiprocessor (SSCMP) architecture, which composed of four subprocessors and one solution for on-chip arbiter and shared data memory interrupt (SDMI). Each subprocessor could work in cooperant and also was completely independent mode. What's more, the proposed architecture set up a shared space for command transfering and data exchanging. An arbiter judgment scheme and effective interrupt access mechanism were introduced to reduce the burden of data exchange and eliminate competitions between the subprocessors.

关键词： Signal processing Hardware Machine vision Image processing Computer architecture Process control Costs Registers Microelectronics Laboratories

来源：评论

学校读者我要写书评

暂无评论

A Pipeline Sliding Window Max-Log-Map Turbo Decoder

A Pipeline Sliding Window Max-Log-Map Turbo Decoder

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ming Li Ming-ming Peng Jing-sai Jiang Fa-yu Wan Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

Turbo codes have become an attractive forward error correction scheme for wireless communication systems. MAP algorithm is the optimization algorithm for turbo-codes. But its implementation is complex. Max-Log-MAP algorithm is a sub-optimization algorithm of turbo-codes, which offers good compromise between performance and complexity for implementation. The authors present a re configurable turbo decoder based on Max-Log-MAP algorithm implemented with sliding window method and pipeline architecture. The sliding window (SW) method can reduce memory size. Pipeline decoding schemes can reduce decoding delay and improve throughput. The structure we proposed can reduce decoding delay obviously. It can be used in wireless communication.

关键词： Pipelines Turbo codes Iterative decoding Delay Wireless communication Throughput Microelectronics Laboratories displays Forward error correction

来源：评论

学校读者我要写书评

暂无评论

Design of On-Chip Debug Module Based on MCU

Design of On-Chip Debug Module Based on MCU

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yue-li Hu Ke-xin Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research and Development Center Shanghai China

A design method of embedded OCD (On-Chip Debugging) based on Intel 8051 MCU architecture is proposed. The OCD module named E-OCD-SFRB (Enhanced OCD module with SFR (Special Function Register) Breakpoint Function) is integrated into an existing MCU core, implementing several debugging function. The method we proposed is able to switch from running mode and debugging mode conveniently by controlling the debugging enable port and also enables controlling the MCU core in debugging mode by additional SFR. The function of SFR breakpoint is added, so we could trace the particular SFR, this is the reinforcement to the exiting OCD methods. The principles of E-OCD-SFR_B and detailed implemental method and simulation solution based on EDA platform are presented and validated. The simulation result indicates the completely observing and controlling to the core is achieved without any effect to original functions of the system.

关键词： Debugging Switches Clocks Ice system-on-a-chip Embedded system Emulation Monitoring Communication system control Registers

来源：评论

学校读者我要写书评

暂无评论

Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Preparation Techniques and Characterization for Sn-3.0Ag-0.5...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xinzhi Xia Changdong Zou Yulai Gao Johan Liu Qijie Zhai School of Materials Science and Engineering Shanghai University Shanghai China Key State Laboratory for New Display and System Applications and SMIT Center Shanghai University Shanghai China

Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning electron microscope (SEM) was employed to measure the morphology and size of these nanopowders. It was observed that the Sn-based nanopowders were almost spherical in shape. In addition, the results showed that nearly the total powders are smaller than 100 nm.

关键词： Nanoparticles Protection Scanning electron microscopy Microelectronics Packaging Environmentally friendly manufacturing techniques Lead Coolants Oxidation X-ray diffraction

来源：评论

学校读者我要写书评

暂无评论

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

A Study of CFD Simulation for On-chip Cooling with 2D CNT Mi...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xiaolong Zhong Yi Fan Johan Liu Yan Zhang Teng Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin array simulation results. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array, that is, 2D fin array can reduce the thermal resistance of the cooler although 2D fin array causes more pressure drop in the architecture than 1D fin array.

关键词： Computational fluid dynamics Cooling Microchannel Carbon nanotubes Thermal conductivity Heat transfer Solid modeling Two dimensional displays Chemical technology Educational technology

来源：评论

学校读者我要写书评

暂无评论

A Study of Effects of Coolants on Heat Transfer Capability of On-chip Cooling with CNT Micro-fin Architectures by Using CFD Simulation

A Study of Effects of Coolants on Heat Transfer Capability o...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yi Fan Xiaolong Zhong Johan Liu Teng Wang Yan Zhang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Goteborg Sweden Department of Applied Mechanics Chalmers University of Technology Goteborg Sweden

The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.

关键词： Coolants Heat transfer Cooling Computational fluid dynamics Computational modeling Thermal conductivity Viscosity Computer architecture Conducting materials Heat sinks

来源：评论

学校读者我要写书评

暂无评论

Research on the Models of OLED-On-Silicon Pixel Circuits

Research on the Models of OLED-On-Silicon Pixel Circuits

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Li-min Yan Hao Wang Key Laboratory of Advanced Display & System Applications Ministry of Education Shanghai University Microelectronic Research and Development Center Shanghai University Shanghai China

In modern information society, the display devices play an important role. Presently, Organic Light-Emitting Diode (OLED) has been emphasized and regarded as one of the best technology for its many advantages, such as active-matrix driver mode, high brightness, fast response time, high efficiency, wide visual angle, thin and light-weight etc. Much work of this paper has been done in AM-OLED technology, mainly focusing on the models of AM-OLED pixel circuit structure design and parameters assurance, AC-driving pixel circuit design and application. This research is prepared for integrated peripheral driving circuit design and application in the future.

关键词： Organic light emitting diodes Flat panel displays Thin film transistors Light emitting diodes Active matrix technology Brightness Threshold voltage Circuit synthesis Liquid crystal displays Active matrix organic light emitting diodes

来源：评论

学校读者我要写书评

暂无评论

Realization of Ultra Wideband Bandpass Filter based on LCP Substrate for Wireless Application

Realization of Ultra Wideband Bandpass Filter based on LCP S...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xia Zhang Camilla Karnfelt Johan Liu Shiwei Ma Xu Wang Linqin Meng Herbert Zirath SMIT Center & Department of Microtechnology Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Department of Microtechnology and Nanoscience Chalmers University of Technology MC2 Microwave Electronics Laboratory Gothenburg Sweden School of Communication and Information Engineering Shanghai University China

Liquid crystal polymer (LCP) materials are considered to be promising substrates for RF applications because of the unique combination of features and performance. Although LCP films offer many excellent properties, the poor adhesion between copper and LCP has prevented the use of these materials in flexible microwave circuits. In order to obtain better adhesion between LCP and copper, oxygen plasma pretreatment of the LCP substrate and a thin Ti adhesion layer are introduced before a Cu layer was sputtered on to the substrate. Finally, a novel and compact microstrip ultra wide band (UWB) band pass filter (BPF) is fabricated on LCP substrates using standard processing technology i.e. physical vapor deposition (PVD), lithography and wet etching, which provides LCP substrate the feasibility of the application in RF wireless systems.

关键词： Ultra wideband technology Band pass filters Adhesives Copper Crystalline materials Radio frequency Liquid crystal polymers Microwave circuits Flexible printed circuits Plasma applications

来源：评论

学校读者我要写书评

暂无评论

Reducing the Power Consumption of the AES S-Box by SSC

Reducing the Power Consumption of the AES S-Box by SSC

引用

第三届IEEE无线通讯、网络技术暨移动计算国际会议

作者： Jinyi Zhang Qinghua Zuo Tianbao Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research & Development Center Shanghai University No.149 Yanchang Road Shanghai 200072 P.R.China

The advanced Encryption Standard (AES) algorithm has been accepted as the default choice in present security services. The S-Box as the key part in AES plays an important role for low-power design in the hardware implementation of the algorithm. About 75％ power consumption of an AES core is caused by the S-Box, so reducing the power of the S-Box is very efficient for the low-power design of the AES core. In this paper, the bus coding technique called Sequence-Switch Coding (SSC) is applied in the S-Box design. Input data are encoded in a certain sequence to reduce the transitions of the S-Box circuits. As a result, the power consumption in the combinational logic is brought down. The verification results show that about 10％ power has been reduced averagely in the experimental S-Box.

关键词： S-Box sequence-switch coding (SSC) AES

来源：评论

学校读者我要写书评

暂无评论

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Encapsulation of OLED device by Using Anisotropic Conductive...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yan Zhang Mans Andreasson Hua Zhou Johan Liu Thorvald Andersson Jing-yu Fan Department of Applied Mechanics Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University China Applied seminconductor Physics Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China

Organic light emitting diodes (OLEDs) is one of the most potential display technologies in the flat panel display (FPD) field, and its applications include simple monochrome large-area lighting to full color, video-capable graphics displays and so on. As organic materials are susceptible to humidity and oxygen, encapsulation is a key issue for OLED device reliability. In the present paper, two kinds of OLED samples have been studied; one encapsulated by adhesive matrix with fillers, and one without encapsulation. Variation of the electrical parameters of the OLED samples with respect to exposure time has been measured. The primary experiment investigation was carried out for the OLED sample sealed with an anisotropic conductive adhesive. Encapsulation material analysis, such as choices of different fillers/absorbent in the adhesive matrix, optimization of polymer matrix etc., will be conducted in future work.

关键词： Encapsulation Organic light emitting diodes Anisotropic magnetoresistance Conductive adhesives Flat panel displays LED lamps Graphics Organic materials Humidity Materials reliability

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共14页 << < 5 6 7 8 9 10 11 12 13 14 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：